EP0569166A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Gold-tin solder suitable for self-aligning applications
Assignee: AT&T Inc
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Filing: 1993-04-22
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Granted: —
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Expires: 2013-04-22
Abstract
Abstract A tin-rich gold-tin solder is disclosed which is particularly advantageous for self-aligning applications. When utilized with gold-plated bond locations, the out-diffusion of tin from the solder during heating functions to shift the composition of the remaining solder closer to the eutectic value, thus preserving the liquid state of the solder and improving its reflow quality with respect to conventional eutectic solders.
Inventors
- 👤 Mindaugas Fernand Dautartas
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-24 05:34
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/30; B23K35/3013; B23K2101/00; B23K2101/34; B23K2103/00; B23K2103/08; B23K2103/50; B23K2103/56; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3465
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
87 words
A method of soldering a first component to a second component, the method comprising providing a first component (10) and a second componment (14), each component including a surface layer of gold (12,16); CHARACTERISED BY disposing a Au/Sn solder (18) of the composition Au 80-x Sn 20+x , 0<x≦6, between the gold surface layers; contacting the first and second components such that the Au/Sn solder is in physical contact with both gold surface layers; and heating the combination to a temperature sufficient to liquify the Au/Sn solder.
Claim 2
Dependent Claim
11 words
The method of claim 1 wherein in performing step b), 2<x≦4.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein in performing step d), the combination is heated to a temperature in excess of 280°C.
References Cited (Backward Citations)
DE1167162B
Cited
FR1320523A
Cited
US3660632A
Cited
US4214904A
Cited
EP0114952A1
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US4875617A
Cited
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