EP0571135A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Hybridized semiconductor pixel detector arrays for use in digital radiography
Assignee: Raytheon Co
•
Filing: 1993-05-13
•
Granted: —
•
Expires: 2013-05-13
Abstract
Abstract A solid state x-ray detector which is a two-dimensional array of individual pixel elements is described. The hybrid semiconductor construction produces detector elements with high spatial resolution (< 30 microns), high sensitivity to the entire x-ray spectrum, and frame rates greater than 1000 Hz. In a biomedical application these arrays provide high quality real time digital radiographic images that are directly coupled to an image processing system for image enhancement and computer aided diagnosis. In an alternative embodiment of the invention, the hybrid construction incorporated into an automated manufacturing process facilitates the real time, nondestructive, x-ray examination of manufactured objects during the production process. Structural defects in inorganic objects under test are identified in real time during the manufacturing process are corrected when feedback signals are generated from the electronic image data generated during the nondestructive test process.
Inventors
- 👤 Timothy C. Collins
- 👤 Stuart Worley
- 👤 Gordon Kramer
- 👤 Douglas W. Wolfe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 05:24
CPC Classifications
G; G01; G01T; G01T1/00; G01T1/29; G01T1/2914; G01T1/2921; G01T1/2928; H; H04; H04N; H04N25/00; H04N25/70; H04N25/79
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
70 words
An non-destructive test system, comprising: at least one source for x-rays; a subject under test exposed to said x-rays said subject operable to selectively absorb said x-rays; a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals; and a processor operable to receive and convert said electrical signals into an electronic image.
Claim 2
Dependent Claim
18 words
The non-destructive test system in Claim 1 wherein said source for x-rays further comprises a high energy tube.
Claim 3
Dependent Claim
16 words
The non-destructive test system in Claim 1 wherein said source for x-rays further comprises Cobalt 60.
Claim 4
Dependent Claim
16 words
The non-destructive test system in Claim 1 wherein said source for x-rays further comprises a synchrotron.
Claim 5
Dependent Claim
16 words
The non-destructive test system in Claim 1 wherein said subject under test is an organic subject.
Claim 6
Dependent Claim
16 words
The non-destructive test system in Claim 1 wherein said subject under test is an in-organic subject.
Claim 7
Dependent Claim
32 words
The non-destructive test system of Claim 1 wherein said hybrid semiconductor pixel array further comprises a detector layer, a readout layer and an interconnect between said detector layer and said readout layer.
Claim 8
Independent Claim
83 words
A method of providing a non-destructive test system, said method comprising the steps of: providing at least one source for x-rays; providing a subject under test exposed to said x-rays said subject operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals; and providing a processor operable to receive and convert said electrical signals into an electronic image.
Claim 9
Independent Claim
76 words
A method of non-destructive testing, said method comprising the steps of: generating x-rays from at least one source; exposing a subject under test to said x-rays, said subject operable to selectively absorb said x-rays; positioning a hybrid semiconductor pixel array proximate said subject under test, said hybrid semiconductor pixel array operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals; and processing said electrical signals into an electronic image.
Claim 10
Dependent Claim
106 words
An automated non-destructive test system, used in a manufacturing process, comprising: at least one source for x-rays; an object under test exposed to said x-rays, said object operable to selectively absorb said x-rays; a hybrid semiconductor pixel array positioned proximate said object under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals; a processor operable to receive and convert said electrical signals into an electronic image; and a comparator operable to compare said electronic image to a stored known image for said object, said comparator further operable to generate a feedback electrical signal into said manufacturing process.
Claim 11
Independent Claim
114 words
A method of providing an automated non-destructive test system to a manufacturing process, comprising: providing at least one source for x-rays; providing an object under test exposed to said x-rays, said object operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said object under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals; providing a processor operable to receive and convert said electrical signals into an electronic image; and providing a comparator operable to compare said electronic image to a stored known image for said object, said comparator further operable to generate a feedback electrical signal into said manufacturing process.
Claim 12
Dependent Claim
115 words
An automated method of non-destructive testing incorporated into a manufacturing process, said method comprising the steps of: generating x-rays; exposing a manufactured object under test to said x-rays, said object operable to selectively absorb said x-rays; positioning a hybrid semiconductor pixel array proximate said object under test, said hybrid semiconductor pixel array operable to receive and convert unabsorbed x-ray photons passing through said object under test into electrical signals; processing said electrical signals into an electronic image; comparing said electronic image to a stored known image of said manufactured object; and revising the manufacturing process in response to the comparison between said manufactured object under test and said stored known image of said manufactured object.
Claim 13
Dependent Claim
80 words
An non-destructive test system for biomedical applications, comprising: at least one source for x-rays; an organic subject under test exposed to said x-rays said subject operable to selectively absorb said x-rays; a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals; and a processor operable to receive and convert said electrical signals into an electronic image of said organic subject under test.
Claim 14
Independent Claim
88 words
A method of providing a non-destructive test system for biomedical applications, comprising: providing at least one source for x-rays; providing an organic subject under test exposed to said x-rays said subject operable to selectively absorb said x-rays; providing a hybrid semiconductor pixel array positioned proximate said subject under test operable to receive and convert unabsorbed x-ray photons passing through said subject under test into electrical signals; and providing a processor operable to receive and convert said electrical signals into an electronic image of said organic subject under test.
References Cited (Backward Citations)
US4803363A
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.