EP0600645A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Single in-line optical package
Assignee: AT&T Inc
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Filing: 1993-11-18
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Granted: —
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Expires: 2013-11-18
Abstract
Abstract An optical packaging arrangement is disclosed which utilizes silicon technology and overmolding techniques to provide a single in-line package with completely passive alignment between the various optical components (26,28). The technique is useful in the packaging of a single active optical device and associated electronics, a pair of optical devices (26,28) and electronics (transceiver) (18,20,22,24), or an array of any desired number of such components. Since the silicon may be processed to include etched alignment fiducials (30) and metallized bond pad sites (14), solder bump self-alignment and silicon optical bench technology may be used to provide for alignment between the active device (26,28), a coupling lens and associated optical fiber.
Inventors
- 👤 Albert Michael Benzoni
- 👤 Mindaugas Fernand Dautartas
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 16:42
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4292; G02B6/4201; G02B6/4219; G02B6/422; G02B6/4221; G02B6/4224; G02B6/4246; G02B6/4249
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
221 words
An optical package comprising a silicon substrate (e.g., 12) defined as comprising a top major surface (e.g., 13); a plurality of metallized bond pad sites (e.g., 14) formed on said top major silicon surface; at least one active optical device (e.g., 26, 28) attached and electrically connected to said top major silicon surface; electronic circuitry (e.g., 18, 20) for operating said at least one active optical device; means for electrically connecting said electronic circuitry between the plurality of metallized bond pad sites and the at least one active optical device; a plurality of alignment fiducials (e.g., 30, 32) formed in said top major silicon surface at predetermined locations with respect to the location of said at least one active optical device; CHARACTERIZED IN THAT the electronic circuitry is attached to the silicon substrate top major surface and the package further comprises; optical receptacle means (e.g., 34, 36, 42, 50, 52) for providing coupling between an optical fiber and said at least one active optical device, said optical receptacle means including alignment fiducials which mate with said optical device alignment fiducials upon attachment and provide optical alignment between said at least one active optical device and said optical receptacle means; and outer packaging (e.g., 60) formed so as to completely enclose said silicon substrate and a portion of said optical receptacle means.
Claim 2
Dependent Claim
36 words
An optical package as defined in claim 1 wherein the optical receptacle means includes a coupling lens and a fiber ferrule receptacle, said coupling lens positioned within an axial bore formed in said fiber ferrule receptacle.
Claim 3
Dependent Claim
35 words
An optical package as defined in claim 2 wherein the optical receptacle means further comprises an optical connector receptacle and the fiber ferrule receptacle includes an outer flange for mating with said optical connector receptacle.
Claim 4
Dependent Claim
43 words
An optical package as defined in claim 2 wherein the optical receptacle means further comprises a lens holder including the plurality of alignment fiducials for supporting said coupling lens and mating with the plurality of fiducials formed on the silicon top major surface.
Claim 5
Dependent Claim
37 words
An optical package as defined in claim 1 wherein the at least one active optical device includes both electrical contact regions on same surface, said surface being attached and electrically connected to the silicon top major surface.
Claim 6
Dependent Claim
22 words
An optical package as defined in claim 1 wherein the at least one active optical device comprises a pair of optical devices.
Claim 7
Dependent Claim
26 words
An optical package as defined in claim 6 wherein the assembly comprises an optical transceiver and the pair of optical devices comprises an LED and photodiode.
Claim 8
Dependent Claim
33 words
An optical package as defined in claim 1 wherein the alignment fiducials comprise a plurality of pyramidal detents etched in silicon, with a like plurality of spherical members disposed therebetween to provide attachment.
Claim 9
Dependent Claim
30 words
An optical package as defined in claim 1 wherein the at least one optical device is self-aligned to bond pad sites formed on top major surface of the silicon substrate.
References Cited (Backward Citations)
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