EP0675539A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Ball grid package with integrated passive circuit elements
Assignee: Intarsia Corp
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Filing: 1995-02-03
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Granted: —
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Expires: 2015-02-03
Abstract
Abstract A ball grid array arrangement comprises a dielectric multilayer substrate, in a lower metallisation layer of which is disposed an array of solder balls. A passive circuit element is integrated into at least one of the metallisation layers. The arrangement may be either a discrete component consisting of a triplate transmission-line resonator or interdigitated filter integrated into an inner metallisation layer and defined by that layer in conjunction with adjacent layers, or it may take the form of an IC carrier or multichip-module carrier having such transmission structures situated within a central die-attach area of the substrate and having also a peripheral area containing bonding structures for the mounting of at least one chip or chip module. There will normally be at least two groups of such bonding structures, and a passive circuit element in the form of an inductor may be formed in the upper metallisation layer between adjacent groups of bonding structures.
Inventors
- 👤 David John Pedder
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 19:28
CPC Classifications
H; H01; H01P; H01P1/00; H01P1/20; H01P1/201; H01P1/203; H01P1/20327; H01P1/20336; H01P7/00; H01P7/08; H01P7/084; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W90/00; H10W90/401; H10W90/701; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/36; H05K3/368; H10W70/62; H10W70/65; H10W70/654; H10W70/656; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
62 words
A ball grid array arrangement (10) including a dielectric multilayer substrate (12) having an upper, a lower and at least one inner layer of metallisation (30, 32, 31), the lower metallisation layer (32) including an array of solder balls (22), characterised in that a passive circuit element (60, 70, 75, 81, 100) is integrated into at least one of the metallisation layers.
Claim 2
Dependent Claim
54 words
A ball grid array arrangement as claimed in Claim 1, characterised in that the passive circuit element is a triplate line resonator transmission-line structure 60 formed in the at least one inner metallisation layer (31) and defined by that layer in conjunction with adjacent metallisation layers (30, 32) and intervening dielectric layers (33, 34).
Claim 3
Dependent Claim
53 words
A ball grid array arrangement as claimed in Claim 1, characterised in that the passive circuit element is an interdigitated filter transmission-line structure (70) formed in the at least one inner metallisation layer (31) and defined by that layer in conjunction with adjacent metallisation layers (30, 32) and intervening dielectric layers (33, 34).
Claim 4
Dependent Claim
59 words
A ball grid array arrangement as claimed in Claim 2 or Claim 3, characterised in that the transmission-line structure is terminated by a surface microstrip section formed in the upper or lower metallisation layer, the microstrip section serving to provide an exposed region of metallisation that can be selectively removed to trim the electrical response of the transmission-line structure.
Claim 5
Dependent Claim
31 words
A ball grid array arrangement as claimed in Claim 4, characterised in that a dielectric coating is provided over the surface microstrip section to improve its optical absorption for laser trimming.
Claim 6
Dependent Claim
28 words
A ball grid array arrangement as claimed in Claim 4 or Claim 5, characterised in that the transmission-line structure is formed between adjacent rows of solder balls (22).
Claim 7
Dependent Claim
35 words
A ball grid array arrangement as claimed in any one of the preceding claims, characterised in that it includes one or more ground planes (13, 23) formed in at least one of the metallisation layers.
Claim 8
Dependent Claim
68 words
A ball grid array arrangement as claimed in any one of the preceding claims, characterised in that the substrate includes a central, die-attach area (13) for the mounting of at least one chip or multichip module (24) and a peripheral area containing bonding structures (20) for establishing electrical connections between at least some of the solder balls (22) and the at least one chip or multichip module (24).
Claim 9
Dependent Claim
34 words
A ball grid array arrangement as claimed in Claim 8, characterised in that the passive circuit element is formed in the at least one inner metallisation layer (31) within the central, die-attach area (13).
Claim 10
Dependent Claim
45 words
A ball grid array arrangement as claimed in Claim 8, characterised in that the peripheral area includes at least two groups of bonding structures (15, 16, 17, 18), and the passive circuit element is disposed in the peripheral area between adjacent groups of bonding structures.
Claim 11
Dependent Claim
21 words
A ball grid array arrangement as claimed in Claim 10, characterised in that the passive circuit element is an inductor (75).
Claim 12
Dependent Claim
24 words
A ball grid array arrangement as claimed in Claim 11, characterised in that the inductor (75) is defined in the upper metallisation layer (30).
Claim 13
Dependent Claim
48 words
A ball grid array arrangement as claimed in Claim 11 or Claim 12, characterised in that it includes a capacitor (76) mounted adjacent to the inductor (75) for providing a tuning function for circuitry within the chip or chip module (24) mounted to the ball grid array arrangement.
Claim 14
Dependent Claim
66 words
A ball grid array arrangement as claimed in any one of Claims 8 to 13, characterised in that it includes ground planes (13, 23) formed in the upper and lower metallisation layers (30, 32) in the central area, at least some of the solder balls (22) in the lower metallisation layer (32) in the central area being allocated as common ground connections for the ground planes.
Claim 15
Dependent Claim
72 words
A ball grid array arrangement as claimed in any one of Claims 8 to 14, characterised in that the bonding structures in the peripheral area are wire-bond pads (20) formed in the upper metallisation layer (30), the pads (20) being either signal pads or ground or power supply pads (V1-V4), the pads being arranged so that at least some of the signal pads are each situated between ground or power supply pads.
Claim 16
Dependent Claim
55 words
A ball grid array arrangement as claimed in any one of Claims 8 to 15, characterised in that it includes a seal ring (14) disposed around the outer part of the peripheral area, the seal ring (14) serving as a sealing-cover bonding structure for bonding a sealing cover (21) to the ball grid array arrangement.
Claim 17
Dependent Claim
34 words
A ball grid array arrangement as claimed in Claim 16, characterised in that the seal ring (14) is arranged to be grounded by means of solder balls (22) in the lower metallisation layer (32).
Claim 18
Dependent Claim
39 words
A ball grid array arrangement as claimed in Claim 16 or Claim 17, characterised in that the bonding structures (20) are disposed between the central ground plane (13) in the upper metallisation layer and the peripheral seal ring (14).
Claim 19
Dependent Claim
36 words
A multichip module assembly characterised by including a ball grid array arrangement (10) as claimed in any one of Claims 8 to 18 and a multichip module (24) mounted on the ball grid array arrangement (10).
Claim 20
Dependent Claim
19 words
A multichip module radio or communications device characterised by including a multichip module assembly as claimed in Claim 19.
References Cited (Backward Citations)
No citation records indexed.
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