EP0640940A2
Expired / Lapsed
EP
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Contactless chip card
Assignee: Nederlandsche Apparatenfabriek NEDAP NV
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Filing: 1994-08-22
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Granted: —
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Expires: 2014-08-22
Abstract
Abstract The invention relates to a card for contactless information transfer, such as an identification card or a smart card, comprising a housing accommodating a coil construction and an electronic circuit coupled to the coil construction. The housing is composed of two top layers and an intermediate layer interposed between the top layers and comprising the coil construction and the electronic circuit. Each top layer is attached to the intermediate layer through a bonding layer located between the relevant top layer and the intermediate layer and whose softening point is lower than the softening point of the top layers and the intermediate layer.
Inventors
- 👤 Willem Otto De Jong
- 👤 Albert Jan Hakkers
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 15:17
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07749; G06K19/07773; G06K19/07777; G06K19/07779; G06K19/07781
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
101 words
A card for contactless information transfer, such as an identification card or a smart card, comprising a housing accommodating a coil construction and an electronic circuit coupled to the coil construction, the housing being composed of two top layers and an intermediate layer interposed between the top layers and comprising the coil construction and the electronic circuit, characterized in that each top layer is attached to the intermediate layer through a bonding layer located between the relevant top layer and the intermediate layer and whose softening point is lower than the softening point of the top layers and the intermediate layer.
Claim 2
Dependent Claim
26 words
A card according to claim 1, characterized in that the bonding layer consists of a plastic layer coextruded with the top layer and/or the intermediate layer.
Claim 3
Dependent Claim
15 words
A card according to claim 1, characterized in that the bonding layer consists of glue.
Claim 4
Dependent Claim
19 words
A card according to claim 1 or 3, characterized in that the bonding layer consists of a thermotransfer layer.
Claim 5
Dependent Claim
68 words
A card according to any one of the preceding claims, characterized in that the coil construction and a coil space in the housing in which the coil construction is located are mutually adjusted, in such a manner that the coil construction is accommodated in the coil space with some clearance, in such a manner that no tensions arise between the coil construction and the housing upon temperature variations.
Claim 6
Dependent Claim
43 words
A card according to claim 5, characterized in that the intermediate layer consists of a first film piece provided with an opening and a second film piece fitted in the opening, the coil space being formed between the first and second film pieces.
Claim 7
Dependent Claim
27 words
A card according to claim 6, characterized in that the first and/or second film piece is provided with an opening in which the electronic circuit is accommodated.
Claim 8
Dependent Claim
40 words
A card according to any one of the preceding claims, characterized in that the turns of the coil construction are provided with a thermoadhesive or baking lacquer with a softening point higher than the softening point of said bonding layers.
Claim 9
Dependent Claim
30 words
A card according to any one of the preceding claims, characterized in that the coil construction is attached directly to a chip of the electronic circuit through a thermocompression weld.
Claim 10
Dependent Claim
29 words
A card according to any one of the preceding claims, characterized in that the coil construction and the electronic circuit are accommodated within the contours of the intermediate layer.
Claim 11
Dependent Claim
32 words
A card according to any one of the preceding claims, characterized in that the coil construction and the electronic circuit are accommodated within the contours of the intermediate layer with bonding layers.
Claim 12
Dependent Claim
38 words
A card according to any one of the preceding claims, characterized in that at least one of the top layers consists of a film of transparent material having images printed thereon on the side facing the intermediate layer.
Claim 13
Dependent Claim
38 words
A card according to claim 12, characterized in that a light barrier is present between the printing and the intermediate layer, so that the coil construction and the electronic circuit are not visible through the transparent top layer.
Claim 14
Dependent Claim
18 words
A card according to claim 13, characterized in that the light barrier is formed by a covering printing.
Claim 15
Dependent Claim
28 words
A card according to claim 13, characterized in that the light barrier is formed by a non-transparent plastic layer located between the top layer and the intermediate layer.
Claim 16
Dependent Claim
51 words
A card according to any one of the preceding claims, characterized in that on the outside of at least one top layer a thermally sensitive coating has been provided which can be written on by means of, for instance, a thermal printer, and which can also be erased through heat supply.
Claim 17
Independent Claim
115 words
A method for manufacturing a card for contactless information transfer, such as an identification card or a smart card, comprising a housing accommodating a coil construction and an electronic circuit coupled to the coil construction, the housing being composed of two top layers and an intermediate layer interposed between the top layers and comprising the coil construction and the electronic circuit, characterized in that at least one of the two top layers and/or the intermediate layer is provided with a bonding layer whose softening point is lower than the softening point of the top layers and the intermediate layer and that subsequently the top layer is attached to the intermediate layer through a lamination process.
Claim 18
Dependent Claim
28 words
A method according to claim 17, characterized in that each top layer is attached to the intermediate layer through a bonding layer by means of the lamination process.
Claim 19
Dependent Claim
41 words
A method according to claim 17 or 18, characterized in that the lamination process is carried out at a temperature above the softening point of the bonding layer and below the softening point of the intermediate layer and the top layer.
Claim 20
Independent Claim
35 words
A method according to any one of claims 17-19, characterized in that at least the top layer or the intermediate layer is coextruded together with the bonding layer before the lamination process is carried out.
Claim 21
Dependent Claim
51 words
A method according to claim 20, characterized in that not only the intermediate layer is coextruded together with a first bonding layer but also the top layer is coextruded together with a second bonding layer before the first and second bonding layers are bonded to each other through the lamination process.
Claim 22
Dependent Claim
51 words
A method according to claim 20, characterized in that the intermediate layer is coextruded together with two bonding layers, so that the intermediate layer is provided with a bonding layer on opposite sides thereof before a top layer is atttached on each side of the intermediate layer through the lamination process.
Claim 23
Dependent Claim
33 words
A method according to claim 20, characterized in that each top layer is coextruded together with a bonding layer before these top layers are attached to the intermediate layer through the lamination process.
References Cited (Backward Citations)
No citation records indexed.
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