EP0622847A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Three dimensional package and architecture for high performance computer
Assignee: International Business Machines Corp
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Filing: 1994-04-11
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Granted: —
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Expires: 2014-04-11
Abstract
Abstract A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate (8) which has on at least one side thereof at least one integrated circuit device (14, 16). Between adjacent subassemblies there is disposed a second substrate (18). There are electrical interconnection means (29) to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.
Inventors
- 👤 Evan Ezra Davidson
- 👤 David Andrew Lewis
- 👤 Jane Margaret Shaw
- 👤 Alfred Viehbeck
- 👤 Janusz Stanislaw Wilczynski
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 14:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H05K1/00; H05K1/02; H05K1/14; H05K1/145; H10; H10W; H10W90/00; H05K1/03; H05K1/05; H05K1/053; H05K1/056; H05K2201/00; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K2201/09654; H05K2201/09718; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/4602; H05K3/4608; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
130 words
A structure comprising: a plurality of subassemblies; each of said subassemblies comprising: a first substrate having a first side and a second side; at least one electronic device disposed on said first side and said second side; a plurality of first contact locations on said first side; a plurality of second contact locations on said second side; a plurality of second substrates; each of said subassemblies is disposed between a first one of said plurality of second substrates and a second one of said plurality of second substrates; first means for electrically interconnecting said plurality of first contact locations to said first one of said plurality of second substrates; second means for electrically interconnecting said plurality of second contact locations to said second one of said plurality of second substrates.
Claim 2
Dependent Claim
26 words
A structure according to claim 1, wherein said first means and said second means are selected from the group consisting of solder mounds and wire bonds.
Claim 3
Dependent Claim
28 words
A structure according to claim 1, wherein there are a plurality of electronic devices on said first side and a plurality of electronic devices on said second side.
Claim 4
Dependent Claim
32 words
A structure according to claim 1, wherein said electronic device is a semiconductor device selected from the group consisting of a silicon integrated circuit chip and a gallium arsenide integrated circuit chip.
Claim 5
Dependent Claim
19 words
A structure according to claim 1, wherein said first substrate has electrical conductors for electrically interconnecting said electronic devices.
Claim 6
Dependent Claim
21 words
A structure according to claim 1, wherein said second substrate has electrical conductors for providing power and ground to said subassemblies.
Claim 7
Dependent Claim
23 words
A structure according to claim 1, wherein there is at least one electronic device disposed on said first side and said second side.
Claim 8
Dependent Claim
39 words
A structure according to claim 1, further including a third substrate, each of said second substrates has an edge having electrical conductors at said edge, said edge is disposed in electrical communication with electrical conductors on said third substrate.
Claim 9
Dependent Claim
22 words
A structure according to claim 8, further including a stack of memory devices in electrical communication with one of said second substrates.
Claim 10
Dependent Claim
29 words
A structure according to claim 1, further including means for directly electrically interconnecting said at least one electronic device to at least one of said plurality of second substrates.
Claim 11
Dependent Claim
34 words
A structure according to claim 10, wherein said means for directly electrically interconnecting said at least one electronic device to said at least one of said plurality of second substrates is a solder mound.
Claim 12
Dependent Claim
160 words
A structure comprising: a plurality of subassemblies; each of said subassemblies comprises a first substrate having a first side and a second side, a first at least one logic electronic device being disposed on said first side, a second at least one electronic devices being disposed on said second side, said first substrate has electrical conductors for electrical interconnection to said first and said second, said first substrate has a plurality of first contact locations; a plurality of second substrates, each having an end; said subassemblies are disposed between said second substrates; said second substrates have a plurality of second contact locations; said first contact locations are disposed adjacent said second contact locations; a means for providing electrical interconnection between said second substrates and said first substrates; a third substrate; said ends of said second substrates being disposed adjacent said third substrates; means for providing electrical interconnection of electrical conductors at said ends with electrical conductors in said third substrate.
Claim 13
Dependent Claim
21 words
A structure according to claim 9, further including at least one memory device disposed in electrical contact with said second substrate.
Claim 14
Dependent Claim
17 words
A structure according to claim 8, wherein said electrical conductors at said edge are electrically conducting pins.
Claim 15
Dependent Claim
43 words
A structure comprising a plurality of metal and dielectric layers which allow an electrical path from an internal metal layers to the first or second side, or both of said substrate an electrically isolated path from first to second side of said substrate.
Claim 16
Dependent Claim
26 words
A structure according to claim 15, wherein the plurality of metal layers are selected from the group consisting of copper, molybdenum, tungsten, copper-Invar-copper, and stainless steel.
Claim 17
Dependent Claim
27 words
A structure according to claim 15, in which the plurality of dielectric layers are selected from the group consisting of polyimides, fluoropolymers, cyanate esters, epoxides and bismaleimides.
Claim 18
Dependent Claim
33 words
A structure according to claim 15, in which the electrical paths from the internal metal layers to the sides, or from one side to another consists of an electrically conducting material or composite.
