EP0587144A2
Expired / Lapsed
EP
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Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus
Assignee: Seiko Epson Corp
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Filing: 1993-09-08
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Granted: —
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Expires: 2013-09-08
Abstract
Abstract A liquid crystal display apparatus is provided which needs a small, thin and compact area thereof for mounting semiconductor chips for driving liquid crystal and, accordingly, a reduced cost. Semiconductor chips (4) for driving liquid crystal are mounted on the surfaces (the first layers (1)) of multi-layer substrates in a face-down manner, each of the surfaces having input lines (5) to the chips (4) and output lines (8) from the chips. The input lines have lands (7) for connecting the multi-layer substra-tes to each other. At least one intermediate layer (2) is formed between the upper surface (1) and the reverse surface (3), the intermediate layer having bus lines (10). The bus lines and the input lines of the first layer are connected to one another via through holes (6). The output lines of the first layer and the terminals (13) of the third layer are connected to one another via through holes of the first, second and the third layers (9, 11, 12). <IMAGE>
Inventors
- 👤 Kenji c/o Seiko Epson Corporation Uchiyama
- 👤 Eiji C/O Seiko Epson Corporation Muramatsu
- 👤 Masari c/o Seiko Epson Corporation Kamimura
- 👤 Shigetoshi c/o Seiko Epson Corporation Yamada
- 👤 Kenichi c/o Seiko Epson Corporation Maruyama
- 👤 Seiichi c/o Seiko Epson Corporation Sakura
- 👤 Kazuaki c/o Seiko Epson Corporation Furuichi
- 👤 Kinichi c/o Seiko Epson Corporation Maeda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 13:20
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13452; H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W72/00; H10W90/00; H10W90/401; H05; H05K; H05K1/00; H05K1/02; H05K1/0296; H05K1/0298; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/36; H05K3/368; H10W70/682; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W74/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
134 words
A liquid crystal display apparatus comprising a liquid crystal panel having mounted thereon a plurality of semiconductor chips for driving liquid crystal, said liquid crystal display apparatus comprising: at least one multi-layer substrate having at least one of said semiconductor chips mounted thereon and composed of an upper surface having an input line pattern to said at least one chip and an output line pattern from said at least one chip, a reverse surface and at least one intermediate layer formed between said upper surface and said reverse surface, wherein said at least one intermediate layer has a portion of said input lines and/or output lines as a circuit pattern, and said at least one multi-layer substrate having said lines connected to one another via through holes is electrically connected to a panel terminal.
Claim 2
Dependent Claim
21 words
The apparatus according to claim 1, wherein a plurality of semiconductor chips are mounted on said at least one multi-layer substrate.
Claim 3
Dependent Claim
31 words
The apparatus according to claim 1 or 2, wherein face bonding or wire bonding is used as means for mounting said semiconductor chip(s) on the surface of said multi-layer substrate according.
Claim 4
Dependent Claim
30 words
The apparatus according to claim 1, 2 or 3, wherein an anisotropic conductive film is used to electrically connect said output lines of said multi-layer substrate and said panel terminal.
Claim 5
Independent Claim
42 words
The apparatus according to any one of claims 1 to 4 comprising a plurality of said multi-layer substrates, wherein wire bonding, a heat seal connection or a flexible substrate connection is used for establishing electrical connection among said plurality of multi-layer substrates.
Claim 6
Independent Claim
37 words
The apparatus according to any one of claims 1 to 4 comprising a plurality of said multi-layer substrates, wherein lines on said liquid crystal panel are used for establishing electrical connection among said plurality of multi-layer substrates.
Claim 7
Dependent Claim
24 words
The apparatus according to claim 6, wherein said lines are disposed in said panel terminal portion and on the inside of a panel cell.
Claim 8
Dependent Claim
43 words
The apparatus according to claim 6, wherein the connection between said lines on said liquid crystal panel and said input lines of said multi-layer substrate and the connection between said output lines of said multi-layer substrate and said panel terminal are collectively established.
Claim 9
Dependent Claim
16 words
The apparatus according to claim 8, wherein said connection is established by an anisotropic conductive film.
