EP0650806A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Polishing apparatus of semiconductor wafer
Assignee: Toshiba Corp
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Filing: 1994-10-28
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Granted: —
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Expires: 2014-10-28
Abstract
Abstract A plurality of cells (33) are provided in a concave portion (22A) of a top plate (22). A cloth (34) to which water is penetrated is provided in a back face of each cell (33), and a wafer (31) is attracted by the cloth (34). First and second pipes (35, 38) are connected to each cell (33). The first pipe (35) introduces liquid (36) to the cell (33), and the second pipe (38) discharges liquid (36) from the cell (33), and guides liquid (36) to the first pipe (35). A constant-temperature device (37) is provided to each first pipe (35), and a temperature of liquid (36) of each cell (33) is adjusted by the constant-temperature device (37) in accordance with a temperature distribution of the wafer (31). Whereby, a polishing rate of each part of the wafer (31) can be equalized.
Inventors
- 👤 Hiroyuki C/O Intellectual Property Div. Ohashi
- 👤 Naoto C/O Intellectual Property Div. Miyashita
- 👤 Ichiro C/O Intellectual Property Div. Katakabe
- 👤 Tetsuya C/O Intellectual Property Div. Tsukihara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 06:02
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/27; B24B37/30; H; H10; H10P; H10P52/00; B24B49/00; B24B49/14
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
113 words
A polishing apparatus characterized by comprising: a top plate (22) having a concave portion (22A) on its back face; a plurality of cells (33) provided in the concave portion of said top plate, wherein each of said cells is filled with liquid (36) and a semiconductor substrate (31) to be polished is attracted to each cell; a pipe (35, 38) for introducing said liquid (36) to each of said cells (33); and adjusting means (37), provided in said pipe (35, 38), for adjusting a temperature of said liquid (36), wherein said adjusting means (37) adjusts the temperature of liquid of each cell in accordance with a temperature distribution of said semiconductor substrate (31).
Claim 2
Dependent Claim
62 words
The apparatus according to claim 1, characterized in that said pipe comprises: a first pipe (35) for introducing said liquid to each of said cells; and a second pipe (35) having one end connected to each of said cells and other end connected to said first pipe for discharging said liquid from said cell, and introducing said liquid to the first pipe.
Claim 3
Dependent Claim
44 words
The apparatus according to claim 1, characterized in that said adjusting means comprises; a heater (39), provided around said first pipe, for heating liquid of said first pipe; and a pump (40), provided in said first pipe, for moving liquid of said first pipe.
Claim 4
Dependent Claim
118 words
A polishing apparatus characterized by comprising: a top plate (22) having a concave portion (22A) on its back face; a plurality of flexible cells (51) provided in the concave portion of said top plate, wherein each of said cells (51)is filled with liquid (36) and a semiconductor substrate (31) to be polished is attracted to each cell; a pipe (52) for introducing said liquid to each of said cells (51); and adjusting means (53), provided in said pipe (52), for adjusting pressure of said liquid, wherein said adjusting means (53) adjusts a position of a surface where the semiconductor substrate (31) of said cell is attracted in accordance with an amount of warp of said semiconductor substrate (31).
Claim 5
Dependent Claim
73 words
The polishing apparatus according to claim 4, characterized by further comprising: measuring means (54) for irradiating said semiconductor substrate (31) with light, and measuring an amount of a warp of said semiconductor substrate in accordance with an angle of light reflected on said semiconductor substrate; and controlling means (60) for controlling said adjusting means (53) in accordance with the amount of the warp of said semiconductor substrate measured by said measuring means (54).
Claim 6
Dependent Claim
102 words
The apparatus according to claim 5, characterized in that said measuring means (54) comprising: a housing (58); driving means (59) for driving said housing (58) along said semiconductor substrate (31); a light source (55), provided in said housing (58), for generating a laser beam; means (56) for guiding the laser beam generated by said light source (55) to said semiconductor substrate (31); and detecting means (57) for detecting the laser beam reflected on said semiconductor substrate (31), wherein said detecting means (57) detects the amount of the warp of the semiconductor substrate by the detected angle of reflection of the laser beam
Claim 7
Dependent Claim
16 words
The apparatus according to claim 5, characterized in that said adjusting means comprises a valve (53).
References Cited (Backward Citations)
GB2072550A
Cited
FR2551382A1
Cited
JPS6080560A
Cited
JPS60146675A
Cited
FR2626208A1
Cited
JPH02240925A
Cited
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