EP0725434A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Microchip module assemblies
Assignee: Intarsia Corp
•
Filing: 1996-01-23
•
Granted: —
•
Expires: 2016-01-23
Abstract
Abstract Low profile microchip module assemblies are formed by first mounting one or more active semiconductor integrated circuit chips on a multilayer metallisation and dielectric structure on a substrate of, say, silicon or alumina, by wire bonding or flip-chip solder bonding, and then inverting the substrate and mounting it on a printed circuit board by means of solder bump connections. The solder bump connections are sufficiently high for the chips to be held clear of the printed circuit board.
Inventors
- 👤 David Pedder
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 11:34
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/36; H05K3/368; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
68 words
A module on board structure in which a microchip module assembly, comprising a microchip module substrate and at least one active semiconductor device mounted on said substrate, is mounted on and connected directly to electrical conductors formed on a surface of a fine line printed circuit board by means of an array of solder bump connections, with said active device between said microchip module substrate and said surface.
Claim 2
Dependent Claim
59 words
A module on board structure in accordance with Claim 1 wherein said active device is mounted on said substrate by flip-chip solder bonding, and spaces left between said device and said substrate after solder bonding are arranged to be substantially filled with a polymer material having a coefficient of thermal expansion substantially matched to that of the solder bonding.
Claim 3
Dependent Claim
45 words
A module on board structure in accordance with Claim 1 or Claim 2 wherein the solder bumps are of diameters between 100 and 500 micrometres and the final spacing between the substrate and the surface of the printed circuit board is up to 400 micrometres.
Claim 4
Dependent Claim
38 words
A method of making a structure in accordance with Claim 2 wherein solderable metallisation and solder layers for the flip chip bonding and for the solder bump connections are applied to the substrate in the same process steps.
Claim 5
Dependent Claim
58 words
A method of making a structure in accordance with Claim 1 wherein solder bumps are defined on connection lands of the printed circuit board by solder plating a larger area than that of each land and then melting the solder plating such that reflow by surface tension increases the height of the solder layer over each respective land.
Claim 6
Dependent Claim
26 words
A method of making a structure in accordance with Claim 1 wherein discrete solder bodies are utilised to add solder volume to the solder bump connections.
Claim 7
Dependent Claim
15 words
A module on board structure substantially as hereinbefore described with reference to the accompanying drawing.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.