EP0538019A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Lead frame for a semiconductor device
Assignee: Shinko Electric Industries Co Ltd
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Filing: 1992-10-14
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Granted: —
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Expires: 2012-10-14
Abstract
Abstract A lead frame (10) for a semiconductor device has good corrosion resistance characteristics and is easily made at a low cost. Such a lead frame (10) comprises a base material (11) made of iron or a metal consisting essentially of iron; a copper or copper alloy plated layer (12) formed on the base material (11); a nickel, cobalt, or nickel-cobalt alloy plated layer (14) formed on the copper or copper-alloy layer (12); and a precious metal plated layer (16) having a thickness of not more than 1 µm formed on the layer (14).
Inventors
- 👤 Akihiko c/o SHINKO ELECTRIC IND. CO. LTD. Murata
- 👤 Norio c/o SHINKO ELEC. IND. CO. LTD. Wakabayashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 18:25
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/457; H10W70/451; H10W72/00; H10W72/071; H10W72/075; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
94 words
A lead frame (10) adapted to be used for a semiconductor device comprising: a lead frame base material (11) made of iron or a metal consisting essentially of iron; a first plated layer (12) made of copper or copper alloy formed on said lead frame base material (11); a second plated layer (14) made of nickel, cobalt, or nickel-cobalt alloy layer formed on said first plated layer (12); and a third plated layer (16) made of precious metal having a thickness of not more than 1 µm formed on said second plated layer (14).
Claim 2
Dependent Claim
30 words
A lead frame according to claim 1, wherein said first (12), second (14) and third (16)plated layers are formed on the entire surfaces of said lead frame base material (11).
Claim 3
Dependent Claim
19 words
A lead frame according to claim 1 or 2, wherein said precious metal plated layer is made of palladium.
Claim 4
Dependent Claim
22 words
A lead frame according to claim 2, wherein said palladium metal plated layer has a thickness of not more than 0.1 µm.
References Cited (Backward Citations)
No citation records indexed.
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