EP0645810A1
Expired / Lapsed
EP
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Package for semiconductor chip
Assignee: Tokuyama Corp
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Filing: 1994-04-06
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Granted: —
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Expires: 2014-04-06
Abstract
Abstract A package for a semiconductor chip having the following features: (a) a power-supply layer, a ground layer, and a signal layer are formed in multilayer through intermediate layers including insulating layers; (b) the power-supply layer and ground layer each comprise an inner lead region exposed from the intermediate layers, an outer lead region, and a conductive region sandwiched by these two regions and covered by the intermediate layers; and (c) the conductive regions of the power-supply layer and ground layer consist of planar conductive members. The self-inductances of the power-supply and ground layers of this package are low, and the capacitance of the capacitor formed by these layers is low. Therefore, the noise of the power-supply system is little. <IMAGE>
Inventors
- 👤 Kenichiro Miyahara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 22:55
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W40/00; H10W40/20; H10W40/22; H10W70/00; H10W70/40; H10W70/421; H10W70/442; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W72/00; H10W72/50; H10W70/682; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07541; H10W72/07551; H10W72/07554; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
119 words
A package for mounting of semiconductor device, wherein: (a) a power layer, a ground layer and a signal layer are laminated via an intermediate layer including an insulating layer, (b) the power layer and the ground layer are each constituted by an inner lead area, an outer lead area and an electro-conductive area, the inner lead area and the outer lead area being not covered with the intermediate layer to be exposed and the electro-conductive area being interposed between the inner lead area and the outer lead area and covered with the intermediate layer, and (c) substantially all of the electro-conductive area of each of the power layer and the ground layer is constituted by a planar electro-conductive member.
Claim 2
Dependent Claim
31 words
The package set forth in Claim 1, wherein at least 90% of the electro-conductive area of each of the power layer and the ground layer is constituted by an electro-conductive member.
Claim 3
Dependent Claim
24 words
The package set forth in Claim 1, wherein the signal layer and the power layer each have a self-inductance of 2 nH or less.
Claim 4
Dependent Claim
22 words
The package set forth in Claim 1, wherein the power layer and the ground layer are laminated adjacently via the intermediate layer.
Claim 5
Dependent Claim
53 words
The package set forth in Claim 4, wherein the lamination is made in the order of: (i) the ground layer, the power layer and the signal layer, (ii) the power layer, the ground layer and the signal layer, or (iii) the ground layer, the power layer, the ground layer and the signal layer.
Claim 6
Dependent Claim
29 words
The package set forth in Claim 4, wherein the intermediate layer between the power layer and the ground layer comprises a ceramic insulating layer and an inorganic adhesive layer.
Claim 7
Dependent Claim
20 words
The package set forth in Claim 6, wherein the ceramic insulating layer has a thickness of 30 µm or more.
Claim 8
Dependent Claim
42 words
The package set forth in Claim 6, wherein the adhesive strengths between the power layer and the ceramic insulating layer and between the ground layer and the ceramic insulating layer are each 1 kg/cm or more in terms of 90° peeling strength.
Claim 9
Dependent Claim
30 words
The package set forth in Claim 4, wherein the intermediate layer between the power layer and the ground layer comprises an organic adhesive layer and an insulating layer present therein.
Claim 10
Dependent Claim
21 words
The package set forth in Claim 9, wherein the insulating layer is a thin ceramic plate or an insulating resin film.
Claim 11
Dependent Claim
30 words
The package set forth in Claim 9, wherein the insulating layer is a metal plate whose both surfaces are covered with a metal oxide film or an insulating resin film.
Claim 12
Dependent Claim
27 words
The package set forth in Claim 9, wherein the capacitor formed by the power layer and the ground layer has a capacity of 110 pF or more.
Claim 13
Dependent Claim
40 words
The package set forth in Claim 9, wherein the adhesive strengths between the power layer and the intermediate layer and between the ground layer and the intermediate layer are each 1 kg/cm or more in terms of 90° peeling strength.
Claim 14
Dependent Claim
27 words
The package set forth in Claim 4, wherein the intermediate layer between the power layer and the ground layer is constituted substantially by an adhesive layer alone.
Claim 15
Dependent Claim
27 words
The package set forth in Claim 14, wherein the capacitor formed by the power layer and the ground layer has a capacity of 110 pF or more.
Claim 16
Dependent Claim
40 words
The package set forth in Claim 14, wherein the adhesive strengths between the power layer and the intermediate layer and between the ground layer and the intermediate layer are each 1 kg/cm or more in terms of 90° peeling strength.
Claim 17
Dependent Claim
52 words
The package set forth in Claim 4, wherein the intermediate layer between the power layer and the ground layer comprises an adhesive layer and an insulating layer formed on the surface of at least either of the electro-conductive members present in the electro-conductive areas of the power layer and the ground layer.
Claim 18
Dependent Claim
21 words
The package set forth in Claim 17, wherein the insulating layer is a metal oxide film or an insulating resin film.
Claim 19
Dependent Claim
27 words
The package set forth in Claim 17, wherein the capacitor formed by the power layer and the ground layer has a capacity of 110 pF or more.
Claim 20
Dependent Claim
40 words
The package set forth in Claim 17, wherein the adhesive strengths between the power layer and the intermediate layer and between the ground layer and the intermediate layer are each 1 kg/cm or more in terms of 90° peeling strength.
Claim 21
Dependent Claim
30 words
The package set forth in Claim 1, wherein a substrate is provided and the power layer or the ground layer is laminated on at least one side of the substrate.
Claim 22
Dependent Claim
22 words
The package set forth in Claim 1, which is used substantially without being subjected to resin sealing after mounting of semiconductor device.
References Cited (Backward Citations)
No citation records indexed.
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