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EP0708338A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Probe card for high temperature application

Assignee: Japan Electronic Materials Corp
•
Filing: 1995-03-15
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Granted: —
•
Expires: 2015-03-15
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Abstract

Abstract Probe card is a part which is incorporated into a probing equipment to test finished IC chips, This card is customarily mounted with a plurality of probes, very fine needle and generally bent, and each probe is disposed so that its front end may pinpoint to a pad of an IC chip of interest. In performing the probing test, a most important condition is to keep the probe contact pressure on the pad of an IC chip at a constant position during measurement time, but in performing such at a high temperature, heated IC chips radiate the probe card and thereby positional deviation of the contact point is caused by heat expansion of the probe card and hence the contact pressure may change. The invented probe card employs a ceramic material in fabricating the probe card for possessing a very low expansion coefficient or for possessing an equivalent coefficient value to the IC chip or wafers, thereby the positional deviation of the probe contact is avoided and other devices to cope with difficulties caused by performance at a high temperature are disclosed.

Inventors

  • 👤 Masao c/o Nihon Denshizairyo K. K. Okubo
  • 👤 Nobuyuki c/o Nihon Denshizairyo K. K. Murakami
  • 👤 Kouji c/o Nihon Denshizairyo K. K. Katahira
  • 👤 Hiroshi c/o Nihon Denshizairyo K. K. Iwata
  • 👤 Kazumasa c/o Nihon Denshizairyo K. K. Okubo

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-08 07:56
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07342; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 60 words
A probe card for testing objectives of interest at a high temperature comprising: a probe for contacting the objectives of interest, a ceramic board for securing the probe, a print board including a wiring pattern, a means for holding the print board at a superposed position spaced from the ceramic board, an interconnector between the wiring pattern and the probe.
Claim 2
Dependent Claim 42 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 1, wherein the ceramic board is made from a material of which thermal expansion coefficient is equivalent to the same coefficient of the objectives of interest.
Claim 3
Dependent Claim 38 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 1, wherein the interconnector is a lead connecting a front end of the wiring pattern with a rear end of the probe.
Claim 4
Dependent Claim 26 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 1, wherein the interconnector is an anisotropic film of electroconduction.
Claim 5
Dependent Claim 24 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 1, wherein the interconnector is a spring pin.
Claim 6
Dependent Claim 41 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 1, or 2, wherein the ceramic board comprises two parts: a ceramic central board and a non-ceramic outer board for holding the ceramic central board.
Claim 7
Dependent Claim 31 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 6, wherein the ceramic central board provides mounts for the probes and the wiring patterns.
Claim 8
Dependent Claim 48 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 1, or 2, wherein the ceramic board is mounted with a retainer which retains the probe at its straight midportion and is durable in a high temperature atmosphere for performing the test.
Claim 9
Dependent Claim 47 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 6, wherein the ceramic central board is mounted with a retainer which retains the probe at its straight midportion and is durable in a high temperature atmosphere for performing the test.
Claim 10
Dependent Claim 37 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 1 or 2, wherein the retainer is secured by an adhesive durable in a high temperature atmosphere for performing the test.
Claim 11
Dependent Claim 35 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 9, wherein the retainer is secured by an adhesive durable in a high temperature atmosphere for performing the test.
Claim 12
Dependent Claim 38 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 10, wherein the adhesive durable in a high temperature is heat durable epoxy adhesive or frit glass for sealing at low temperature.
Claim 13
Dependent Claim 38 words
A probe card for testing objectives of interest at a high temperature as claimed in claim 11, wherein the adhesive durable in a high temperature is heat durable epoxy adhesive or frit glass for sealing at low temperature.

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