EP0566043A2
Expired / Lapsed
EP
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Method of producing boards for printed wiring
Assignee: Resonac Corp
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Filing: 1993-04-08
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Granted: —
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Expires: 2013-04-08
Abstract
Abstract A board for printed wiring is produced by disposing a metal foil (4) in a plate-shaped cavity (3) of a mold so that the metal foil (4) is in contact with at least one internal surface of the cavity (3), injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic filler into the cavity and curing the epoxy resin. The molding material contains 50 to 90 % by volume of the powdery inorganic filler based on the total of the molding material.
Inventors
- 👤 Hiroyuki Kuriya
- 👤 Shinsuke Hagiwara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 18:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; B; B29; B29C; B29C45/00; B29C45/0013; B29C45/14; B29C45/14467; B29C67/00; B29C67/24; B29C67/242; B29C67/243; B29C70/00; B29C70/58; B29C70/60; B29C70/606; C; C04; C04B; C04B35/00; C04B35/622; C04B35/626; C04B35/63; C04B35/632; C04B35/634; C04B35/63448; C04B35/63472; C04B35/63476; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K1/05; H05K1/056; H05K3/0011; H05K3/0014; B29C2045/14532; B29K; B29K2063/00; B29K2503/00; B29K2503/04; B29K2503/06; H05K1/0306; H05K1/036; H05K1/16; H05K1/162; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2203/00; H05K2203/13; H05K2203/1305; H05K2203/1327; H05K3/02; H05K3/022; H05K3/025
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
189 words
A method of producing a board for printed wiring, comprising disposing a metal foil (4) in a plate-shaped cavity (3) of a mold (1, 2) so that the metal foil (4) is in contact with at least one internal surface of the cavity (3), injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic filler into the cavity (3) and curing the epoxy resin, the molding material containing 50 to 90 % by volume of the powdery inorganic filler based on the total of the molding material, and the powdery inorganic filler being a silica powder, a cordierite powder, an alumina powder, an aluminum nitride powder, a silicon nitride powder, a boron nitride powder, a silicon carbide powder, a boron carbide powder, a beryllia powder, a titanium dioxide powder, a barium titanate powder, a calcium titanate powder, a strontium titanate powder, a lead titanate powder, a barium zirconate powder, a calcium zirconate powder, a barium stannate powder, a calcium stannate powder, and/or a burned powder of a material of a ceramic capacitor, the burned powder having a relative dielectric constant of at least 300.
Claim 2
Dependent Claim
24 words
The method of claim 1, wherein the epoxy resin has a melt viscosity of not more than 3 poise, as measured at 150 °C.
Claim 3
Dependent Claim
17 words
The method of claim 2, wherein the epoxy resin is a diglycidyl ether of an alkyl-substituted biphenol.
Claim 4
Independent Claim
23 words
The method of any one of claims 1 to 3, wherein the hardening agent is a novolak phenolic resin or a phenolaralkyl resin.
Claim 5
Independent Claim
39 words
The method of any one of claims 1 to 4, wherein before the injection of the molding material in the cavity (3), at least one metal plate (6), preferably a copper plate, is further disposed in the cavity (3).
Claim 6
Dependent Claim
19 words
The method of claim 5, wherein the metal plate (6) is partially or wholly covered with a ceramic coating.
Claim 7
Dependent Claim
19 words
The method of claim 6, wherein the ceramic coating is a 10 to 300 µm thick ceramic flame-sprayed coating.
Claim 8
Dependent Claim
32 words
The method of claim 7, wherein the ceramic flame-sprayed coating is formed by coating the metal plate with nickel and flame-spraying an alumina ceramic or a cordierite ceramic on the nickel coating.
Claim 9
Independent Claim
35 words
The method of any one of claims 1 to 4, wherein before the injection of the molding material into the cavity (3), at least one ceramic plate (6') is further disposed in the cavity (3).
Claim 10
Dependent Claim
44 words
The method of claim 9, wherein the ceramic plate (6') is an alumina ceramic plate, an aluminum nitride ceramic plate, a silicon-nitride ceramic plate, a boron nitride ceramic plate, a silicon carbide ceramic plate, a boron carbide ceramic plate or a beryllia ceramic plate.
Claim 11
Independent Claim
26 words
The method of any one of claims 6 to 10, wherein the ceramic is an alumina ceramic, and the powdery inorganic filler is an alumina powder.
Claim 12
Independent Claim
34 words
The method of any one of claims 1 to 4, wherein before the injection of the molding material into the cavity (3), a printed wiring board (8) is further disposed in the cavity (3).
Claim 13
Dependent Claim
27 words
The method of claim 12, wherein the printed wiring board (8) is a glass-epoxy resin double-sided wiring board and the powdery inorganic filler is an alumina powder.
References Cited (Backward Citations)
No citation records indexed.
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