Patent FR874663A successfully refreshed from Google Patents.
EP0532015A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of establishing soldered connections
Assignee: Verizon Laboratories Inc
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Filing: 1992-09-10
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Granted: —
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Expires: 2012-09-10
Abstract
Abstract A method of connecting a component (21) with regions of selective metallization to a reference surface (25) comprises the steps of forming a desired pattern of wettable metal pads (10,11,12) on the reference surface (25), depositing solder (13) on each of the pads (10,11,12), and rigidly positioning the component (21) on the reference surface (25). When the solder (13) is heated, each of the solder patterns (27) reflows and contacts a respective region of metallization on the component (21) without movement of either the component (21) or the reference surface (25).
Inventors
- 👤 Thomas W. Fitzgerald
- 👤 Jagannath Chirravuri
- 👤 Marvin Tabasky
- 👤 Vincent J. Barry
- 👤 Victor J. Cataldo
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 21:57
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4219; G02B6/4228; G02B6/4232; H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/0235; H01S5/02375; H01S5/02355; H01S5/0237; H01S5/40; H01S5/4025; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
70 words
A method of connecting a component with regions of selective metallization to a reference surface, comprising the steps of: forming a desired pattern of solder-wettable metal pads on said reference surface; depositing solder on each of said pads; integrating said component with said surface in a fixed, rigid position; and sufficiently heating said solder to reflow and contact respective regions of selective metallization to form electrical connections with said pads.
Claim 2
Dependent Claim
25 words
The method as recited in claim 1 wherein the formation of said electrical connections occurs without movement of either said component or said reference surface.
Claim 3
Dependent Claim
33 words
The method as recited in claim 2 wherein said component includes a plurality of active regions; and said reference surface is integrated with an optoelectronic device having a plurality of optical receiving elements.
Claim 4
Dependent Claim
27 words
The method as recited in claim 3 wherein the active regions of said rigidly positioned component are in optical communication with receiving elements of said optoelectronic device.
Claim 5
Dependent Claim
77 words
The method as recited in claim 4 wherein the step of rigidly positioning said component on said surface includes the step of: abutting a front face of said component with contact surfaces of two front pedestals formed at respective locations on said reference surface; and abutting a sidewall of a mating channel formed in a lateral area of said component to a contact surface of a side pedestal formed at a respective location on said reference surface.
Claim 6
Independent Claim
74 words
A method of connecting a component with regions of selective metallization to a reference surface having a pattern of wettable metal pads each associated with a corresponding region of selective metallization, comprising the steps of: depositing solder on each of said pads; integrating said component with said surface in a fixed, rigid position; and sufficiently heating said solder to reflow and contact corresponding regions of selective metallization to form electrical connections with said pads.
Claim 7
Dependent Claim
25 words
The method as recited in claim 7 wherein the formation of said electrical connections occurs without movement of either said component or said reference surface.
References Cited (Backward Citations)
No citation records indexed.
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