Light emitting semiconductor device using group III nitrogen compound
Abstract
Abstract A light-emitting semiconductor device (10) consecutively includes a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n⁺-layer (3) of high carrier (n-type) concentration, a Si-doped (Al x3 Ga 1-x3 ) y3 In 1-y3 N n⁺-layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Al x2 Ga 1-x2 ) y2 In 1-y2 N emission layer (5), and a Mg-doped (Al x1 Ga 1-x1 ) y1 In 1-y1 N p-layer (6). The AlN layer (2) has a 500 Å thickness. The GaN n⁺-layer (3) has about a 2.0 µm thickness and a 2 x 10¹⁸/cm³ electron concentration. The n⁺-layer (4) has about a 2.0 µm thickness and a 2 x 10¹⁸/cm³ electron concentration. The emission layer (5) has about a 0.5 µm thickness. The p-layer 6 has about a 1.0 µm thickness and a 2 x 10¹⁷/cm³ hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n⁺-layer (4) , respectively. A groove (9) electrically insulates the electrodes (7, 8). The composition ratio of Al, Ga, and In in each of the layers (4, 5, 6) is selected to meet the lattice constant of GaN in the n⁺-layer (3). The LED (10) is designed to improve luminous intensity and to obtain purer blue color.
Inventors
- 👤 Katsuhide C/O Toyoda Gosei Heiwacho Plant Manabe
- 👤 Hisaki C/O Toyoda Gosei Heiwacho Plant Kato
- 👤 Michinari C/O Toyoda Gosei Heiwacho Plant Sassa
- 👤 Shiro C/O Toyoda Gosei Heiwacho Plant Yamazaki
- 👤 Makoto C/O Toyoda Gosei Heiwacho Plant Asai
- 👤 Naoki C/O Toyoda Gosei Heiwacho Plant Shibata
- 👤 Masayoshi C/O Toyoda Gosei Heiwacho Plant Koike
Bibliographic Details
Claims Analysis
Total Claims: 9References Cited (Backward Citations)
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