Patent US2290051A successfully refreshed from Google Patents.
EP0712159A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Structure of resin molded type semiconductor
Assignee: Oki Electric Industry Co Ltd
•
Filing: 1995-10-27
•
Granted: —
•
Expires: 2015-10-27
Abstract
Abstract A resin molded type semiconductor device according to the present invention comprises a chip support (3) face-bonded to one surface of a semiconductor element (1), which is connected to gold wires (4), with an adhesive tape (2), so as to avoid portions of the semiconductor element (1), which are connected to the gold wires (4), and a mold resin (6) for sealing the other surface of the semiconductor element (1), which is located on the opposite side of one surface thereof and a surface of the chip support (3), which is located on the opposite side of a surface thereof bonded to the semiconductor element (1), so as to expose both the other surface (1b) of the semiconductor element and the surface (3b) of the chip support (3). Owing to the above construction, a thinned semiconductor device can be obtained.
Inventors
- 👤 Etsuo c/o Oki Electric Industry Co.Ltd. Yamada
- 👤 Yasushi Oki Electric Industry Co.Ltd. Shiraishi
- 👤 Hiroshi c/o Oki Electric Industry Co.Ltd. Kawano
- 👤 Shinji c/o Oki Electric Industry Co.Ltd. Ohuchi
- 👤 Hidekazu c/o Oki Electric Industry Co.Ltd. Nasu
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 08:43
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/01; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W74/131; H10W74/142; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
104 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element having a surface to which gold wires are connected; a chip support fixed to the semiconductor element so as to avoid portions of said semiconductor element, which are respectively connected to the gold wires; and a mold resin for sealing a back surface of said semiconductor element, which is located on the opposite side of the surface of said semiconductor element and a surface of said chip support, which is located on the side opposite to a surface thereof fixed to said semiconductor element, so as to expose said both surfaces.
Claim 2
Dependent Claim
130 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element having a surface to which gold wires are connected; a pair of chip supports fixed to said semiconductor element so as to avoid portions of said semiconductor element, which are respectively connected to the gold wires; an adhesive injected between said pair of chip supports, for fixing said pair of chip support and said semiconductor element to each other; and a mold resin for sealing a back surface of said semiconductor element, which is located on the opposite side of the surface of said semiconductor element and a surface of said each chip support, which is located on the side opposite to a surface thereof fixed to said semiconductor element, so as to expose said both surfaces.
Claim 3
Dependent Claim
49 words
A structure according to claim 2, wherein said chip supports are respectively composed of horizontal and vertical portions integrally provided so as to be substantially L-shaped in cross section and are constructed so that tips of the horizontal portions of said chip supports are disposed face-to-face with each other.
Claim 4
Dependent Claim
140 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element having a surface to which gold wires are connected; chip supports disposed so as to avoid portions of said semiconductor element, which are connected to the gold wires and to extend from plural directions, said chip supports having a plurality of adhesive injection holes defined in tips thereof so as to vertically extend therethrough and being bonded to said semiconductor element with adhesives injected through the adhesive injection holes; and a mold resin for sealing a back surface of said semiconductor element, which is located on the opposite side of the surface of said semiconductor element and a surface of said each chip support, which is located on the side opposite to a surface thereof bonded to said semiconductor element, so as to expose said both surfaces.
Claim 5
Dependent Claim
117 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element having a surface to which gold wires are connected; at least one pair of die pads disposed on a back surface of said semiconductor element, which is opposite to the surface of said semiconductor; and a mold resin injected between said pair of die pads so as to bond between said pair of die pads, said mold resin bonding said pair of die pads and said semiconductor element to one another and sealing surfaces of said die pads, which are located on the side opposite to surfaces thereof bonded to said semiconductor element, so as to expose the opposed surfaces of said die pads.
Claim 6
Dependent Claim
65 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element; a plurality of leads respectively having adhesive injection holes defined in tips thereof provided on a surface of said semiconductor element; an adhesive injected through said each adhesive injection hole, for bonding between said semiconductor element and said each lead; and a mold resin for sealing said semiconductor element and said leads.
Claim 7
Dependent Claim
116 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element having a surface to which gold wires are connected; a chip support bonded to the surface of said semiconductor element so as to avoid portions of said semiconductor element, which are connected to the gold wires, said chip support having a projection provided on a surface on the opposite side of the bonded surface; and a mold resin for sealing a back surface of said semiconductor element, which is located on the opposite side of the surface of said semiconductor element and a tip of the projection of said chip support so as to expose the back surface thereof and the tip thereof.
Claim 8
Dependent Claim
111 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element having a surface to which gold wires are connected; a chip support face-bonded to said semiconductor element with an elastic adhesive layer interposed therebetween so as to avoid portions of said semiconductor element, which are connected to the gold wires; and a mold resin for sealing a back surface of said semiconductor element, which is located on the opposite side of said one surface of said semiconductor element and a surface of said chip support, which is located on the opposite side of a surface thereof bonded to said semiconductor element, so as to expose said both surfaces.
Claim 9
Dependent Claim
113 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element having bonding pads formed on a surface thereof; a plurality of inner leads respectively electrically connected to the bonding pads; a metal plate bonded to said semiconductor element so as to avoid the bonding pads provided on the surface of said semiconductor element; and a mold resin for sealing the other surface of said semiconductor element, which is located on the opposite side of the surface of said semiconductor element and a surface of said metal plate, which is located on the opposite side of a surface thereof bonded to said semiconductor element, so as to expose said both surfaces.
Claim 10
Dependent Claim
15 words
A structure according to claim 9, wherein said metal plate is a radiative metal plate.
Claim 11
Dependent Claim
21 words
A structure according to claim 10, wherein said radiative metal plate is selected from Cu, Al and Cu/W as a material.
Claim 12
Dependent Claim
117 words
A structure of a resin molded type semiconductor device, comprising: a semiconductor element having bonding pads formed on a surface thereof; a plurality of inner leads respectively electrically connected to the bonding pads; a chip support thinner in thickness than each of said inner leads bonded to the surface of said semiconductor element so as to avoid the bonding pads; and a mold resin for sealing the other surface of said semiconductor element, which is located on the opposite side of the surface of said semiconductor element and a surface of said chip support, which is located on the opposite side of a surface thereof bonded to said semiconductor element, so as to expose said both surfaces.
Claim 13
Dependent Claim
128 words
A semiconductor device structure having first and second major opposed substantially planar surfaces between which peripheral side edge portions extend, a semiconductor element (1), a chip support (3), a plurality of leads (5) that are exposed to the exterior of the device, electrical connection wires (4) that provide electrical connections between the leads and pads (A1) on the semiconductor element, and resin molding material which encapsulates the device, wherein the chip support is adhered to the semiconductor element on the same side as the pads, the first major surface includes a surface of the chip support contiguous with a first surface of the resin molding material, and the second major surface includes a surface of the semiconductor element contiguous with a second surface of the resin molding material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.