EP0606648A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
Assignee: Toshiba Corp
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Filing: 1993-12-28
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Granted: —
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Expires: 2013-12-28
Abstract
Abstract In a semiconductor manufacturing apparatus, a cleaner (2) is inserted in a space defined between an upper mold (1) and a lower mold (3), which are incorporated in a mold unit. The cleaner (2) has an ultraviolet-ray supply unit (26, 27), an ozone supply unit (28), an ozone collecting unit (29), and a brush. Dirt on the surfaces of the upper and lower molds is decomposed and removed by radiating ultraviolet rays in the atmosphere of heated ozone.
Inventors
- 👤 Mika C/O Intellectual Property Div. Egashira
- 👤 Yasumasa C/O Intellectual Property Div. Noda
- 👤 Shinji C/O Intellectual Property Div. Takei
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 08:54
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0441; B; B08; B08B; B08B7/00; B08B7/0035; B08B7/0057; B29; B29C; B29C33/00; B29C33/70; B29C33/72
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
61 words
A semiconductor manufacturing apparatus characterized by comprising: mold means (1, 3) provided with an upper mold (1) and a lower mold (3) for sealing a semiconductor chip with a resin; and removal means (26, 27, 28, 29) for decomposing and removing dirt on the surfaces of the upper and lower molds by radiating ultraviolet rays in the atmosphere of heated ozone.
Claim 2
Dependent Claim
78 words
The semiconductor manufacturing apparatus according to claim 1, characterized in that the removal means has cleaner means (2) to be inserted between the upper and lower molds (1, 3) for cleaning the surfaces of the upper and lower molds, the cleaner means (2) having ultraviolet-ray supply means (26, 27), ozone supply means (28), ozone collecting means (29) for collecting ozone and exhausted gases, and a movable brush to be brought into contact with the upper and lower molds.
Claim 3
Dependent Claim
84 words
The semiconductor manufacturing apparatus according to claim 1, characterized in that the removal means has a cleaning portion having a brush to be inserted between the upper and lower molds; a cleaner main body provided outside the mold means and including ultraviolet-ray supply means, ozone supply means, and ozone collecting means for collecting ozone and exhausted gases; wire means connected to the ultraviolet-ray supply means, each having an open tip portion in the cleaning portion; and pipe means connected to the ozone collecting means;
Claim 4
Dependent Claim
26 words
The semiconductor manufacturing apparatus according to claim 3, characterized in that the wire means connected to the ultraviolet-ray supply means is a glass fiber unit (21).
Claim 5
Dependent Claim
85 words
The semiconductor manufacturing apparatus according to claim 3, characterized in that the wire means connected to the ultraviolet-ray supply means has a plurality of wires, and the pipe means (22) onnected to the ozone supply means has a plurality of pipes, tip portions of the wires and the pipes being arranged in the vertical direction and in the horizontal direction such that ultraviolet rays and ozone can be uniformly applied to the surfaces of the upper and lower molds through the wires and the pipes.
Claim 6
Independent Claim
88 words
A method of manufacturing a semiconductor device, characterized by comprising the steps of: heating a mold unit consisting of upper and lower molds; decomposing and removing dirt on the surfaces of the upper and lower molds by radiating ultraviolet rays in the atmosphere of heated ozone; clamping the upper and lower molds after placing in the lower mold a lead frame having a semiconductor chip mounted thereon; injecting a melted resin into the mold unit; hardening the injected resin; and dismounting the lead frame from the mold unit.
Claim 7
Dependent Claim
18 words
The method according to claim 6, characterized in that the heating step is performed at 150 - 200°C.
Claim 8
Dependent Claim
36 words
The method according to claim 6, characterized in that in the dirt decomposing/removing step, unnecessary resin accumulated on a parting surface of the mold unit is removed with a releasing agent adhered to the parting surface.
Claim 9
Dependent Claim
62 words
The method according to claim 6, characterized in that the dirt decomposing/removing step is performed by the use of cleaner means, which is inserted between the upper and lower molds and has ultraviolet-ray supply means, ozone supply means, ozone collecting means for collecting ozone and exhausted gases, and a movable brush to be brought into contact with the upper and lower molds.
Claim 10
Dependent Claim
110 words
The method according to claim 6, characterized in that the dirt decomposing/removing step is performed by the use of the dirt decomposing/removing means, which has a cleaning portion having a brush to be inserted between the upper and lower molds; a cleaner main body provided outside the mold means and including ultraviolet-ray supply means, ozone supply means, and ozone collecting means for collecting ozone and exhausted gases; wire means connected to the ultraviolet-ray supply means; pipe means connected to the ozone supply means; and pipe means connected to the ozone collecting means; the wire means and the two pipe means each having an opening tip portion in the cleaning portion.
Claim 11
Dependent Claim
20 words
The method according to claim 9, characterized in that heated ozone is supplied by means of the ozone supply means.
Claim 12
Dependent Claim
20 words
The semiconductor manufacturing apparatus according to claim 2 or 3, characterized in that the ozone supply means has heating means.
References Cited (Backward Citations)
No citation records indexed.
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