EP0633295A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Resin composition for electronic parts
Assignee: Otsuka Chemical Co Ltd
•
Filing: 1994-01-27
•
Granted: —
•
Expires: 2014-01-27
Abstract
Abstract The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO₂ as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.
Inventors
- 👤 Takio 332-9 Aza Hachikitakaitaku Tasaka
- 👤 Hiroyuki Mezondofurora 505 Monde
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 08:58
CPC Classifications
C; C08; C08K; C08K7/00; C08K7/02; C08K7/04; C08K7/08; C08K7/10; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0242; H05K2201/0248; H05K2201/0251
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
105 words
An electronic device resin composition comprising a thermoplastic resin or a thermosetting resin and a fiber component selected from the group consisting of whiskers of the composition represented by the general formula aA x O y ·bB₂O₃ (wherein a and b each represents a whole number of 1 - 9; A represents a divalent or trivalent metal, x and y each represents a whole number of 1 - 3) and either wollastonite or xonotlite, which is a fibrous substance composed predominantly of CaO·SiO₂, the latter component occurring in a proportion of 5 - 60% based on the combined weight of said resin and fiber component.
Claim 2
Dependent Claim
59 words
The electronic device resin composition of claim 1 wherein said thermoplastic resin is at least one member selected from the group consisting of poly(phenylene ether) resin, syndiotactic polystyrene, 5-methylpentene resin, cyclic polyolefin resin, heat-resistant ABS resin, heat-resistant polyamide resin, poly(phenylene sulfide) resin, aromatic polysulfone resin, polyetherimide resin, polyetherketone resin, polyethernitrile resin, thermotropic liquid crystal polyester resin and heat-fusible fluororesin.
Claim 3
Dependent Claim
31 words
The electronic device resin composition of claim 1 wherein said thermosetting resin is at least one member selected from the group consisting of phenolic resin, epoxy resin and unsaturated polyester resin.
Claim 4
Dependent Claim
82 words
The electronic device resin composition of claims 1 - 3 characterized in that said whiskers of the composition represented by general formula aA x O y ·bB₂O₃ are whiskers of an aluminum borate of the formula 9Al₂O₃·2B₂O₃ or 2Al₂O₃·B₂O₃ and/or whiskers of a magnesium borate of the formula 2MgO·B₂O₃ and that either one or both of said kinds of whiskers are used in the fiber diameter range of 0.05 - 5 µm and the fiber length range of 2 - 100 µm.
Claim 5
Dependent Claim
50 words
The electronic device resin composition of claims 1 - 3 wherein said wollastonite comprises fibers with aspect ratios not less than 6 in a proportion of not less than 60 weight % and fibers with diameters not greater than 5 µm in a proportion not less than 80 weight %.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.