Tape automated bonding type semiconductor device

Abstract

Abstract A flexible resin substrate (2) with a device hole (2a) at the center thereof is formed wiring leads (3) with copper foil on the back side face. A tape carrier having such construction forms substrate of a package. The wiring leads (3) are formed to extend from the back side face of the flexible resin substrate (2) into a device hole (2a). The extended portions of the wiring leads (3) are stepped within the device hole (2a) to form the inner leads (3a). On the other hand, the wiring leads (3) have lands (3b) provided greater width than other portions at the portions located on the back side face of the flexible resin substrate (2). A semiconductor chip (1) is formed with bump elements of Au or so forth, on the surface side face and oriented directing the surface where the bump electrodes are formed downwardly and arranged within the device hole (2a). The bump electrodes are connected to the inner leads (3a) of the tape carrier by batch bonding. On the other hand, the lands (3b) are arranged in a form of grid array. Solder balls are fixed on respective lands (3b) to form bumps (5). Also, an insulative resin layer (6) covers the back side face of the tape carrier except for the lands (3b). A sealing resin (mold resin) (4) is formed filling the device hole (2a) and completely covers the semiconductor chip (1) and further covers in a uniform thickness to cover over all area of the flexible resin substrate (2) except for the peripheral edge portion.

Inventors

• 👤 Tsuguo c/o NEC Corporation Nakamura

Bibliographic Details