EP0611129A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Embedded substrate for integrated circuit modules
Assignee: Lockheed Martin Corp
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Filing: 1994-02-08
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Granted: —
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Expires: 2014-02-08
Abstract
Abstract Substrate material is molded directly to semiconductor chips (14) and other electrical components (20) that are positioned for integrated circuit module fabrication. Chips (14) having contact pads are placed face down on a layer of adhesive supported by a base (10). A mold form is positioned around the chips. Substrate molding material (24) is added within the mold form, and the substrate molding material (24) is then hardened. A dielectric layer (12) having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material (24) and the faces of the chips (14). A thermal plug (34) may be affixed to the backside of a chip (14) before substrate molding material (24) is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips (14) and substrate molding material (24) may be removed after the substrate molding material (24) is hardened.
Inventors
- 👤 Raymond Albert Fillion
- 👤 Robert John Wojnarowski
- 👤 Michael Gdula
- 👤 Herbert Stanley Cole
- 👤 Eric Joseph Wildi
- 👤 Wolfgang Daum
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 18:42
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10P; H10P72/00; H10P72/70; H10P72/74; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W72/00; H10W72/01; H10W72/0198; H10W74/10; H10W74/111; H10W74/124; H10W74/40; H10W74/47; H10W74/473; H10W90/00; H10W70/099; H10W72/071; H10W72/073; H10W72/07302; H10W72/07304; H10W72/07307; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/801; H10W72/834; H10W72/90; H10W72/941; H10W72/9413; H10W74/114; H10W74/131; H10W74/137; H10W74/142; H10W90/10; H10W90/20; H10W90/288; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
97 words
An integrated circuit module, comprising: a plurality of chips, each of said chips having contact pads located on a common plane; hardened substrate molding material surrounding said chips, except for the faces of said chips; a dielectric layer situated on the faces of said chips and said hardened substrate molding material, said dielectric layer including a plurality of vias therein, at least some of said plurality of vias being aligned with predetermined ones of said contact pads, respectively; and a pattern of electrical conductors extending through selected ones of said plurality of vias in said dielectric layer.
Claim 2
Dependent Claim
13 words
The module of claim 1, wherein said hardened substrate molding material comprises plastic.
Claim 3
Dependent Claim
30 words
The module of claim 2, wherein said hardened substrate molding material comprises material selected from the group consisting of thermoplastics, thermosets, polyetherimide resins, polytetrafluoroethylenes, epoxies, benzocyclobutene, acrylates, polyurethanes, and polyimides.
Claim 4
Dependent Claim
29 words
The module of claim 2, wherein said hardened substrate molding material includes filler material therein selected from the group consisting of glass, SiC, Al₂O₃, AlN, diamond, graphite, and metal.
Claim 5
Dependent Claim
27 words
The module of claim 4, wherein said filler material is in one of the configurations selected from the group consisting of particles, fibers, screens, mats, and plates.
Claim 6
Dependent Claim
13 words
The module of claim 1, wherein said dielectric layer comprises a thermoset material.
Claim 7
Dependent Claim
15 words
The module of claim 6, wherein said hardened substrate molding material comprises a thermoset material.
Claim 8
Dependent Claim
19 words
The module of claim 1, wherein said substrate molding material comprises a blend of polyimide, epoxy, and crosslinking catalyst.
Claim 9
Dependent Claim
28 words
The module of claim 8, wherein said substrate molding material further comprises particles selected from the group consisting of alumina, aluminum nitride, aluminum silicon carbide, aluminum, and diamond.
Claim 10
Dependent Claim
43 words
The module of claim 8, further including an adhesive layer between said dielectric layer on one side and said chips and said substrate molding material on the other side, and wherein said adhesive layer comprises the same material as said substrate molding material.
Claim 11
Dependent Claim
34 words
The module of claim 1, further including a thermal plug extending from the backside of at least one of said chips at least through to the opposite side of said hardened substrate molding material.
Claim 12
Dependent Claim
14 words
The module of claim 11 ,wherein said thermal plug comprises an electrically conductive material.
Claim 13
Dependent Claim
28 words
The module of claim 11, wherein said thermal plug comprises a material selected from the group consisting of copper, molybdenum, and a silicon carbide matrix infiltrated with aluminum.
Claim 14
Dependent Claim
27 words
The module of claim 1, further including a connector frame including contact pads coplanar with contact pads around said chips positioned in said hardened substrate molding material.
Claim 15
Dependent Claim
28 words
The module of claim 14, wherein said connector frame further comprises an array of pins which extend at least through said substrate molding material to the surface thereof.
Claim 16
Dependent Claim
28 words
The module of claim 14, wherein said connector frame further comprises an array of pins which extend at least through to the side of said substrate molding material.
Claim 17
Dependent Claim
21 words
The module of claim 1, further including an inner dielectric layer positioned between said chips and said hardened substrate molding material.
Claim 18
Dependent Claim
31 words
The module of claim 17, further including an electrically conductive strip extending along said inner dielectric layer from the backside of at least one of said chips to said dielectric layer.
Claim 19
Dependent Claim
29 words
The module of claim 18, further including an electrical connection from said electrically conductive strip to one potential selected from the group consisting of a voltage source and ground.
Claim 20
Dependent Claim
69 words
The module of claim 1, further including: an additional dielectric layer situated over said dielectric layer, said additional dielectric layer including a plurality of additional vias therein, at least some of said plurality of additional vias being aligned with predetermined portions of said pattern of electrical conductors; and an additional pattern of electrical conductors extending through selected ones of said plurality of additional vias in said additional dielectric layer.
References Cited (Backward Citations)
No citation records indexed.
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