EP0591604A2
Expired / Lapsed
EP
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Via fill compositions
Assignee: EIDP Inc
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Filing: 1993-03-05
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Granted: —
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Expires: 2013-03-05
Abstract
Abstract A thick film paste especially suitable for via fill applications comprising finely divided particles of conductive metal which is not alloyable with silver selected from the group consisting of Os, Ru, Ir, Rh and mixtures and alloys thereof and optionally a small amount of inorganic binder both dispersed in a liquid organic medium.
Inventors
- 👤 Jacob Hormadaly
- 👤 Arthur Harvey Mones
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 13:36
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H05K1/03; H05K1/0306
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
56 words
A thick film paste composition comprising by weight, basis total inorganic solids, 90-100% finely divided particles of a conductive metal which is not alloyable with silver selected from the group consisting of Os, Ru, Ir, Rh and mixtures and alloys thereof and 10-0% finely divided particles of inorganic binder, both dispersed in a liquid organic medium.
Claim 2
Dependent Claim
12 words
The composition of claim 1 in which the conductive metal is Ru.
Claim 3
Dependent Claim
16 words
The composition of claim 1 which contains 0.5-10% inorganic binder having a softening point of 400-1000C.
Claim 4
Dependent Claim
78 words
A method for forming electrically conductive vias between electrically functional layers separated by dielectric layers comprising the sequential steps: (1) forming via holes in the dielectric layers separating the electrically functional layers; (2) filling the via holes with the composition of claim 1 by screen printing; and (3) firing the filled via holes to effect volatilization of the liquid organic medium from the paste and sintering of the conductive metal particles and of the inorganic binder if any.
Claim 5
Dependent Claim
42 words
The method of claim 4 in which the dielectric layers are formed from an alumina green tape which contains no inorganic binder, the via fill paste contains no inorganic binder and the firing is carried out at 1300-1600C in a non-reducing atmosphere.
Claim 6
Dependent Claim
42 words
The method of claim 4 in which the dielectric layers are formed from an alumina green tape which contains an inorganic binder, the via fill paste contains no inorganic binder and the firing is carried out at 800-1000C in a non-reducing atmosphere.
Claim 7
Dependent Claim
17 words
The method of claim 4 in which the electrically functional layers are selected from resistors and conductors.
Claim 8
Dependent Claim
32 words
The method of claim 4 in which the electrically functional layers are conductive layers prepared by printing and firing a thick film paste having the same composition as the via fill composition.
Claim 9
Dependent Claim
48 words
A fired multilayer electronic structure comprising alternating layers of dielectric tape and conductor patterns having interconnecting vias filled with the thick film paste of claim 1 from which the organic medium has been completely volatilized and the conductive metal sintered by firing the structure in a non-reducing atmosphere.
Claim 10
Dependent Claim
29 words
The fired multilayer electronic structure of claim 9 in which the fired dielectric tape layer is comprised of alumina and the structure is fired at a temperature of 1300-1600C.
Claim 11
Dependent Claim
40 words
The fired multilayer electronic structure of claim 9 in which the fired dielectric tape layer is comprised of 90-99.5% alumina and 10-0.5% inorganic binder having a softening point of 800-1000C and the structure is fired at a temperature of 1300-1600C.
Claim 12
Dependent Claim
46 words
The fired multilayer electronic structure of claim 9 in which the fired dielectric tape layer is comprised of a minor amount of alumina dispersed in a matrix of inorganic binder having a softening point of 400-700C and the structure is fired at a temperature of 800-1000C.
Claim 13
Dependent Claim
26 words
The fired multilayer electronic structure of claim 9 in which the fired compositions of the conductor patterns and of the via fill material are the same.
References Cited (Backward Citations)
No citation records indexed.
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