Claim 10
Dependent Claim
38 words
The apparatus according to claim 9, wherein said anisotropic conductive film comprises an adhesive agent layer and conductive particles dispersed therein, the thickness of the adhesive agent layer is smaller than the particle size of the conductive particles.
Claim 11
Dependent Claim
96 words
A liquid crystal display apparatus having a line electrode group and a column electrode portion formed on a display substrate thereof said electrode portions forming a plurality of pixels, and display drive signals are supplied from a semiconductor device to said electrode portions to perform color pixel display, said liquid crystal display apparatus comprising: a laminated substrate having bus lines and connection terminals formed thereon; and semiconductor devices mounted on said laminated substrate, wherein output lines of said semiconductor devices independently provided for each color electrode are connected to electrode terminals extended from said display substrate.
Claim 12
Dependent Claim
19 words
The apparatus according to claim 11, wherein said semiconductor devices are mounted on the surface of said laminated substrate.
Claim 13
Dependent Claim
34 words
The apparatus according to claim 11, wherein said semiconductor devices formed into a rod-like shape and having input and output terminals running in parallel and facing each other are mounted on said laminated substrate.
Claim 14
Dependent Claim
91 words
A structure for mounting a semiconductor device wherein a semiconductor device having an output terminal on at least a main output terminal side thereof and an input terminal on a side thereof facing said main output terminal side is used, and said semiconductor device is mounted on a predetermined pattern of a laminated circuit substrate having at least an output circuit pattern and an input circuit pattern, said structure comprising: a bump formed on a terminal of said laminated substrate, said bump being [electrically and/or mechanically] connected to another electronic device.
Claim 15
Dependent Claim
116 words
A structure for mounting a semiconductor device wherein a semiconductor device having an output terminal on at least a main output terminal side thereof and an input terminal on a side thereof facing said main output terminal side is used, and said semiconductor device is mounted on a predetermined pattern of a laminated circuit substrate having at least an output circuit pattern and an input circuit pattern, said structure comprising: a terminal formed in a side surface portion of said laminated substrate, said terminal used to mount said laminated substrate on an electronic device so that the plane of said laminated substrate and the plane of said electronic device are positioned substantially perpendicularly to one another.
Claim 16
Dependent Claim
25 words
The structure according to claim 15, wherein the connection between said laminated substrate and said electronic device is established by using an anisotropic conductive film.
Claim 17
Dependent Claim
17 words
An electro optical apparatus comprising a structure as defined in any one of claims 14 to 16.
Claim 18
Dependent Claim
17 words
An electronic printing apparatus comprising a structure as defined in any one of claims 14 to 16.
Claim 19
Dependent Claim
110 words
A multi-layer substrate having a semiconductor device mounted thereon, said multi-layer substrate being composed of an upper layer having an input line pattern to said semiconductor device and an output line pattern from said semiconductor device, a lower layer having an output terminal to be connected to an external terminal and at least one intermediate layer formed between said upper layer and said lower layer said at least one intermediate layer having a portion of an input line and/or an output line as a circuit pattern, said lines being connected via through holes, said multi-layer substrate further comprising: an opening portion formed in at least one of said layers .
Claim 20
Dependent Claim
64 words
A method of mounting a semiconductor device on the surface of a multi-layer substrate as defined in claim 19, said method comprising the steps: passing said semiconductor through the opening portion formed in the upper layer of said multi-layer substrate; and mounting said semiconductor on the surface of an intermediate layer adjacent to the upper layer by employing face down bonding or wire bonding.
Claim 21
Dependent Claim
45 words
The method of claim 20, wherein, when a plurality of said multi-layer substrates is provided, bus lines for input signals to said multi-layer substrates are collectively connected by using an FPC, or a PCB substrate having a plurality of opening portions, or by wire bonding.
Claim 22
Dependent Claim
29 words
The apparatus according to claim 1 wherein a projection or a pit is provided in at least a portion of a side of said at least one multi-layer substrate.
Claim 23
Dependent Claim
24 words
The apparatus according to claim 1 wherein an arbitrary one of the plural layers of said multi-layer substrate is smaller than the other layers.
Claim 24
Dependent Claim
20 words
The according to claim 1 wherein said multi-layer substrate has a fastening hole or a fastening cut portion formed therein.
References Cited (Backward Citations)
No citation records indexed.
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