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EP0717418A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Composition containing a polymer and conductive filler and use thereof

Assignee: International Business Machines Corp
•
Filing: 1995-11-27
•
Granted: —
•
Expires: 2015-11-27
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Abstract

Abstract A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.

Inventors

  • 👤 Marie Angelopoulos
  • 👤 Vlasta A. Brusic
  • 👤 Teresita Ordonez Graham
  • 👤 Sampath Purushothaman
  • 👤 Judith Marie Roldan
  • 👤 Ravi F. Saraf
  • 👤 Jane Margaret Shaw
  • 👤 Alfred Viehbeck

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-27 04:19
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0073; H05K9/0081; H05K9/0083; C; C08; C08G; C08G61/00; C08G61/12; C08L; C08L65/00; C09; C09D; C09D5/00; C09D5/08; C09D5/24; C09J; C09J9/00; C09J9/02; H01; H01B; H01B1/00; H01B1/06; H01B1/12; H01B1/124; H01B1/125; H01B1/127; H01B1/128; H01B1/20; H01B1/22; H01B1/24; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K9/0079; H05K9/0088; C08L33/00; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0329; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/25; Y10T428/31504; Y10T428/31511; Y10T428/31529; Y10T428/31533; Y10T428/31551; Y10T428/31605; Y10T428/31652; Y10T428/31663; Y10T428/31678; Y10T428/31681; Y10T428/31692; Y10T428/31721; Y10T428/31725; Y10T428/31855

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 80 words
A composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, wherein said filler component comprises at least one conducting polymer selected from the group consisting of substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polyanilines, substituted and unsubstituted polyazines, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted polyacetylenes and mixtures thereof; and copolymers thereof; and conductive particles.
Claim 2
Dependent Claim 27 words
The composition of claim 1 wherein the amount of said conducting polymer is about 0.3 to about 90% by weight of the total of said polymeric matrix.
Claim 3
Dependent Claim 33 words
The composition of claims 1 to 2 wherein the amount of conductive particles is about 40 to about 95% by weight based upon the total of said conducting polymer and said polymeric matrix.
Claim 4
Dependent Claim 36 words
The composition of any of the preceding claims 1 to 3 wherein said polymeric matrix comprises at least one polymer selected from the group consisting of polyepoxides, polyacrylates, polysiloxanes and polyimides, polymethacrylates, polyurethanes, polyolefins, and polyamides.
Claim 5
Dependent Claim 18 words
The composition of any of the preceding claims 1 to 4 wherein said particles are silver or copper.
Claim 6
Dependent Claim 21 words
The composition of any of the preceding claims 1 to 4 wherein said conductive particles are precoated with said conducting polymer.
Claim 7
Dependent Claim 22 words
The composition of any of the preceding claims 1 to 6 wherein said polymer is a polyaniline, comprising an alkoxy substituted polyaniline.
Claim 8
Dependent Claim 21 words
The composition of any of the preceding claims 1 to 7, wherein said composition is in the form of a paste.
Claim 9
Dependent Claim 23 words
The composition of any of the preceding claims 1 to 8 wherein said conducting polymer has conductivity of about 10⁻¹⁰ohm⁻¹cm⁻¹ to about 10⁶ohm⁻¹cm⁻¹.
Claim 10
Dependent Claim 55 words
A composite comprising a metal substrate, wherein said metal comprises copper or silver and as a corrosion protecting layer on at least one major surface of said substrate, a composition according to any one of the preceding claims 1 to 9, or a layer of a polyaniline, comprising an alkoxy polyaniline or an ethoxy polyaniline.
Claim 11
Independent Claim 24 words
A method for providing electrostatic discharge protection or electromagnetic interference shielding by applying the composition of any of the preceding claims 1 to 9.

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