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EP0751546A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Micro electromechanical RF switch

Assignee: Boeing North American Inc
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Filing: 1996-05-21
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Granted: —
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Expires: 2016-05-21
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Abstract

Abstract A micro electromechanical RF switch is fabricated on a substrate (12) using a suspended microbeam as a cantilevered actuator arm (20). From an anchor structure (14), the cantilever arm (20) extends over a ground line (16) and a gapped signal line (18) that comprise microstrips on the substrate. A metal contact (22) formed on the bottom of the cantilever arm remote from the anchor is positioned facing the signal line gap. An electrode (24) atop the cantilever arm forms a capacitor structure above the ground line. The capacitor structure may include a grid of holes extending through the top electrode and cantilever arm to reduce structural mass and the squeeze damping effect during switch actuation. The switch is actuated by application of a voltage on the top electrode (24), which causes electrostatic forces to attract the capacitor structure toward the ground line (16) so that the metal contact closes the gap in the signal line (18). The switch functions from DC to at least 4 GHz with an electrical isolation of -50 dB and an insertion loss of 0.1 dB at 4 GHz. A low temperature fabrication process allows the switch to be monolithically integrated with microwave and millimeter wave integrated circuits (MMICs). The RF switch has applications in telecommunications, including signal routing for microwave and millimeter wave IC designs, MEMS impedance matching networks, and band-switched tunable filters for frequency-agile communications.

Inventors

  • 👤 Jason Yao Jun

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-06 14:05
CPC Classifications
H; H01; H01H; H01H59/00; H01H59/0009; H01H1/00; H01H1/12; H01H1/14; H01H1/20

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 142 words
A micro electromechanical switch 10 formed on a substrate 12, comprising: an anchor structure 14, a bottom electrode 16, and a signal line 18 formed on the substrate 12; said signal line 18 having a gap 19 forming an open circuit; a cantilever arm 20 attached to said anchor structure 14 and extending over said bottom electrode 16 and said signal line gap 19; a contact 22 formed on said cantilever arm 20 remote from said anchor structure 14 and positioned facing said gap 19 in said signal line 18; a top electrode 24 formed atop said cantilever arm 20; and a portion of said cantilever arm 20 and said top electrode 24 positioned above said bottom electrode 16 forming a capacitor structure 26 electrostatically attractable toward said bottom electrode 16 upon selective application of a voltage on said top electrode 24.
Claim 2
Dependent Claim 41 words
The micro electromechanical switch 10 of Claim 1, wherein said electrostatic attraction of said capacitor structure 26 toward said bottom electrode 16 causes said contact 22 on said cantilever arm 20 to close said gap 19 in said signal line 18.
Claim 3
Dependent Claim 17 words
The micro electromechanical switch 10 of Claim 1, wherein said substrate 12 comprises a semi-insulating GaAs substrate.
Claim 4
Dependent Claim 16 words
The micro electromechanical switch 10 of Claim 1, wherein said cantilever arm 20 comprises insulating material.
Claim 5
Dependent Claim 16 words
The micro electromechanical switch 10 of Claim 1, wherein said cantilever arm 20 comprises silicon dioxide.
Claim 6
Dependent Claim 56 words
The micro electromechanical switch 10 of Claim 1, wherein said capacitor structure 26 further comprises a grid of holes 28 extending through said cantilever arm 20 and top electrode 24, said holes 28 reducing the structural mass of said cantilever arm 20 and the squeeze film damping effect of air during actuation of the switch 10.
Claim 7
Dependent Claim 24 words
The micro electromechanical switch 10 of Claim 1, wherein said bottom electrode 16 and signal line 18 comprise gold microstrips on the substrate 12.
Claim 8
Dependent Claim 26 words
The micro electromechanical switch 10 of Claim 1, wherein said contact 22 comprises a metal selected form the group consisting of gold, platinum, and gold palladium.
Claim 9
Dependent Claim 22 words
The micro electromechanical switch 10 of Claim 1, wherein said cantilever arm 20 has a thickness in the range of 1-10 µm.
Claim 10
Dependent Claim 30 words
The micro electromechanical switch 10 of Claim 1, wherein said cantilever arm 20 has a length from anchor structure 14 to capacitor structure 26 in the range of 10-1000 µm.

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