EP0729182A2
Expired / Lapsed
EP
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Chip carrier and method of manufacturing and mounting the same
Assignee: Panasonic Holdings Corp
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Filing: 1996-02-20
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Granted: —
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Expires: 2016-02-20
Abstract
Abstract In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer (5) is formed between an external connecting electrode (4) of a chip carrier (1) and a circuit wiring board (8). Consequently, the external connecting electrode (4) can be prevented from cracking due to a difference between the coefficients of thermal expansion of the external connecting electrode (4) and the circuit wiring board (8). Thus, the reliability in a thermal shock test can be enhanced. A connecting wiring (21) which is conducted to an electrode (31) of a semiconductor device (3) is provided on a surface (20a) of an electrical insulating board (20), and the external connecting electrode (4) for connection to a connecting electrode (85) of the circuit wiring board (8) is provided on a back face (20b) of the electrical insulating board (20). The external connecting electrode (4) has a solder ball (2) made of a conductor, and the resin layer (5) formed on the side portion thereof.
Inventors
- 👤 Yoshifumi Nakamura
- 👤 Yoshihiro Bessho
- 👤 Minehiro Itagaki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 08:19
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W90/701; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/04; H05K2203/043; H05K2203/11; H05K2203/1105; H05K3/22; H05K3/28; H05K3/284; H05K3/3465; H05K3/3485; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/07254; H10W72/20; H10W72/241; H10W72/244; H10W72/247; H10W72/251; H10W72/252; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
87 words
A chip carrier comprising: an electrical insulating board; a connecting wiring for connection to the electrode of a semiconductor device which is provided on a first face of the electrical insulating board; and an external connecting electrode for connection to a connecting electrode of a circuit wiring board, provided on the back face of the electrical insulating board, wherein the external connecting electrode is formed by a bump made of a conductor, and a resin layer is formed so as to cover the side of the bump.
Claim 2
Dependent Claim
27 words
The chip carrier according to claim 1, wherein the resin layer is formed almost flatly around the bump and the tip portion of the bump is exposed.
Claim 3
Dependent Claim
28 words
The chip carrier according to claim 1, wherein the resin layer is formed like a convexity around the bump and the tip portion of the bump is exposed.
Claim 4
Dependent Claim
34 words
The chip carrier according to claim 1, wherein the resin layer is formed like a layer on the back face of the electrical insulating board and the tip portion of the bump is exposed.
Claim 5
Dependent Claim
14 words
The chip carrier according to claim 1, wherein the bump comprises a solder ball.
Claim 6
Dependent Claim
29 words
The chip carrier according to claim 1, wherein the bump is made of a conductor whose main component contains at least one of Sn, Cu, Ag, Au and Ni.
Claim 7
Dependent Claim
34 words
The chip carrier according to Claim 1, wherein the bump is covered with the resin layer to a level of 20 % or more with respect to the height thereof from the chip carrier.
Claim 8
Dependent Claim
14 words
The chip carrier according to claim 1, wherein the resin is an epoxy resin.
Claim 9
Dependent Claim
21 words
The chip carrier according to claim 1, wherein the thickness of the resin layer ranges from 50 µm to 1000 µm.
Claim 10
Independent Claim
93 words
A method of manufacturing a chip carrier, comprising the steps of: providing a connecting wiring for connection to the electrode of a semiconductor device on a first face of an electrical insulating board; forming an external connecting electrode having a bump for connection to the connecting electrode of a circuit wiring board on a back face of the electrical insulating board; covering the side portion of the external connecting electrode with a resin paste; and heat-treating at a temperature at which the resin paste is hardened so that a resin layer is formed.
Claim 11
Dependent Claim
38 words
The method according to claim 10, wherein the resin paste is poured between the external connecting electrodes, and heat-treatment is performed at a temperature at which the resin paste is hardened so that the resin layer is formed.
Claim 12
Dependent Claim
34 words
The method according to claim 10, wherein heat is supplied and the resin is poured into the back face on which the external connecting electrodes are provided so as to form the resin layer.
Claim 13
Dependent Claim
77 words
The method according to claim 10, wherein the back face on which the external connecting electrode made of the bump is formed is immersed in the resin paste, the chip carrier is removed from the resin paste, the bump is covered with the resin, the resin layer is formed by heat-treatment at a temperature at which the resin is hardened, and the bump is caused to appear on a face on which the resin layer is formed.
Claim 14
Dependent Claim
60 words
The method according to claim 10, wherein the resin is sprayed on the back face on which the external connecting electrodes are provided, the resin layer is formed so as to cover the back face on which the external connecting electrodes are provided, and the bump is caused to appear on the face on which the resin layer is formed.
Claim 15
Dependent Claim
19 words
The method according to claim 13 or 14, wherein the method for causing the bump to appear is grinding.
Claim 16
Dependent Claim
65 words
The method according to claim 10, wherein a surface of a conductive foil is exposed and coated with the resin paste by screen printing, heat-treatment is performed at a temperature at which the resin layer is hardened, the conductive foil is coated with the solder paste, and heat-treatment is performed at a temperature at which the solder paste is melted to form a solder bump.
Claim 17
Dependent Claim
18 words
The method according to claim 10, wherein the resin paste has a viscosity of 500 to 200000 cps.
Claim 18
Independent Claim
107 words
A method of manufacturing a chip carrier comprising the steps of: providing a connecting wiring for connection to the electrode of a semiconductor device on a first face of an electrical insulating board; forming an external connecting electrode for connection to the connecting electrode of a circuit wiring board on a back face of the electrical insulating board; and bonding, to the back face of the electrical insulating board, a sheet made of a resin having through holes in corresponding positions to the external connecting electrodes in such a manner that the external connecting electrodes correspond to the through holes, so that a resin layer is formed.
Claim 19
Dependent Claim
23 words
The method according to claim 18, wherein an adhesive resin layer is provided on the surface of the sheet made of a resin.
Claim 20
Dependent Claim
51 words
The method according to claim 18, wherein the surface of the sheet made of a resin is provided on the back face of the electrical insulating board, and the resin sheet is melted at a suitable temperature and bonded to the electrical insulating board so that the resin layer is formed.
Claim 21
Dependent Claim
27 words
The method according to claim 18, wherein a bump for connection to the external connecting electrode is provided on the back face of the electrical insulating board.
Claim 22
Independent Claim
129 words
A method of mounting a chip carrier on a circuit wiring board, the chip carrier having a back face on which a resin layer is provided and an external connecting electrode that extends through the resin layer so that an external connecting electrode portion is exposed, the method comprising the steps of: forming a solder paste layer on a connecting electrode of the circuit wiring board; mounting the chip carrier on the circuit wiring board in such a manner that the external connecting electrode of the chip is connected to a solder paste on the connecting electrode of the circuit wiring board; melting the solder paste at a suitable temperature; and bonding the resin layer formed on the back face of the chip carrier to the circuit wiring board.
Claim 23
Dependent Claim
29 words
The method according to claim 22, wherein the resin layer is bonded to the circuit wiring board by a bonding layer provided on the surface of the resin layer.
Claim 24
Dependent Claim
30 words
The method according to claim 22, wherein the the resin layer is melted when melting the solder paste, so that the chip carrier is bonded to the circuit wiring board.
Claim 25
Dependent Claim
32 words
The method according to claim 22, wherein the thickness of the resin layer is substantially equal to or less than that of a solder paste layer formed on the circuit wiring board.
Claim 26
Dependent Claim
29 words
The method according to claim 22, wherein the softening point of the resin layer is not less than 150°C and is not more than the solder paste melting temperature.
References Cited (Backward Citations)
EP0717442A1
Cited
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