EP0768148A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Apparatus for and method of polishing workpiece
Assignee: Ebara Corp
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Filing: 1996-10-09
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Granted: —
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Expires: 2016-10-09
Abstract
Abstract A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. A guide ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
Inventors
- 👤 Norio Kimura
- 👤 Hozumi Yasuda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 01:42
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/27; B24B37/30; H; H10; H10P; H10P52/00; B24B37/32
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
86 words
An apparatus for polishing a workpiece, comprising: a turntable with an abrasive cloth mounted on an upper surface thereof; a top ring for holding a workpiece and pressing the workpiece against said abrasive cloth under a first pressing force to polish the workpiece; a guide ring for retaining said workpiece under said top ring, said guide ring being vertically movably disposed around said top ring; and a pressing device for pressing said guide ring against said abrasive cloth under a second pressing force which is variable.
Claim 2
Dependent Claim
22 words
An apparatus according to claim 1, wherein said first pressing force and said second pressing force are variable independently of each other.
Claim 3
Dependent Claim
19 words
An apparatus according to claim 1, wherein said second pressing force is determined based on said first pressing force.
Claim 4
Dependent Claim
41 words
An apparatus according to claim 3, wherein said second pressing force is substantially equal to said first pressing force to remove the same thickness of material from a peripheral portion of the workpiece as from an inner region of the workpiece.
Claim 5
Dependent Claim
122 words
An apparatus according to claim 3, wherein said second pressing force is smaller than said first pressing force to remove a greater thickness of material from a peripheral portion of the workpiece than from an inner region of the workpiece, wherein preferably said second pressing force is greater than said first pressing force to remove a smaller thickness of material from a peripheral portion of the workpiece than from an inner region of the workpiece, wherein preferably said pressing device comprises a fluid pressure cylinder, wherein preferably said top ring is supported by a top ring head, and said fluid pressure cylinder is fixed to said top ring head, and wherein preferably said fluid pressure cylinder is fixed to said top ring.
Claim 6
Independent Claim
102 words
An apparatus for polishing a workpiece, comprising: a turntable with an abrasive cloth mounted on an upper surface thereof; a top ring for holding a workpiece and pressing the workpiece against said abrasive cloth under a first pressing force to polish the workpiece; a guide ring for retaining said workpiece under said top ring, said guide ring being vertically movably disposed around said top ring; and a pressing device for pressing said guide ring against said abrasive cloth under a second pressing force which is variable; wherein said first pressing force and said second pressing force are variable independently of each other.
Claim 7
Independent Claim
96 words
A method of polishing a workpiece, comprising the steps of: holding a workpiece between an abrasive cloth mounted on an upper surface of a turntable and a lower surface of a top ring disposed above said turntable; pressing the workpiece against said abrasive cloth under a first pressing force to polish the workpiece; and pressing a guide ring vertically movably disposed around said top ring against said abrasive cloth around the workpiece under a second pressing force which is determined based on said first pressing force, said guide ring retaining the workpiece under said top ring.
Claim 8
Dependent Claim
129 words
A method according to claim 7, wherein said first pressing force and said second pressing force are variable independently of each other, wherein preferably said second pressing force is substantially equal to said first pressing force to remove the same thickness of material from a peripheral portion of the workpiece as from an inner region of the workpiece, wherein preferably said second pressing force is smaller than said first pressing force to remove a greater thickness of material from a peripheral portion of the workpiece than from an inner region of the workpiece, and wherein preferably said second pressing force is greater than said first pressing force to remove a smaller thickness of material from a peripheral portion of the workpiece than from an inner region of the workpiece.
Claim 9
Independent Claim
100 words
A method of fabricating a semiconductor device, comprising the steps of: holding a semiconductor wafer between an abrasive cloth mounted on an upper surface of a turntable and a lower surface of a top ring disposed above said turntable; pressing the semiconductor wafer against said abrasive cloth under a first pressing force to polish the semiconductor wafer; and pressing a guide ring vertically movably disposed around said top ring against said abrasive cloth around the workpiece under a second pressing force which is determined based on said first pressing force, said guide ring retaining the workpiece under said top ring.
Claim 10
Independent Claim
33 words
An apparatus for polishing a workpiece, comprising: a turntable with an abrasive mounted on surface thereof; a ring for holding a workpiece; a ring for retaining said workpiece under said ring for holding.
References Cited (Backward Citations)
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