EP0694932A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Inductor device
Assignee: Intarsia Corp
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Filing: 1995-07-07
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Granted: —
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Expires: 2015-07-07
Abstract
Abstract An inductor device for a multichip module, surface-mount or direct-chip attach asembly is formed on a chip or substrate of a dielectric material, high resistivity semiconductor or ferrite as a spiral metallisation, with solder bumps formed on the terminations of the spiral for connection to corresponding conductors on the underlying surface of the assembly. The use of the flip chip solder bonding technique ensures precise lateral alignment and vertical spacing of the chip with respect to the underlying surface.
Inventors
- 👤 David John Pedder
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 18:11
CPC Classifications
H; H01; H01F; H01F17/00; H01F17/0006; H01F27/00; H01F27/28; H01F27/29; H01F27/292
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
73 words
An inductor device for mounting on a multichip module, on a direct-chip-attach assembly or on a surface mount assembly, comprising a substantially planar electrically insulating substrate, a spiral metallisation structure on a first major face of said substrate defining an inductive element, and a plurality of solder bumps formed on one of the major faces of said substrate for effecting electrical connection of said inductive element to conductors of said module or assembly.
Claim 2
Dependent Claim
21 words
An inductor device in accordance with Claim 1 wherein solder bumps are formed on said first major face of said substrate.
Claim 3
Dependent Claim
30 words
An inductor device in accordance with Claim 1 or Claim 2 wherein said metallisation structure is separated from the material of said substrate by a layer of low permittivity material.
Claim 4
Dependent Claim
33 words
An inductor device in accordance with Claim 1, Claim 2 or Claim 3 wherein a trimmable metallisation layer is formed on the opposite major face of said substrate to said first major face.
Claim 5
Dependent Claim
24 words
An inductor device in accordance with Claim 4 wherein said trimmable metallisation layer is patterned in a concentric ring pattern or a spiral pattern.
Claim 6
Dependent Claim
23 words
An inductor device in accordance with any preceding claim wherein said metallisation structure is coated with a passivating layer of electrically insulating material.
Claim 7
Dependent Claim
24 words
An inductor device in accordance with any one of Claims 1 to 5 wherein said metallisation structure is coated with a non-solderable metallisation layer.
Claim 8
Dependent Claim
16 words
An inductor device in accordance with any preceding claim wherein said substrate is of ferrite material.
References Cited (Backward Citations)
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