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EP0745656A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Abrasive particles, method for producing the same, and use of the same

Assignee: Sumitomo Chemical Co Ltd
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Filing: 1996-05-22
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Granted: —
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Expires: 2016-05-22
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Abstract

Abstract Abrasive particles having an average particle size of not more than 2 µm and comprising 100 parts by weight of aluminum oxide and/or silicon oxide and 5 to 25 parts by weight of cerium in the form of cerium oxide may be used for planarizing an insulating film on a semiconductor substrate.

Inventors

  • 👤 Kazumasa Ueda
  • 👤 Yoshiaki Takeuchi

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 14:05
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/01; C04B35/10; C04B35/111; C04B35/1115; C09; C09K; C09K3/00; C09K3/14; C09K3/1409; C09K3/1418; C09K3/1436; C09K3/1454; C09K3/1463

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 64 words
Abrasive particles which have an average particle size of 2 µm or less, each of which comprises (a) at least one oxide selected from aluminum oxide and silicon oxide and (b) cerium in the form of cerium oxide, the amount of cerium in each particle being from 5 to 25 parts by weight per 100 parts by weight of aluminum oxide and silicon oxide.
Claim 2
Dependent Claim 21 words
Abrasive particles according to claim 1, which have a BET specific surface area of from 40 to 150 m 2 /g.
Claim 3
Dependent Claim 15 words
Abrasive particles according to claim 1 or 2, wherein the oxide (a) is transition alumina.
Claim 4
Dependent Claim 23 words
Abrasive particles according to any one of claims 1 to 3, wherein the content of Na and K is 50 ppm or less.
Claim 5
Independent Claim 214 words
A method for producing abrasive particles, which comprises suspending in a solvent at least one compound selected from aluminum oxide having an average particle size of 2 µm or less in an amount of 100 parts by weight, silicon oxide having an average particle size of 2 µm or less in an amount of 100 parts by weight, and a precursor of aluminum or silicon oxide which is able to be converted by calcining to aluminum oxide or silicon oxide having an average particle size of 2 µm or less in an amount of 100 parts by weight, to form a suspension; mixing into the suspension a cerium compound in an amount of 5 to 25 parts by weight in terms of cerium, wherein the cerium compound is able to be converted to cerium oxide by calcining, to form a mixture; drying the mixture; and calcining the dried mixture to obtain abrasive particles having an average particle size of 2 µm or less, each of which comprises (a) at least one oxide selected from aluminum oxide and silicon oxide and (b) cerium in the form of cerium oxide, the amount of cerium in each particle being from 5 to 25 parts by weight per 100 parts by weight of aluminum oxide and silicon oxide.
Claim 6
Dependent Claim 36 words
A method according to claim 5, wherein the cerium compound is at least one compound selected from cerium nitrate, cerium acetate, cerium sulfate, cerium chloride, cerium oxalate, cerium carbonate, ammonium cerium sulfate and ammonium cerium nitrate.
Claim 7
Dependent Claim 20 words
A method according to claim 5 or 6, wherein aluminum oxide is obtained by hydrolysis of an organic aluminum compound.
Claim 8
Dependent Claim 25 words
A method according to claim 5 or 6, wherein the precursor of aluminum oxide is aluminum hydroxide obtained by hydrolysis of an organic aluminum compound.
Claim 9
Dependent Claim 17 words
A method according to claim 7 or 8, wherein the organic aluminum compound is an aluminum alkoxide.
Claim 10
Independent Claim 27 words
A method according to any one of claims 5 to 9, wherein the drying step is carried out using a flash drier or a pneumatic conveying drier.
Claim 11
Dependent Claim 74 words
Use of abrasive particles having an average particle size of 2 µm or less, each of which comprises (a) at least one oxide selected from aluminum oxide and silicon oxide and (b) cerium in the form of cerium oxide, the amount of cerium in each particle being from 5 to 25 parts by weight per 100 parts by weight of aluminum oxide and silicon oxide, for planarizing an insulating film on a semiconductor substrate.

References Cited (Backward Citations)

DE1519396A1 Cited
DE2737358A1 Cited
US5114437A Cited
JPH059463A Cited
WO1993022103A1 Cited
WO1994007970A1 Cited

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