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EP0532160A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Card grounding system

Assignee: ITT Manufacturing Enterprises LLC
•
Filing: 1992-07-02
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Granted: —
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Expires: 2012-07-02
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Abstract

Abstract An IC memory card (10, Figure 2) is insertable into a slot (12) of an electronic device (14), and any static electric charge on the card is discharged. The card frame can be constructed of moulded electrically conductive material forming at least part of the conductive region.

Inventors

  • 👤 Carl Curtiss Perkins

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-03 07:25
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07735; G06K13/00; G06K13/02; G06K13/07; G06K13/077; G06K19/07743; Y; Y10; Y10S; Y10S439/00; Y10S439/946

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 118 words
An IC card characterised by a frame having opposite sides and front and rear ends and including a body with upper and lower surfaces and top and bottom conductive covers that lie respectively over the body upper and lower surfaces and that each has a peripheral cover portion, by a circuit board assembly mounted to the frame, the circuit board assembly including a board and at least one circuit component mounted on the board, the board assembly having a ground plane and characterised in that the board has a peripheral board portion, and the ground plane includes a peripheral ground plane portion lying at the board peripheral portion and engaging at least one of the cover peripheral portions.
Claim 2
Dependent Claim 80 words
An IC card as claimed in claim 1, characterised in that the body has a peripheral portion that has electrically conductive upper and lower surfaces that are connected together, in that at least a part of the ground plane has interconnected portions lying on opposite faces of the board at the board peripheral portion and in that the ground plane part is sandwiched between one of the conductive body surfaces and the peripheral cover portion of one of the covers.
Claim 3
Dependent Claim 50 words
An IC card as claimed in claim 1, characterised in that at least one of the covers has a primarily horizontally extending face and has an edge portion forming the peripheral portion of the cover and bent to extend largely vertically, the cover edge baring against the ground plane portion.
Claim 4
Dependent Claim 57 words
An IC card as claimed in claim 1, characterised in that the card frame includes a body of moulded electrically conductive material forming opposite side edges of the card, with at least one of the side edges of the body sandwiched between the ground plane of the board assembly and the other of the cover peripheral portions.
Claim 5
Dependent Claim 178 words
An IC card which includes a frame having opposite sides and forward and rearward ends, and a circuit board assembly which lies in the frame and which includes a board having a ground plane and a plurality of circuit components mounted on the board, the card being constructed to be inserted into a slot of an electronic device until card contacts at the front end of the card mate with device contacts in the device, characterised in that the IC card includes electrically conductive upper and lower covers, each having a peripheral portion, in that at least a portion of the frame is electrically conductive so the frame has conductive and electrically connected upper and lower surface portions in that the peripheral portion of a first of the covers engages a first of the conductive surface portions and in that the board ground plane engages a second of the conductive surface portions, and the peripheral portion of a second of the covers engages the board ground plane to electrically connect both of the covers to the ground plane.
Claim 6
Dependent Claim 69 words
An IC card as claimed in claim 5, characterised in that the frame is moulded as an electrically conductive material forming the upper and lower surface portions, and the circuit board includes a highly conductive material which is at least one order of magnitude more conductive than the frame moulded material and which forms the ground plane and which bears against the frame and the second cover peripheral portion.

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