EP0575806A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Package for integrated circuit chips
Assignee: International Business Machines Corp
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Filing: 1993-06-07
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Granted: —
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Expires: 2013-06-07
Abstract
Abstract This invention relates to three dimensional packaging of integrated circuit chips (306) into stacks to form cube structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate (300) having a plurality of conductors (316) one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures (318) can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contains solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate (302) surface or the pin-like structures can be adapted for insertion into apertures (320) in a second substrate. The second substrate provides a means for electrically interconnecting a plurality of these cubes. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cube.
Inventors
- 👤 Thomas Mario Cipolla
- 👤 Paul William Coteus
- 👤 Ioannis Damianakis
- 👤 Glen Walden Johnson
- 👤 Linda Carolyn Matthew
- 👤 Lawrence Shungwei Mok
- 👤 Peter Gerard Ledermann
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 21:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; H10; H10W; H10W72/00; H10W90/00; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0397; H05K2201/04; H05K2201/048; H05K2201/09; H05K2201/09145; H05K2201/09172; H05K2201/09818; H05K2201/09909; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10484; H05K2201/1059; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K2201/10954; H05K2201/10984; H05K3/30; H05K3/32; H05K3/325; H05K3/326; H05K3/34; H05K3/3452; H05K3/3465; H05K3/366; H05K3/40; H05K3/4007; H05K3/4092; H10W72/834; H10W90/20; H10W90/284
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
144 words
A structure comprising: at least one first substrate; said at least one first substrate has a first side and a second side; said first side of said at least one first substrate has a plurality of electrical conductors disposed thereon; at least one electronic device is disposed in electrical connection with at least a part of said plurality of said electrical conductors to form at least one assembly; said electrical conductors extend to a first edge of said at least one substrate; said conductors at said edge being substantially linear and free of bends; a second substrate having a plurality of conductors disposed on at least a first side thereof: said conductors at said edge of said at least one first substrate being disposed adjacent to at least a part of said plurality of conductors on said second substrate and being electrically connected thereto.
Claim 2
Dependent Claim
45 words
The structure of claim 1, further including: at least one aperture; said aperture being adapted to receive said edge of said at least one first substrate; and at least a part of said conductors on said second substrate extend to said at least one aperture.
Claim 3
Dependent Claim
15 words
The structure of claim 1, wherein said first substrate is orthogonal to said second substrate.
Claim 4
Dependent Claim
71 words
The structure of claim 1, wherein there are a plurality of said at least one assembly and a plurality of apertures in said second substrate, each of said plurality of apertures are adapted to receive said edge of one of said plurality of first substrates of said at least one assembly, said plurality of apertures are disposed so that each of said assemblies is adjacent another of said plurality of assemblies.
Claim 5
Dependent Claim
30 words
The structure of claim 4, wherein said at least one electronic device of one of said adjacent assemblies is adjacent said second side of the other of said adjacent assemblies.
Claim 6
Dependent Claim
31 words
The structure of claim 5, wherein said at least one electronic device of one of said adjacent assemblies is disposed against said second side of the other of said adjacent assemblies.
Claim 7
Dependent Claim
26 words
The structure of claim 1, wherein said electronic device is selected from the group consisting of semiconductor chips, semiconductor chip modules, decoupling capacitors and packaging substrates.
Claim 8
Dependent Claim
20 words
The structure of claim 7, wherein said semiconductor chips are selected from the group consisting of memory and logic chips.
Claim 9
Dependent Claim
22 words
The structure of claim 1, further including an encapsulant disposed on at least a part of said at least one electronic device.
Claim 10
Dependent Claim
23 words
The structure of claim 1, further including at least one electronic device on said second side of said at least one first substrate.
Claim 11
Dependent Claim
17 words
The structure of claim 1, wherein said at least one first substrate comprises a flexible polymer film.
Claim 12
Dependent Claim
14 words
The structure of claim 1, wherein said second substrate comprises a flexible polymer film.
Claim 13
Dependent Claim
21 words
The structure of claim 1, wherein said second side of said first substrate has an electrical conductor forming a ground plane.
Claim 14
Dependent Claim
24 words
The structure of claim 1, wherein said second substrate has a second side which is disposed adjacent a first side of a resilient layer.
Claim 15
Dependent Claim
20 words
The structure of claim 14, wherein said resilient layer has a second side which is disposed adjacent a third substrate.
