EP0651449A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic component and method for producing the same
Assignee: Panasonic Holdings Corp
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Filing: 1994-10-31
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Granted: —
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Expires: 2014-10-31
Abstract
Abstract An electronic component of the present invention includes a first substrate, a second substrate, a first conductive layer constituting a terminal electrode on a first surface of the first substrate, and a first insulating layer formed on the first conductive layer, wherein the first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
Inventors
- 👤 Kazuo Eda
- 👤 Yoshihiro Tomita
- 👤 Akihiro Kanaboshi
- 👤 Masato Sugimoto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 01:41
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/0595; H03H3/00; H03H3/007; H03H3/02; H03H3/08; H03H9/10; H03H9/1007; H03H9/1035; H10; H10N; H10N30/00; H10N30/01; H10N30/02; H10N30/07; H10N30/072; H10N30/20; H10N30/204; H10N30/2041; H10N30/2042; H10N30/80; H10N30/88; Y; Y10; Y10T; Y10T29/00; Y10T29/42
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
70 words
An electronic component comprising a first substrate, a second substrate, a first conductive layer constituting a terminal electrode on a first surface of the first substrate, and a first insulating layer formed on the first conductive layer, wherein the first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
Claim 2
Dependent Claim
34 words
An electronic component according to claim 1, wherein a thickness of an interface at which the first insulating layer and the second substrate are directly bonded to each other is 20 nm or less.
Claim 3
Dependent Claim
19 words
An electronic component according to claim 1, wherein the first conductive layer is buried with the first insulating layer.
Claim 4
Dependent Claim
41 words
An electronic component according to claim 1, wherein the second substrate has convex portions at its periphery, and the first insulating layer and at least a part of the convex portions of the second substrate are directly bonded to each other.
Claim 5
Dependent Claim
15 words
An electronic component according to claim 1, wherein the first substrate is a piezoelectric substrate.
Claim 6
Dependent Claim
36 words
An electronic component according to claim 5, wherein the first substrate is a single crystalline piezoelectric substrate made of a material selected from the group consisting of quartz crystal, lithium niobate, lithium tantalate, and lithium borate.
Claim 7
Dependent Claim
36 words
An electronic component according to claim 1, wherein the second substrate is a single crystalline piezoelectric substrate made of a material selected from the group consisting of quartz crystal, lithium niobate, lithium tantalate, and lithium borate.
Claim 8
Dependent Claim
17 words
An electronic component according to claim 1, wherein the second substrate is a single crystalline silicon substrate.
Claim 9
Dependent Claim
15 words
An electronic component according to claim 1, wherein the second substrate is a glass substrate.
Claim 10
Dependent Claim
84 words
An electronic component comprising a functional portion and a package portion for hermetically sealing the functional portion, the functional portion including a substrate, a conductive layer constituting a terminal electrode formed on a first surface of the substrate, and an insulating layer formed on the conductive layer, wherein at least a part of the package portion and the insulating layer are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
Claim 11
Dependent Claim
27 words
An electronic component according to claim 10, wherein the substrate of the functional portion is a piezoelectric substrate, and the functional portion functions as a piezoelectric element.
Claim 12
Independent Claim
128 words
A method for producing an electronic component including a first substrate, a second substrate, and a conductive layer constituting a terminal electrode between the first substrate and the second substrate, comprising the steps of: forming the conductive layer constituting the terminal electrode on a first surface of the first substrate; forming an insulating layer on the conductive layer; conducting hydrophilic treatment on a surface of the insulating layer and a surface of the second substrate; and attaching the insulating layer to the second substrate with the respective surfaces subjected to the hydrophilic treatment faced each other, wherein the first substrate and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
Claim 13
Dependent Claim
27 words
A method for producing an electronic component according to claim 12, comprising the step of conducting heat treatment after attaching the insulating layer to the second substrate.
Claim 14
Dependent Claim
37 words
A method for producing an electronic component according to claim 13, wherein the step of forming the conductive layer is performed by one process selected from the group consisting of vacuum deposition, sputtering, and chemical vapor deposition.
Claim 15
Independent Claim
37 words
A method for producing an electronic component according to clam 14, wherein the step of forming the insulating layer is performed by one process selected from the group consisting of vacuum deposition, sputtering, and chemical vapor deposition.
Claim 16
Dependent Claim
25 words
A method for producing an electronic component according to claim 15, wherein the surface of the insulating layer is flattened after forming the insulating layer.
Claim 17
Dependent Claim
38 words
A method for producing an electronic component according to claim 12, wherein the step of forming the insulating layer is a step of coating a solution-state precursor of an insulator onto the conductive layer and heat-treating the precursor.
Claim 18
Dependent Claim
33 words
A method for producing an electronic component according to claim 13, wherein the step of heat treatment includes a step of applying an electric field between the conductive layer and the second substrate.
References Cited (Backward Citations)
No citation records indexed.
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