Device for actuating a magnet arrangement of a planar magnetron for a sputtering facility

Abstract

Abstract The invention relates to a process for operating a sputtering installation in which, as a result of movements of the magnet unit, the sputtering magnetic field and hence the plasma are moved in accordance with a predetermined movement characteristic (movement program) which comprises one or more defined movement directions, speeds, decelerations, accelerations and/or dwell times, so that the regions of the target surface which are normally not eroded or are eroded only slightly are eroded more severely than in the past. In addition, a device is proposed in which it is provided that two recesses, which are fitted at a distance from one another, are provided in the yoke (53) of the magnet unit, into which recesses in each case one pin or stud (38, 49) of a first and of a second crank drive engage and which set the yoke (53) in reciprocating movement within the trough space of the cathode trough (40), and that the two crank drives are connected to one another in drive terms via a toothed V-belt pulley (45) such that they rotate synchronously. <IMAGE>

Inventors

• 👤 Rudolf Dr. Latz

Bibliographic Details