Claim 16
Dependent Claim
27 words
The structure of claim 15, wherein said third substrate has electrical contact locations which are electrically connected to portions of said electrical conductors on said second substrate.
Claim 17
Dependent Claim
20 words
The structure of claim 1, further including a heat dissipation means in thermal contact with said at least one assembly.
Claim 18
Dependent Claim
32 words
The structure of claim 1, wherein said electrical conductors in said first substrate are electrically interconnected to electrical contact locations on said at least one electronic device by a plurality of wires.
Claim 19
Dependent Claim
46 words
The structure of claim 1, wherein a portion of said electrical conductors of said first substrate have conductor ends which cantilever over a second edge of said at least one first substrate, said conductor ends being electrically interconnected to electrical contact locations on said electronic device.
Claim 20
Dependent Claim
23 words
The structure of claim 1, wherein said first side of said at least one first substrate is adhesively attached to said electronic device.
Claim 21
Dependent Claim
13 words
The structure of claim 14, wherein said resilient material is an elastomeric material.
Claim 22
Dependent Claim
79 words
The structure of claim 1, wherein at least one of said electrical conductors cantilevers off of said first edge to form a first cantilevered lead, wherein an electrical conductor cantilevers off of said first edge from said second side of said at least one first substrate to form a second cantilevered lead, said first cantilevered lead and said second cantilevered lead being aligned and substantially disposed opposite to each other with a space therebetween to form a lead assembly.
Claim 23
Dependent Claim
14 words
The structure of claim 22, wherein there are a plurality of said lead assemblies.
Claim 24
Dependent Claim
45 words
The structure of claim 22, wherein said space of said lead assembly contains solder which provides said electrical interconnection between a part of said plurality of electrical conductors on said first substrate and a part of said plurality of electrical conductors on said second substrate.
Claim 25
Dependent Claim
39 words
The structure of claim 24, further including at least one aperture in said second substrate; said aperture being adapted to receive said beam lead assemble; and said conductors on said second substrate extend to said at least one aperture.
Claim 26
Dependent Claim
96 words
A structure comprising: a first substrate having a first side, a second side and an edge; a first electrical conductor on said first side; a second electrical conductor on said second side; said first electrical conductor has a portion which cantilevers over said edge as a first cantilevered lead; said second electrical conductor has a portion which cantilevers over said edge as a second cantilevered lead; said first cantilevered lead and said second cantilevered lead being substantially aligned and opposite to each other with a space therebetween forming a lead assembly; and said space contains solder.
Claim 27
Dependent Claim
28 words
The structure of claim 26, further including a second substrate having an electrical conductor thereon, said lead assembly being soldered to said electrical conductor on said second substrate.
Claim 28
Dependent Claim
20 words
The structure of claim 26, wherein said first substrate is in a nonorthogonal arrangement with respect to said second substrate.
Claim 29
Dependent Claim
31 words
The structure of claim 28, wherein said first and said second cantilevered leads have different length to accommodate said nonorthognal arrangement of said first substrate with respect to said second substrate.
Claim 30
Dependent Claim
19 words
The structure of claim 27, further including an aperture in said second substrate adopted to receive said lead assembly.
Claim 31
Dependent Claim
26 words
The structure of claim 1, further including an electrically conductive via between said first side and said second side of said at least one first substrate.
Claim 32
Dependent Claim
11 words
The structure of claim 1, wherein said first substrate is flexible.
Claim 33
Dependent Claim
11 words
The structure of claim 1, wherein said second substrate is flexible.
Claim 34
Dependent Claim
263 words
A structure comprising: a plurality of first substrates; each of said plurality of said first substrates has a first side and a second side; said first side has a plurality of electrical conductors disposed thereon; said second side has a plurality of electrical conductors disposed thereon; at least one electronic devise is disposed in electrical contact with said plurality of electrical conductors on said first side of said first substrate to form a plurality of first assemblies; at least a portion of said plurality of electrical conductors on said first side extend to an edge of said first substrate and cantilever over said edge as a plurality of first cantilevered leads; at least a portion of said plurality of said second electrical conductors disposed on said second side extend to said edge and cantilever over said edge as a plurality of second cantilevered leads; each of said first cantilevered leads is aligned with one of said second cantilevered leads with a space therebetween containing solder to form a plurality of lead assemblies; each of said plurality of first assemblies being disposed adjacent another one of said plurality of first assemblies so that said at least one electronic device of one of said adjacent assemblies is adjacent said second side of the other of said adjacent assemblies; a second substrate having conductors, at least a portion of which extend to a plurality of apertures adapted to receive said plurality of lead assemblies; and each of said plurality of lead assemblies being soldered to electrical conductors on said second substrate which extend to said apertures.
