EP0580408A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Excimer laser processing method and apparatus
Assignee: Fujitsu Ltd
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Filing: 1993-07-20
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Granted: —
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Expires: 2013-07-20
Abstract
Abstract An excimer laser ablation processing for forming via holes in a resin film by irradiation of an excimer laser wherein, the emission of light caused during the decomposition of the resin during the processing is detected, its intensity is measured, and the endpoint of the processing is judged or a comparison is made of the positions of light emission and the design positions for processing to examine for the presence of defects. Provision is made of a means for measuring the intensity and a means for judging the endpoint of the processing from the changes in the intensity of light emission during the processing.
Inventors
- 👤 Yasuo Yamagishi
- 👤 Kanae Shimizu
- 👤 Daisuke Mizutani
- 👤 Tamotsu Owada
- 👤 Yoshikatsu Ishizuki
- 👤 Hideya Hashii
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 07:08
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/02; B23K26/03; B23K26/032; B23K26/12; B23K26/123; H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0035; B23K2103/00; B23K2103/30; B23K2103/42; B23K2103/50; H05K1/00; H05K1/02; H05K1/0266; H05K1/0269; H05K2203/00; H05K2203/02; H05K2203/0207; H05K2203/05; H05K2203/0548; H05K2203/056; H05K2203/16; H05K2203/163
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
63 words
An excimer laser ablation processing method for forming via holes in a resin film by irradiation of an excimer laser comprising the steps of: detecting the emission of light caused during the decomposition of the resin during the processing to measure the intensity thereof; and judging the endpoint of the processing from the changes in the intensity of light emission during the processing.
Claim 2
Dependent Claim
48 words
An excimer laser processing method as claimed in claim 1, wherein a mask obtained by selectively patterning a dielectric multilayer film is placed on the resin film, processing is performed by laser light passing through the mask, and the intensity of light emission is measured through the mask.
Claim 3
Dependent Claim
65 words
An excimer laser ablation processing apparatus for forming via holes in a resin film by irradiation of an excimer laser, comprising: a means for detecting the light emission caused during the decomposition of the resin during the processing and measuring the intensity thereof; and a means for judging the endpoint of the processing from the changes in the intensity of light emission during the processing.
Claim 4
Dependent Claim
49 words
An excimer laser processing apparatus as claimed in claim 3, wherein a mask obtained by selectively patterning a dielectric multilayer film is placed on the resin film, the processing is performed by laser light passing through the mask, and the intensity of light emission is measured through the mask.
Claim 5
Dependent Claim
81 words
An excimer laser ablation processing method for forming via holes in a resin film by irradiation of an excimer laser comprising the steps of: detecting the emission of light caused during the decomposition of the resin during the processing is detected; detecting the positions of light emission; comparing the detected positions of light emission and design positions of processing against each other; and using the comparison of the positions of light emission and design positions to inspect the presence of defects.
Claim 6
Dependent Claim
49 words
An excimer laser processing method as claimed in claim 5, wherein a mask obtained by selectively patterning a dielectric multilayer film is placed on the resin film, the processing is performed by laser light passing through the mask, and the intensity of light emission is measured through the mask.
Claim 7
Dependent Claim
28 words
An excimer laser processing method as claimed in claim 5, wherein the resin film is a layer insulation film in a multilayer circuit substrate of an electronic circuit.
Claim 8
Dependent Claim
93 words
An excimer laser ablation processing apparatus for forming via holes in a resin film by irradiation of an excimer laser comprising: a means for taking an image of the light emission caused during the decomposition of the resin during the processing; a means for identifying the positions of light emission; a means for comparing the identified positions of light emission and design positions for formation of the via holes; and a means for using the comparison of the positions of light emission and the design positions to inspect for the presence of defects.
Claim 9
Dependent Claim
49 words
An excimer laser processing apparatus as claimed in claim 8, wherein a mask obtained by selectively patterning a dielectric multilayer film is placed on the resin film, the processing is performed by laser light passing through the mask, and the intensity of light emission is measured through the mask.
Claim 10
Dependent Claim
32 words
An excimer laser processing apparatus as claimed in claim 8, wherein the processing apparatus is an apparatus for forming via holes in an insulating resin forming part of an electronic circuit substrate.
Claim 11
Dependent Claim
43 words
An excimer laser processing apparatus as claimed in claim 9, which has the function of observing the light emission from a specific positions over time and judging the end of processing for that apparatus by the cessation of light emission from that position.
Claim 12
Dependent Claim
38 words
An excimer laser ablation processing method for forming via holes in a resin film by irradiation of an excimer laser comprising: using an oxygen gas atmosphere in the proximity of the surface of a processed material during processing.
References Cited (Backward Citations)
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