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EP0721205A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method of etching an oxide layer with simultaneous deposition of a polymer layer

Assignee: Cypress Semiconductor Corp
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Filing: 1995-10-25
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Granted: —
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Expires: 2015-10-25
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Abstract

Abstract A method of etching an oxide layer is disclosed. First, a resist layer is formed on an oxide layer on a substrate. Next, a photosensitive layer is formed on the oxide layer and patterned to expose regions of the oxide layer to be removed. The exposed regions may overlie a nitride layer, and may overlie a structure such as a polysilicon gate. The etch is performed such that polymer deposits on the photosensitive layer, thus eliminating interactions between the photosensitive layer and the plasma. In this way, a simple etch process allows for good control of the etch, resulting in reduced aspect ratio dependent etch effects, high oxide:nitride selectivity, and good wall angle profile control.

Inventors

  • 👤 James E. Nulty

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-07 11:13
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/20; H10P50/28; H10P50/282; H10P50/283; H10P50/73; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/069; H10W20/071; H10W20/081

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 65 words
A method of etching an oxide layer comprising: providing a substrate having said oxide layer thereon: forming a photosensitive layer on said oxide layer; forming a first opening in said photosensitive layer to expose a portion of said oxide layer; exposing said substrate to a plasma, said plasma etching said exposed portion of said oxide layer and forming a first layer on said photosensitive layer.
Claim 2
Dependent Claim 14 words
The method as described in claim 1 wherein said first layer comprises a polymer.
Claim 3
Dependent Claim 18 words
The method as described in claim 1 wherein said plasma is formed in a flow comprising Freon 134a.
Claim 4
Dependent Claim 15 words
The method as described in claim 3 wherein said flow further comprises CHF 3 .
Claim 5
Dependent Claim 25 words
The method as described in claim 1 wherein said plasma is formed using an RF power in the range of approximately 300 - 400 W.
Claim 6
Dependent Claim 27 words
The method as described in claim 1 wherein said plasma is formed between two electrodes having a spacing in the range of approximately 1.3 - 1.8 inches.
Claim 7
Dependent Claim 27 words
The method as described in claim 3 wherein said plasma is formed between two electrodes having a spacing in the range of approximately 1.3 - 1.8 inches.
Claim 8
Dependent Claim 18 words
The method as described in claim 1 wherein said oxide layer opening exposes a corner of a structure.
Claim 9
Dependent Claim 18 words
The method as described in claim 3 wherein said oxide layer opening exposes a corner of a structure.
Claim 10
Dependent Claim 18 words
The method as described in claim 6 wherein said oxide layer opening exposes a corner of a structure.
Claim 11
Dependent Claim 25 words
The method as described in claim 8 wherein said substrate comprises a nitride layer underlying said oxide layer, said nitride layer disposed on said corner.
Claim 12
Dependent Claim 51 words
The method as described in claim 1 wherein said photosensitive layer is the uppermost layer on said substrate prior to said formation of said first layer, and wherein at least a portion of said photosensitive layer having said first layer formed thereon is substantially parallel to a surface of said substrate.
Claim 13
Dependent Claim 51 words
The method as described in claim 3 wherein said photosensitive layer is the uppermost layer on said substrate prior to said formation of said first layer, and wherein at least a portion of said photosensitive layer having said first layer formed thereon is substantially parallel to a surface of said substrate.
Claim 14
Dependent Claim 51 words
The method as described in claim 6 wherein said photosensitive layer is the uppermost layer on said substrate prior to said formation of said first layer, and wherein at least a portion of said photosensitive layer having said first layer formed thereon is substantially parallel to a surface of said substrate.

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