Claim 35
Dependent Claim
70 words
The structure of claim 33, further including: a second side of said second flexible substrate being disposed on a first side of a resilient layer; a second side of said resilient layer being disposed on a third substrate; and said third substrate having a plurality of electrical conductors at least a portion of which are electrically connected to at least a portion of said electrical conductors on said third substrate.
Claim 36
Dependent Claim
21 words
The structure of claim 35, further including a heat dissipation means disposed in thermal contact with each of said first assemblies.
Claim 37
Dependent Claim
14 words
The structure of claim 35 wherein said first and said second substrates are flexible.
Claim 38
Dependent Claim
98 words
A structure comprising: a first substrate having a first side, a second side and an edge; said edge has at least one projection; a first electrical conductor on said first side; a second electrical conductor on said second side; said first electrically conductor has a first portion which extends onto said at least one projection; said second electrical conductor has a second portion which extends onto said at least one projection; said first portion of said first conductor and said second portion of said second conductor being substantially aligned and opposite to each other forming a lead assembly.
Claim 39
Dependent Claim
231 words
A structure comprising: a plurality of first substrates; each of said plurality of said first substrates has a first side, a second side and an edge; said edge has a plurality of projections; said first side has a plurality of electrical conductors disposed thereon; said second side has a plurality of electrical conductors disposed thereon; at least one electronic device is disposed in electrical contact with said plurality of electrical conductors on said first side of said first substrate to form a plurality of first assemblies; at least a portion of said plurality of electrical conductors on said first side extend onto said plurality of projections; at least a portion of said plurality of said second electrical conductors disposed on said second side extend onto said plurality of projections; said plurality of projections comprises a plurality of conductor assemblies; each of said plurality of first assemblies being disposed adjacent another one of said plurality of first assemblies so that said at least one electronic device of one of said adjacent assemblies is adjacent said second side of the other of said adjacent assemblies; a second substrate having conductors on a first side thereof at least a portion of which extend to a plurality of apertures adapted to receive said plurality of conductor assemblies; and each of said plurality of conductor assemblies being electrically connected to said conductors on said second substrate.
Claim 40
Dependent Claim
277 words
A structure comprising: a plurality of first substrates; each of said plurality of said substrates has a first side and a second side; said first side has a plurality of electrical conductors disposed thereon; said second side has a plurality of electrical conductors disposed thereon; at least one electronic device is disposed in electrical contact with said plurality of electrical conductors on said first side of said first substrate to form a plurality of first assemblies; at least a first portion of said plurality of electrical conductors on said first side extend to an edge; at least a second portion of said plurality of said second electrical conductors disposed on said second side extend to said edge; said at least a first portion and said at least a second portion from a plurality of lead assemblies; each of said plurality of first assemblies being disposed adjacent another one of said plurality of first assemblies so that said at least one electronic device of one of said adjacent assemblies is adjacent said second side of the other of said adjacent assemblies; a second substrate having conductors on a first side thereof at least a portion of which extend to a plurality of apertures adapted to receive said plurality of lead assemblies; said lead assemblies being electrically connected to electrical conductors on said second substrate which extend to said apertures; said second substrate having a second side which is disposed adjacent a first side of a resilient layer; a second side of said resilient layer being disposed on a third substrate; and said third substrate has electrical conductors which are electrically interconnected to said conductors on said second substrate.
Claim 41
Dependent Claim
20 words
The structure of claim 40, further including, a heat dissipation means in thermal contact with said plurality of first assemblies.
Claim 42
Dependent Claim
25 words
The structure of claim 15, further including a heat dissipation means pressed into contact with said lead assemblies so that said resilient layer is compressed.
Claim 43
Dependent Claim
23 words
The structure of claim 1, wherein said edge has at least one projection having an electrical conductor on at least one side thereof.
References Cited (Backward Citations)
No citation records indexed.
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