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EP0586069A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Memory module and packing method

Assignee: Samsung Electronics Co Ltd
•
Filing: 1993-07-20
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Granted: —
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Expires: 2013-07-20
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Abstract

Abstract A memory module is disclosed wherein a piercing hole (58) is formed at the predetermined part of a module substrate (54) where a semiconductor package is to be inserted and a first semiconductor package (51) having gull-wing shaped external leads (56) is inserted so that the leads (56) are hung on the side edges of the piercing hole (58). Next, a second semiconductor package (52) is arranged on the external leads (56) of the first semiconductor package (51). Finally, the semiconductor packages are mounted by reflow soldering. Thus, the packing density can be improved as much as about two or three times in the same area and more packages can be mounted without changing the thickness of the memory module, thereby miniaturising the semiconductor device.

Inventors

  • 👤 Kyung Sub Kim
  • 👤 Khee Park

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-23 15:36
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W90/00; H10W70/60

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 77 words
A memory module comprising a module substrate (54) where metal wirings are formed and a plurality (51, 52) of semiconductor packages, characterised by at least one piercing hole (58) formed in said substrate (54); a first semiconductor package (51) located in each said piercing hole (58) and having external leads (56) engaging side edges of said piercing hole (58); and a second semiconductor package (52) mounted on the external leads (56) of said first semiconductor package (51).
Claim 2
Dependent Claim 77 words
A memory module comprising a module substrate (54) where metal wirings are formed and a plurality (51, 52) of semiconductor packages, characterised by at least one piercing hole (58) formed in said substrate (54); a first semiconductor package (51) located in each said piercing hole (58) and having external leads (56) engaging side edges of said piercing hole (58); and a second semiconductor package (52) mounted on the external leads (56) of said first semiconductor package (51).
Claim 3
Dependent Claim 39 words
A memory module as claimed in claim 1, wherein pads connected to the metal wirings are provided at the edges of said piercing hole (58) to be connected with the external leads (56) of said first semiconductor packages (51).

References Cited (Backward Citations)

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