EP0660405A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Surface mount chip package
Assignee: International Business Machines Corp
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Filing: 1994-11-22
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Granted: —
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Expires: 2014-11-22
Abstract
Abstract An electrical device for logic circuits having a package comprising a combination of controlled collapse electrical interconnections, such as solder balls and pin through-hole conductors, wherein the conductors are disposed outside the perimeter of an inter-array of solder balls, so as to provide an increased footprint for the electrical device beyond that, otherwise maximum footprint for solder balls alone, which footprint is otherwise limited in size due to failures which occur in solder balls when solder balls are exposed to thermal and mechanical stress levels at extended distances from the neutral or zero stress point of the array. <IMAGE>
Inventors
- 👤 Gene Joseph Gaudenzi
- 👤 John Crosby Milliken
- 👤 Joseph Michael Mosley
- 👤 Vito James Tuozzolo
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 11:35
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3415; H10W90/00; H10W90/701; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10734; H05K3/3447; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
62 words
A packaged electronic hardware unit for performing logic functions, comprising: a substrate (60); an electrical logic circuit (54) have input/output terminals carried by the substrate; individual contacts (56) of controlled collapse electrically conductive material connected to some of the input/output terminals; characterised by individual pins (58) of electrically conductive material connected to other of the input/output terminals not connected to the contacts.
Claim 2
Dependent Claim
26 words
A packaged electronic hardware unit as claimed in Claim 1, wherein the individual contacts (56) of controlled collapse electrically conductive material are composed of solder material.
Claim 3
Dependent Claim
26 words
A packaged electronic hardware unit as claimed in Claim 1 or 2, wherein the individual contacts (56) of controlled collapse electrically conductive material are solder balls.
Claim 4
Dependent Claim
70 words
A packaged electronic hardware unit as claimed in Claim 3, wherein the solder balls are disposed in an array on the substrate (60) so that no solder ball extends outwardly from a point centrally located within the array on the substrate a distance greater than "D", where "D" is a distance beyond which stresses can occur in a solder ball which cause the solder ball to not be electrically conductive.
Claim 5
Dependent Claim
17 words
A packaged electronic hardware unit as claimed in Claim 4, wherein "D" is greater than 13.5 mm.
Claim 6
Dependent Claim
41 words
A packaged electronic hardware unit as claimed in any preceding claim, wherein the individual pins (58) are disposed only beyond a perimeter which defines an outline of an array of the individual contacts controlled collapse electrically conductive material on the substrate.
Claim 7
Dependent Claim
89 words
A packaged electronic hardware unit for performing logic functions, comprising: a substrate; an electrical logic circuit have input/output terminals carried by the substrate; a first set of individual electrically conductive contacts made of a material having a first level of electrical inductance connected to some of the input/output terminals; and a second set of individual electrically conductive contacts made of a material having a second level of electrical inductance greater than the first level connected to other of the input/output terminals not connected to the first set of contacts.
References Cited (Backward Citations)
No citation records indexed.
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