EP0771638A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Mold cleaning mechanism for resin sealing/molding apparatus
Assignee: Towa Corp
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Filing: 1996-10-29
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Granted: —
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Expires: 2016-10-29
Abstract
Abstract In a resin sealing/molding apparatus for electronic parts, a cleaning UV application mechanism (17) for removing mold surface contaminants adhering to/accumulating on mold surfaces (16) is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames (3) and resin tablets (6) to each resin sealing/molding part (8) and an operation for taking out sealed lead frames (9) and a position close to the mold surfaces (16) in each resin sealing/molding part (8). According to this structure, the mold surface contaminants, such as a mold release agent contained in a resin material or volatile gas generated by heating, adhering to/accumulating on the mold surfaces (16) of each resin sealing/molding part (8) are efficiently and reliably removed.
Inventors
- 👤 Michio Osada
- 👤 Keiji Maeda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 09:09
CPC Classifications
B; B29; B29C; B29C33/00; B29C33/70; B29C33/72; B08; B08B; B08B7/00; B08B7/0035; B08B7/0057; B29L; B29L2031/00; B29L2031/34; B29L2031/3425
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
145 words
A resin sealing/molding apparatus for electronic parts being formed by a body of said resin sealing/molding apparatus for electronic parts comprising a resin sealing/molding part (8) for sealing/molding electronic parts such as semiconductor chips with a resin material and a connector consisting of a resin sealing/molding apparatus comprising at least a resin sealing/molding part being detachably mounted on said body, said resin sealing/molding apparatus for electronic parts comprising: a UV application mechanism (17) for cleaning a mold surface of a mold (20, 21) in each said resin sealing/molding part (8), said cleaning UV application mechanism (17) being mounted to be freely reciprocative between a retracted position not inhibiting a material supply operation to and a molding extracting operation from each said resin sealing/molding part (8) and a position close to said mold surface of said mold (20, 21) in each said resin sealing/molding part (8).
Claim 2
Dependent Claim
65 words
The resin sealing/molding apparatus for electronic parts in accordance with claim 1, wherein each said resin sealing/molding part (8) is provided with a suction discharge mechanism (18) for mold surface contaminants (32) for catching said mold surface contaminants (32) being separated/scattered from said mold surface of said mold in said resin sealing/molding part (8) while forcibly suction-discharging said mold surface contaminants (32) to the exterior.
Claim 3
Dependent Claim
65 words
The resin sealing/molding apparatus for electronic parts in accordance with claim 2, wherein said suction discharge mechanism (18) includes an air inlet hole (29) provided through said mold (20, 21) on outer peripheral portions of the sealing/molding part (8), a vacuum source arranged outside of said mold (20, 21), and an inlet passage (30) communicationally connecting said air inlet hole (29) with said vacuum source.
Claim 4
Dependent Claim
65 words
The resin sealing/molding apparatus for electronic parts in accordance with claim 1, wherein said cleaning UV application mechanism (17) is provided with a suction discharge mechanism (18a) for mold surface contaminants (32) for catching said mold surface contaminants (32) being separated/scattered from said mold surface of said mold in said resin sealing/molding part (8) while forcibly suction-discharging said mold surface contaminants (32) to the exterior.
Claim 5
Dependent Claim
83 words
The resin sealing/molding apparatus for electronic parts in accordance with claim 4, wherein said cleaning UV application mechanism (17) has a body (17a) and a UV application lamp (17a), and said suction discharge mechanism (18a) includes an air inlet hole (29a) provided through said body (17a) on the outer peripheral portions of said UV application lamps (17a), a vacuum source arranged outside of said mold (20, 21), and an inlet passage (30a) communicationally connecting said air inlet hole (29a) with said vacuum source.
Claim 6
Dependent Claim
73 words
The resin sealing/molding apparatus for electronic parts in accordance with claim 1, wherein each of said resin sealing/molding part (8) and said cleaning UV application mechanism (17) is provided with a suction discharge mechanism (18a) for mold surface contaminants (32) for catching said mold surface contaminants (32) being separated/scattered from said mold surface of said mold in said resin sealing/molding part (8) while forcibly suction-discharging said mold surface contaminants (32) to the exterior.
Claim 7
Dependent Claim
111 words
The resin sealing/molding apparatus for electronic parts in accordance with claim 6, wherein said clearing UV application mechanism (17) has a body (17a) and UV application lamp (17a), and said suction discharge mechanism (18a) includes an air inlet hole (29) provided through said mold (20, 21) on an outer peripheral portion of said sealing/molding part (8), another air inlet hole (29a) provided through said body (17a) on an outer peripheral portion of said UV application lamps (17b), a vacuum source arranged outside of said mold (20, 21), and an inlet passage (30, 30a) communicationally connecting said air inlet hole (29) and said another air inlet hole (29a) with said vacuum source.
Claim 8
Dependent Claim
39 words
The resin sealing/molding apparatus for electronic parts in accordance with claim 7, wherein said another air inlet hole (29a) is provided through said body (17a) in a position substantially corresponding to the position of said air inlet hole (29).
References Cited (Backward Citations)
No citation records indexed.
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