EP0564019A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Multilayer thermoplastic electronic package and method of making same
Assignee: International Business Machines Corp
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Filing: 1993-03-08
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Granted: —
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Expires: 2013-03-08
Abstract
Abstract A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets (10) formed by injection, compression or other suitable molding techniques. Metal pieces to form vias (12) of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets. <IMAGE>
Inventors
- 👤 Arthur Bross
- 👤 Robert Otis Lussow
- 👤 Thomas J. Walsh
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 07:16
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4632; H05K3/4614; H05K3/4617; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W70/69; H10W70/695; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/0141; H05K2201/10; H05K2201/10227; H05K2201/10234; H05K2201/10378; H05K2201/10416; H05K3/22; H05K3/28; H05K3/40; H05K3/4038; H05K3/4046; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
87 words
A method for forming a multilayer microelectronic wiring module, comprising the steps: forming a plurality of thermoplastic polymer sheets with conductive vias embedded therein; forming a conductive wiring pattern on at least certain ones of said plurality of thermoplastic polymer sheets; stacking said plurality of thermoplastic polymer sheets with said vias in at least certain sheets aligned with vias in an adjacent sheet; applying heat or pressure or both heat and pressure to said stacked thermoplastic polymer sheets to bond said sheets into a microelectronic wiring module.
Claim 2
Independent Claim
98 words
A method for forming a multilayer microelectronic wiring module, comprising the steps: forming a plurality of thermoplastic polymer sheets by a molding process with conductive vias molded in situ in each sheet; forming a conductive wiring pattern on at least certain ones of said plurality of thermoplastic polymer sheets; stacking said plurality of thermoplastic polymer sheets with vias in one thermoplastic polymer sheet aligned with vias in an adjacent thermoplastic polymer sheet; applying heat or pressure or heat and pressure to said stacked thermoplastic polymer sheets to bond said sheets and said vias into a microelectronic wiring module.
Claim 3
Dependent Claim
25 words
A method for forming a multilayer microelectronic wiring module as in claim 1, wherein said thermoplastic polymer sheet is a thermoplastic liquid crystal polymer sheet.
Claim 4
Independent Claim
45 words
A method for forming a multilayer microelectronic wiring module as in any of the preceding claims, wherein said thermoplastic liquid crystal polymer in each sheet has a flow direction along an axis and said flow direction in two adjacent sheets are aligned along different axes.
Claim 5
Independent Claim
27 words
A method for forming a multilayer microelectronic wiring module as in any of the preceding claims, wherein said flow direction along an axis forms an irregular pattern.
Claim 6
Independent Claim
29 words
A method for forming a multilayer microelectronic wiring module as in any of the preceding claims, wherein aligned vias are bonded together by compression bonding, or by reflow soldering.
Claim 7
Dependent Claim
89 words
A multilayer electronic wiring module comprising in combination: a plurality of thermoplastic polymer sheets with conductive vias embedded therein; at least certain ones of said plurality of thermoplastic polymer sheets having a wiring pattern formed on a surface thereof; said plurality of thermoplastic polymer sheets being bonded together by an application of heat or pressure or both heat and pressure to form a wiring module with certain of said conductive vias in one thermoplastic polymer sheet joined to certain of said conductive vias in an adjacent thermoplastic polymer sheet.
Claim 8
Dependent Claim
86 words
A multilayer electronic wiring module comprising in combination: a plurality of molded thermoplastic polymer sheets with conductive vias molded in situ in each sheet; at least some of said plurality of thermoplastic polymer sheets having a wiring pattern formed on a surface thereof; said thermoplastic polymer sheets being bonded together by an application of heat or pressure or heat and pressure to form a wiring module with certain of said conductive vias in one sheet bonded to certain of said conductive vias in an adjacent sheet.
Claim 9
Dependent Claim
24 words
A multilayer microelectronic wiring module as in any of the predecing claims, wherein said thermoplastic polymer sheet is a thermoplastic liquid crystal polymer sheet.
Claim 10
Dependent Claim
41 words
A multilayer microelectronic wiring module as in any of the preceding claims, wherein said thermoplastic liquid crystal polymer in each sheet has a flow direction along an axis and said flow direction in two adjacent sheets are aligned along different axes.
Claim 11
Dependent Claim
23 words
A multilayer microelectronic wiring module as in any of the preceding claims, wherein said flow direction along an axis forms an irregular pattern.
Claim 12
Dependent Claim
25 words
A multilayer electronic wiring module as in any of the preceding claims, wherein aligned vias are bonded together by compression bonding, or by reflow soldering.
References Cited (Backward Citations)
No citation records indexed.
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