EP0506225A2
Expired / Lapsed
EP
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Integrated circuit chip package
Assignee: International Business Machines Corp
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Filing: 1992-02-11
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Granted: —
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Expires: 2012-02-11
Abstract
Abstract An integrated circuit chip package comprises a first ceramic substrate 1 having integrated circuit chips 2 thereon and a second printed circuit card substrate 7 electrically connected to the substrate 1 and having signal input/output connections 3 for the chips 2 located at edges thereof. Conductive power planes 5 are separated from the signal input/output connections 3 and removably connected to the substrate 7 by an area array power connector 4. Power is provided from a power source 21 to the power planes 5 and thence through flexible signal connectors 13 to the connections 3.
Inventors
- 👤 John Brian Gillett
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 21:02
CPC Classifications
G; G06; G06F; G06F13/00; G06F13/38; G06F13/40; G06F13/4063; G06F13/409; G06F1/00; G06F1/16; G06F1/18; H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W90/00; H10W90/401; Y; Y02; Y02D; Y02D10/00
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
69 words
An integrated circuit chip package comprising a substrate (1;7) having a plurality of integrated chips (2) on at least one major surface thereof, signal input/output connections (3) for the chips (2) located at edges of the substrates and conductive power planes (5) separated from the signal input/output connections (3) and removably connected to the substrate (1;7) along one surface of the substrate, thereby to carry power to the substrate.
Claim 2
Dependent Claim
13 words
A package according to claim 1, wherein the substrate (1) is of ceramic.
Claim 3
Dependent Claim
15 words
A package according to claim 1, wherein the substrate is a printed circuit card (7).
Claim 4
Dependent Claim
23 words
A package according to claim 1, 2 or 3, wherein the input/output connections (3) are located on three edges of the substrate (1;7).
Claim 5
Dependent Claim
24 words
A package according to claim 1, 2, 3 or 4, wherein the input/output connections (3) are located on both surfaces of the substrate (1;7).
Claim 6
Dependent Claim
24 words
A package according to any preceding claim, wherein the power planes (5) are connected to the substrate by an area array power connector (4).
Claim 7
Dependent Claim
88 words
An integrated circuit chip package comprising a first substrate (1) having a plurality of integrated chips (2) on at least one major surface thereof, a second substrate (7) electrically connected to the first substrate and having signal input/output connections (3) for the the integrated chips located at edges of the second substrate (7), conductive power planes (5) separated from the signal input/output connections (3) and removably connected to the second substrate (7) along one surface of the second substrate thereby to carry power to the first substrate (1).
Claim 8
Dependent Claim
14 words
A package according to claim 7, wherein the first substrate (1) is of ceramic.
Claim 9
Dependent Claim
18 words
A package according to claim 7 or 8, wherein the second substrate (7) is a printed circuit card.
Claim 10
Dependent Claim
24 words
A package according to claim 7, 8 or 9, wherein the input/output connections (3) are located on three edges of the second substrate (7).
Claim 11
Dependent Claim
25 words
A package according to claim 7, 8, 9 or 10, wherein the input/output connections (3) are located on both surfaces of the second substrate (7).
Claim 12
Dependent Claim
28 words
A package according to claim 7, 8, 9, 10 or 11, wherein the power planes (5) are connected to the second substrate by an area array power connector(4).
References Cited (Backward Citations)
No citation records indexed.
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