Claim 19
Dependent Claim
25 words
A structure according to claim 18, in which the conducting material can be selected from the group consisting of conducting polymer, metal or metal alloy.
Claim 20
Dependent Claim
21 words
A structure according to claim 18, in which the composite material consists of a metal in an organic or inorganic binder.
Claim 21
Dependent Claim
23 words
A structure according to claim 20, in which the binder is a thermosetting polymer from the group epoxy resin, cyanate ester, and bismaleimide.
Claim 22
Dependent Claim
29 words
A structure according to claim 20, in which the binder is a thermoplastic polymer, selected from the group consisting of polyimides, polyimidesiloxanes, polyamic acid, poly(siloxane), polysulfones, polyetherimides and fluoropolymers.
Claim 23
Dependent Claim
27 words
A structure according to claim 20, in which the metal in the polymer composite is selected from copper, silver, gold, chromium, nickel, palladium, platinum and alloys thereof.
Claim 24
Dependent Claim
15 words
A structure according to claim 18, in which the organic binder is a silicon oil.
Claim 25
Dependent Claim
113 words
A structure in which the first side of the structure according to claim 15, is electrically interconnected to the first side of a second structure with second side of second structure is electrically connected to an electronic device disposed thereon means to provide electrical interconnection of signal and power to a plurality of electronic devices attached the second side of the second structure to (i) other devices on the second side of the second structure (ii) to the electrical connections on the first side of the first substrate means to provide electrical contacts from the electronic devices in the second side of the second structure of the first substrate to a second substrate.
Claim 26
Dependent Claim
94 words
A structure according to claim 25, wherein second structure is a power and signal redistribution layer from the metal layers of structure 1 to electronic devices attached to the second side of structure 2 from electrical contacts on sides 1 and 2 of structure 1 to electrical devices electrically connected and disposed on side 2 of structure 2 from electronic devices attached to a second structure 2 on side 2 of structure 1, to electrical devices attached to the second side of the first structure 2, joined to the first side of structure 1.
Claim 27
Dependent Claim
66 words
A structure according to claim 15, with electrically conductive pins attached electrically and disposed on the second side of the same, in electrical contact with one or a plurality of metal layers inside the substrate electrical devices disposed on the first side of the substrate used as a chip carrier for a single chip or a plurality of chips each containing a plurality or electrical circuits.
Claim 28
Dependent Claim
65 words
A structure according to claim 15, with electrically conductive pads on the second side of the substrate, which are in electrical contact with one or a plurality of metal layers inside the substrate electrical devices disposed on the first side of the substrate used as a chip carrier for a single chip or a plurality of chips each containing a plurality or electrical circuits. .sp
Claim 29
Dependent Claim
15 words
The structure according to claim 15, when the same is used as a power redistribution.
Claim 30
Dependent Claim
33 words
A structure according to claim 25, when a heatsink is attached to the second side of the substrate to limit and control the maximum temperature of the substrate and electronic devises disposed thereon.
Claim 31
Dependent Claim
66 words
A structure according to claim 25, with electrically conductive pins attached electrically and disposed on the second side of the same, in electrical contact with one or a plurality of metal layers inside the substrate electrical devices disposed on the first side of the substrate used as a chip carrier for a single chip or a plurality of chips each containing a plurality or electrical circuits.
Claim 32
Dependent Claim
64 words
A structure according to claim 25, with electrically conductive pads on the second side of the substrate, which are in electrical contact with one or a plurality of metal layers inside the substrate electrical devices disposed on the first side of the substrate used as a chip carrier for a single chip or a plurality of chips each containing a plurality or electrical circuits.
Claim 33
Dependent Claim
33 words
A structure according to claim 25, where a heatsink is attached to the second side of the substrate to limit and control the maximum temperature of the substrate and electronic devises disposed thereon.
Claim 34
Dependent Claim
24 words
A structure according to claim 25, where a means for cooling same to subambient temperatures is attached to the second side of the substrate.
Claim 35
Dependent Claim
42 words
A structure according to claim 33, used as a chip carrier for a single chip or a plurality of chips each containing a plurality or electrical circuits, with a means to electrically carry signals from the electronic devices to a second substrate.
Claim 36
Dependent Claim
42 words
A structure according to claim 34, used as a chip carrier for a single chip or a plurality of chips each containing a plurality or electrical circuits with a means to electrically carry signals from the electronic devices to a second substrate.
Claim 37
Dependent Claim
43 words
A structure according to claim 15, further including a second structure electrically disposed on one or both sides of the first structure. With the second structure having an edge, there is a means for electrical contact from said edge to a third structure.
Claim 38
Dependent Claim
43 words
A structure according to claim 25, further including a second structure electrically disposed on one or both sides of the first structure. With the second structure having an edge, there is a means for electrical contact from said edge to a third structure.
Claim 39
Dependent Claim
35 words
A means to provide increased electrical connection density on an electronic device by providing a means of introducing the power and ground, or signal from the opposite side of the wafer to the active devices.
References Cited (Backward Citations)
No citation records indexed.
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