Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
72 words
An VDMOS transistor comprising at least a matrix of source cells a dielectric, field-isolation, layer alongside said matrix and a field-plate structure overlying an edge portion of said field-isolation layer facing peripheral cells of said matrix of source cells, characterized by comprising a field-isolation diffusion under said dielectric field-isolation layer, along the edge facing said peripheral cells and an electrical connection between said field-isolation diffusion and a source region of the transistor.
Claim 2
Dependent Claim
34 words
A VDMOS transistor as defined in claim 1, wherein said electrical connection is constituted by a projection of a body region of at least one of said peripheral cells that intersects said field-isolation diffusion.
Claim 3
Dependent Claim
35 words
A VDMOS transistor as defined in claim 1, characterized by comprising a plurality of alternated matrices of source cells and drain-connection diffusions separated by a strip of said dielectric field-isolation layer forming an inter-digitated structure.
Claim 4
Dependent Claim
26 words
A VDMOS transistor as defined in claim 1, characterized by being an n-channel transistor, having P-body regions formed in an epitaxial layer having an N-type conductivity.
Claim 5
Dependent Claim
46 words
A VDMOS transistor as defined in claim 4, wherein a P-body region of at least a peripheral source cell facing the edge of said dielectric field-isolation layer overlying a P-field isolation diffusion, extends as far as intersecting said P-field isolation diffusion for establishing said electrical connection.
Claim 6
Dependent Claim
124 words
An integrated VDMOS transistor comprising at least a matrix of source cells and a drain-connection diffusion, a field-isolation diffusion, under a strip of a field-isolation dielectric layer separating said matrix of cells from said drain-connection diffusion and a biplanar field-plate overlaying an edge portion of said dielectric field-isolation layer facing peripheral cells of said matrix, and wherein said field-isolation diffusion under said edge portion of the dielectric field-isolation layer, topped by said field-plate, is electrically connected to a source region of the transistor through a projection of a body region of at least one of said peripheral source cells of said matrix extending toward the edge of said dielectric field-isolation layer and intersecting said field-isolation diffusion present under the edge of said field-isolation layer.
Claim 7
Independent Claim
54 words
A method for increasing the breakdown voltage of a VDMOS transistor comprising at least a matrix of source cells and a dielectric field-isolation layer characterized by the fact that comprises forming a field-isolation diffusion under said field-isolation layer and tying the electrical potential of said field-isolation diffusion to the source potential of the transistor.
Claim 8
Independent Claim
58 words
A method for increasing the breakdown voltage of an integrated VDMOS transistor comprising at least a matrix of source cells and a drain-connection diffusion, separated by a strip of dielectric field-isolation layer and which comprises forming a field-isolation diffusion under said strip of field-isolation layer and electrically connecting said field-isolation diffusion to a source region of the transistor.
Claim 9
Independent Claim
51 words
A method for increasing the breakdown voltage of an integrated VDMOS transistor comprising at least a matrix of source cells and a dielectric field-isolation layer formed over a field-isolation diffusion, characterized by the fact that comprises tying the electrical potential of said field-isolation diffusion to the source potential of the transistor.