EP0560072A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Anisotropic electrically conductive adhesive film and connection structure using the same
Assignee: Nitto Denko Corp
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Filing: 1993-02-11
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Granted: —
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Expires: 2013-02-11
Abstract
Abstract An anisotropic electrically conductive adhesive film (1) having fine through holes (2) independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the end portions of the each through hole on the front and back surfaces of said film being blocked with a bump-form metal projection (4) having a larger base area than the area of the opening portion of the through hole, wherein the insulating film comprises a thermoplastic polyimide resin having a melt viscosity at 400°C of not higher than 1×10⁸ poise is disclosed. The film is interposed between materials to be connected to provide a connection structure.
Inventors
- 👤 Kazumi C/O Nitto Denko Corporation Higashi
- 👤 Amane C/O Nitto Denko Corporation Mochizuki
- 👤 Masako c/o Nitto Denko Corporation Maeda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 04:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/09; H05K2201/09818; H05K2201/09945; H05K2201/10; H05K2201/10227; H05K2201/10378; H10W72/00; H10W72/071; H10W72/073
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
89 words
An anisotropic electrically conductive adhesive film having fine through holes independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the end portions of the each through hole on the front and back surfaces of said film being blocked with a bump-form metal projection having a larger base area than the area of the opening portion of the through hole, wherein the insulating film comprises a thermoplastic polyimide resin having a melt viscosity at 400°C of not higher than 1×10⁸ poise.
Claim 2
Dependent Claim
22 words
The anisotropic electrically conductive adhesive film of claim 1, wherein the fine through holes are formed by irradiation of a laser light.
Claim 3
Dependent Claim
30 words
The anisotropic electrically conductive adhesive film of claim 1, wherein the base area of the bump-form metal projections is larger than 1.1 times the plane area of the through holes.
Claim 4
Dependent Claim
26 words
The anisotropic electrically conductive adhesive film of claim 1, wherein the plane area of the through holes is larger than (the thickness of the insulating film)².
Claim 5
Dependent Claim
24 words
The anisotropic electrically conductive adhesive film of claim 1, wherein the melt viscosity of the thermoplastic polyimide resin is from 1×10³ to 1×10⁷ poise.
Claim 6
Dependent Claim
24 words
The anisotropic electrically conductive adhesive film of claim 1, wherein the glass transition temperature of the thermoplastic polyimide resin is at least 475 K.
Claim 7
Dependent Claim
33 words
A connection structure comprising the anisotropic electrically conductive adhesive film of claim 1 and materials to be connected, wherein said anisotropic electrically conductive adhesive film is interposed between the materials to be connected.
Claim 8
Dependent Claim
33 words
The connection structure of claim 7, wherein the materials to be connected are selected from flexible printed substrates, external circuit substrates, semiconductor elements, multilayer circuit substrates, multi-tip modules, electronic parts, and leading frames.
Claim 9
Dependent Claim
95 words
An anisotropic electrically conductive adhesive film having fine through holes independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the portions of the each through hole on the front and back surfaces of said film being blocked with a bump-form metal projection having a larger base area than the area of the opening of the through hole, wherein a thermoplastic polyimide resin layer having a melt viscosity at 400°C of not higher than 1×10⁸ poise is formed on at least one surface of the insulating film.
Claim 10
Dependent Claim
22 words
The anisotropic electrically conductive adhesive film of claim 9, wherein the fine through holes are formed by irradiation of a laser light.
Claim 11
Dependent Claim
30 words
The anisotropic electrically conductive adhesive film of claim 9, wherein the base area of the bump-form metal projection is larger than 1.1 times the plane area of the through holes.
Claim 12
Dependent Claim
26 words
The anisotropic electrically conductive adhesive film of claim 9, wherein the plane area of the through holes is larger than (the thickness of the insulating film)².
Claim 13
Dependent Claim
24 words
The anisotropic electrically conductive adhesive film of claim 9, wherein the melt viscosity of the thermoplastic polyimide resin is from 1×10³ to 1×10⁷ poise.
Claim 14
Dependent Claim
24 words
The anisotropic electrically conductive adhesive film of claim 9, wherein the glass transition temperature of the thermoplastic polyimide resin is at least 475 K.
Claim 15
Dependent Claim
33 words
A connection structure comprising the anisotropic electrically conductive adhesive film of claim 9 and materials to be connected, wherein the anisotropic electrically conductive adhesive film is interposed between the materials to be connected.
Claim 16
Dependent Claim
33 words
The connection structure of claim 15, wherein the materials to be connected are selected from flexible printed substrates, external circuit substrates, semiconductor elements, multilayer circuit substrates, multi-tip modules, electronic parts, and leading frames.
References Cited (Backward Citations)
No citation records indexed.
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