EP0510859A2
Expired / Lapsed
EP
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Molded optical package utilizing leadframe technology
Assignee: AT&T Inc
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Filing: 1992-04-14
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Granted: —
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Expires: 2012-04-14
Abstract
Abstract An optical communication arrangement and method is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe (20) is utilized for the placement and connection of the required electronic circuitry (24). An optical device (32) is also coupled to the leadframe, where a subassembly may be used to house the optical device. The electronics and optics are then simultaneously encapsulated in a molded outer package (50) to form the final arrangement. In one embodiment, an optical subassembly incorporating a fiber optic connector receptacle (52) may be utilized, wherein the molded outer package is configured such that the connector receptacle remains exposed. Alternatively, the molded outer package may be configured to include the connector receptacle.
Inventors
- 👤 Muvaffak Sabri Acarlar
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 06:46
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4292; G02B6/4201; G02B6/4204; G02B6/4219; G02B6/4236; G02B6/4245; G02B6/4246; G02B6/4255; G02B6/4274; G02B6/4277
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
69 words
An optical communication arrangement comprising at least one semiconductor optical device (32); electronic circuitry (24) for operating said at least one optical device; CHARACTERISED IN THAT the arrangement further comprises a leadframe section (20) coupled to said at least one optical device and attached to said electronic circuitry; and molded outer packaging (50) disposed so as to encapsulate both said electronic circuitry and said at least one optical device.
Claim 2
Dependent Claim
69 words
An optical communication arrangement comprising at least one semiconductor optical device (32); electronic circuitry (24) for operating said at least one optical device; CHARACTERISED IN THAT the arrangement further comprises a leadframe section (20) coupled to said at least one optical device and attached to said electronic circuitry; and molded outer packaging (50) disposed so as to encapsulate both said electronic circuitry and said at least one optical device.
Claim 3
Dependent Claim
33 words
An arrangement as defined in claim 1, further comprising receptacle means (52) for facilitating attachment of a optical fiber to said arrangement, said outer packaging being optionally molded to include the receptacle means.
Claim 4
Dependent Claim
48 words
An arrangement as defined in claim 2, further comprising a base member (46) embedded within the package and aligned with the optical device for providing coupling of an optical fiber to said optical device, said base member optionally including a lensing element (34) aligned with the optical device.
Claim 5
Dependent Claim
56 words
An arrangement as defined in claim 2, further comprising a base member (72) aligned with the optical device and formed to include the receptacle means, the outer packaging molded so as to allow the receptacle portion of the base member to remain exposed, said base member optionally including a lensing element aligned with the optical device.
Claim 6
Dependent Claim
25 words
An arrangement as defined in claim 2 or 4, wherein the optical device is supported (via means 33) and electrically coupled to the leadframe section.
Claim 7
Dependent Claim
24 words
An arrangement as defined in any one preceding claim, wherein the arrangement further comprises a metallic coating (88) disposed over the molded outer packaging.
Claim 8
Dependent Claim
46 words
An arrangement as defined in claim 1, wherein the at least one semiconductor optical device comprises an optical transmitting or receiving device; and the electronic circuitry comprises a transmitting driver circuit or an amplifier - decision circuit respectively, the arrangement forming an optical transmitter or receiver.
Claim 9
Dependent Claim
24 words
An arrangement as defined in any one preceding claim, wherein the at least one active semiconductor optical device comprises a pair of optical devices.
Claim 10
Dependent Claim
43 words
An arrangement as defined in claim 8, wherein the pair of optical devices comprises a transmitting device and a receiving device so as to form an optical transceiver arrangement, or a pair of optical transmitting devices, or a pair of optical receiving devices.
Claim 11
Dependent Claim
26 words
An arrangement as defined in claim 1, wherein the outer molded outer packaging comprises a molded plastic material, optionally being a thermoset transfer molded plastic material.
References Cited (Backward Citations)
No citation records indexed.
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