EP0510860A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Molded optical packaging arrangement
Assignee: AT&T Inc
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Filing: 1992-04-14
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Granted: —
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Expires: 2012-04-14
Abstract
Abstract An optical communication arrangement is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe (12) is utilized for the placement and connection of the required electronic circuitry (24). A first molding operation is then performed to encapsulate (30) the electronics. If necessary, a metallic plate may then be attached to the housed electronics to provide EMI shielding. An optical device (44) is then coupled to the leadframe, where a separate subassembly may be used to house the optical device. The encapsulated electronics and optics are then simultaneously covered during a second molding operation to form the final package (52). In one embodiment, an optical subassembly incorporating a connector receptacle (54) may be utilized, where the second molding operation is performed such that the connector receptacle remains exposed. Alternatively, the molded outer package may be configured to include the connector receptacle.
Inventors
- 👤 Muvaffak Sabri Acarlar
- 👤 Louis Thomas Manzione
- 👤 Steven David Robinson
- 👤 Dennis Stefanik
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 07:27
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4274; G02B6/4277; G02B6/4246; G02B6/4251; G02B6/4253; G02B6/4255; G02B6/4292; H; H10; H10W; H10W90/00
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
95 words
An optical communication arrangement comprising: a semiconductor optical device (44); and electronic circuitry (24), required for the operation of said semiconductor optical device; CHARACTERISED IN THAT the arrangement further comprises a leadframe section (12) attached to the electronic circuitry; first molded packaging (30) disposed to encapsulate said electronic circuitry and further comprising a molded support member (36); an optical base member (42) for supporting said semiconductor optical device and disposed to rest upon the molded support member; and second molded packaging (52) disposed to cover both the encapsulated electronic circuitry and the optical base member.
Claim 2
Dependent Claim
95 words
An optical communication arrangement comprising: a semiconductor optical device (44); and electronic circuitry (24), required for the operation of said semiconductor optical device; CHARACTERISED IN THAT the arrangement further comprises a leadframe section (12) attached to the electronic circuitry; first molded packaging (30) disposed to encapsulate said electronic circuitry and further comprising a molded support member (36); an optical base member (42) for supporting said semiconductor optical device and disposed to rest upon the molded support member; and second molded packaging (52) disposed to cover both the encapsulated electronic circuitry and the optical base member.
Claim 3
Dependent Claim
41 words
An optical arrangement as defined in claim 1, wherein the arrangement further comprises connector receptacle means (54) for facilitating attachment of an optical fiber to said arrangement, an optical device optionally being directly attached and electrically coupled to the leadframe section.
Claim 4
Dependent Claim
68 words
An arrangement as defined in claim 2, wherein the outer molded packaging is formed to include the connector receptacle means and the base member of the optical means remains substantially embedded with said second molded packaging, and/or the optical means base member is formed to include the connector receptacle and the second molded packaging is formed such that the connector receptacle portion of said base member remains exposed.
Claim 5
Dependent Claim
47 words
An arrangement as defined in claim 1, wherein optical means comprises an optical subassembly including a mounting member (46) for supporting said active optical device, said base member aligned with said mounting member, or the optical device comprises an optical transmitting device or an optical receiving device.
Claim 6
Dependent Claim
29 words
An arrangement as defined in claim 1, wherein the arrangement further comprises EMI shielding means (110) disposed over the first molded packaging and electrically coupled to the leadframe section.
Claim 7
Dependent Claim
25 words
An arrangement as defined in claim 1, wherein the first and second molded packaging comprise a plastic material, the latter optionally, being a transfer-molded plastic.
Claim 8
Dependent Claim
203 words
An optical communication arrangement for use with a pair of active optical devices, the arrangement comprising: a leadframe section (12); first electronic circuitry (98), required for the operation of a first optical device, attached to said leadframe section; second electronic circuitry (108), required for the operation of a second optical device, attached to said leadframe section in a location physically separate from said first electronic circuitry; first molded packaging for encapsulating said first electronic circuitry and including a first molded support member (96); second molded packaging for encapsulating said second electronic circuitry and including a second molded support member (106); first optical means (92), including an active semiconductor optical device, coupled to said first encapsulated electronic circuitry and including a first base member (94) disposed to rest upon the first molded support member; second optical means (102), including an active semiconductor optical device, coupled to said second encapsulated electronic circuitry and including a second base member (104) disposed to rest upon the second molded support member; and third molded packaging (120) disposed to cover the first and second molded packaging and the first and second optical means, the third molded packaging optionally being formed to include the first and second connector receptacle means.
Claim 9
Dependent Claim
203 words
An optical communication arrangement for use with a pair of active optical devices, the arrangement comprising: a leadframe section (12); first electronic circuitry (98), required for the operation of a first optical device, attached to said leadframe section; second electronic circuitry (108), required for the operation of a second optical device, attached to said leadframe section in a location physically separate from said first electronic circuitry; first molded packaging for encapsulating said first electronic circuitry and including a first molded support member (96); second molded packaging for encapsulating said second electronic circuitry and including a second molded support member (106); first optical means (92), including an active semiconductor optical device, coupled to said first encapsulated electronic circuitry and including a first base member (94) disposed to rest upon the first molded support member; second optical means (102), including an active semiconductor optical device, coupled to said second encapsulated electronic circuitry and including a second base member (104) disposed to rest upon the second molded support member; and third molded packaging (120) disposed to cover the first and second molded packaging and the first and second optical means, the third molded packaging optionally being formed to include the first and second connector receptacle means.
Claim 10
Dependent Claim
43 words
An arrangement as defined in claim 7. wherein the arrangement further comprises first connector receptacle means for facilitating attachment of a first optical fiber to said arrangement; and second connector receptacle means for facilitating attachment of a second optical fiber to said arrangement.
Claim 11
Dependent Claim
99 words
An arrangement as defined in claim 7, wherein the first optical means base member is formed to include the first connector receptacle means; and the second optical means base member is formed to include the second connector receptacle means, wherein the third molded packaging is formed such that the connector receptacle portions of the first and second base members remain exposed, the first and second optical means optionally each including an optical transmitting device, or an optical receiving device, or the first optical means includes an optical transmitting device and the second optical means includes an optical receiving device.
Claim 12
Dependent Claim
21 words
An arrangement as defined in claim 9, wherein the arrangement further comprises EMI shielding means disposed over the second molded packaging.
Claim 13
Dependent Claim
26 words
An arrangement as defined in claim 7, wherein the first, second and third molded packaging comprise a plastic material, the latter optionally being a transfer-molded plastic.
References Cited (Backward Citations)
No citation records indexed.
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