EP0587442A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Wire bonding over the active circuit area of an integrated circuit device
Assignee: Texas Instruments Inc
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Filing: 1993-09-10
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Granted: —
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Expires: 2013-09-10
Abstract
Abstract Wire bonding over the active circuit (13) of an integrated circuit device (10) is accomplished by providing a layer of a polyimide material (23) in overlying relationship relative to the active circuit, depositing a bonding pad (31) on the polyimide layer opposite the active circuit, connecting the bonding pad electrically to the active circuit, and bonding a wire (33) to the bonding pad.
Inventors
- 👤 Katherine G. Heinen
- 👤 Rafael Verity Instruments Inc. Alfaro
- 👤 Roger J. Stierman
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 14:28
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10W72/071; H10W72/075; H10W72/50; H10W72/90; H10W70/00; H10W70/60; H10W72/0711; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07541; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/921; H10W72/923; H10W72/9232; H10W72/951; H10W72/952; H10W74/00
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
67 words
A method of effecting wire bonding over an active circuit of an integrated circuit device, comprising the steps of: providing a layer of a polyimide material in overlying relationship relative to the active circuit; depositing a bonding pad on the polyimide layer opposite the active circuit; connecting the bonding pad electrically to the active circuit through the polyimide layer; and bonding a wire to the bonding pad.
Claim 2
Dependent Claim
24 words
A method according to Claim 1, wherein said wire bonding step includes operating a bonding transducer at a frequency of at least 100 kHz.
Claim 3
Dependent Claim
27 words
A method according to Claim 1 or Claim 2, further comprising providing the polyimide layer having a modulus of elasticity in a range of approximately 6-13 GPa.
Claim 4
Independent Claim
32 words
A method according to any preceding claim, further comprising providing the polyimide layer having a coefficient of thermal expansion in a range of approximately 3 x 10⁻⁶ to 10 x 10⁻⁶ in/in/°C.
Claim 5
Independent Claim
33 words
A method according to any preceding claim, further comprising providing the polyimide layer having a thickness in a range of approximately 3 to 6 microns and having a dielectric constant of approximately 3.
Claim 6
Independent Claim
51 words
A method according to any preceding claim, wherein said connecting step includes the steps of providing in the polyimide layer a through opening which extends through the polyimide layer, and placing in the opening an electrical conductor which extends through the opening and terminates in electrical contact with the active circuit.
Claim 7
Independent Claim
15 words
A method according to any preceding claim, further comprising providing the wire made from gold.
Claim 8
Independent Claim
78 words
A method of making an integrated circuit, comprising: providing an active circuit; providing a layer of a polyimide material in overlying relationship relative to the active circuit; depositing a plurality of bonding pads on the polyimide layer opposite the active circuit; connecting the bonding pads electrically to the active circuit through the polyimide layer; bonding a plurality of wires respectively to the bonding pads; and molding an encapsulant onto the polyimide layer, the bonding pads and the wires.
Claim 9
Dependent Claim
90 words
An integrated circuit device, comprising: an active circuit; a layer of polyimide material disposed in overlying relationship relative to said active circuit; a plurality of bonding pads deposited on said polyimide layer, said polyimide layer being interposed between said active circuit and said bonding pads, said bonding pads being electrically connected to said active circuit through said polyimide layer, and a plurality of wires for connecting said bonding pads to a lead structure, each said wire having an enlarged bond end which is bonded to a respective said bonding pad.
Claim 10
Dependent Claim
85 words
An integrated circuit according to Claim 9, wherein said polyimide layer has a plurality of through openings therein for permitting electrical connection of said active circuit to the respective bonding pads, and including a plurality of electrical conductors respectively provided in said through openings, said electrical conductors being electrically connected to the respective bonding pads and extending through the respective through openings to terminate in electrical contact with said active circuit, and an encapsulant molded onto said polyimide layer, said bonding pads and said wires.
Claim 11
Dependent Claim
25 words
An integrated circuit according to Claim 9 or Claim 10, wherein said bonding pads are disposed in overlying relationship relative to the respective electrical conductors.
Claim 12
Dependent Claim
26 words
An integrated circuit according to any of Claims 9 to 11, wherein the polyimide layer has a modulus of elasticity of at least approximately 6 GPa.
Claim 13
Dependent Claim
34 words
An integrated circuit according to any of Claims 9 to 12, wherein the polyimide layer has a coefficient of thermal expansion in a range of approximately 3 x 10⁻⁶ to 10 x 10⁻⁶ in/in/°C
Claim 14
Dependent Claim
35 words
An integrated circuit according to any of Claims 9 to 13, wherein the polyimide layer has a thickness in a range of approximately 3 to 6 microns, and has a dielectric constant of approximately 3.
Claim 15
Dependent Claim
40 words
An integrated circuit according to any of Claims 9 to 14, including a protective overcoat layer interposed between said active circuit and said polyimide layer, said overcoat layer being one of a silicon nitride material and a silicon oxide material.
References Cited (Backward Citations)
No citation records indexed.
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