Semiconductor device having heat radiating fin assembly and case for containing the same

Claim 2

A semiconductor device as set forth in claim 1, wherein said heat radiating fin assembly is comprised of a support column extending vertically from the top surface of the said package body and at least one heat radiating fin extending in the radial direction from the support column, said protective means is comprised of a plate-shaped member mounted to said heat radiating fins in a manner detachable from the same, which plate-shaped member has a contour shape larger than a contour shape of said lead array, the contour shape of the said plate-shape member being aligned with the contour shape of the said lead array when mounting the said plate-shaped member to the said heat radiating fins, said plate-shaped member is made to be supported by engagement with said container, and said orienting means is comprised of at least one orienting surface formed at a part of the said heat radiating fins and at least one first orienting surface formed at a part of said plate-shaped member, the engagement of the orienting means of the said heat radiating fins and the orienting surface of the said plate-shaped member orienting the said plate-shaped member to a predetermined direction at all times when the said plate-shaped member is mounted to the said heat radiating fins, said orienting means being further comprised of at least one second orienting surface formed at a part of said plate-shaped member and an orienting surface formed at a part of said container, the second orienting surface of said plate-shaped member and the orienting means of the said container orienting the said plate-shaped member to a predetermined direction at all times when said plate-shaped member is engaged with said container.

Claim 3

A semiconductor device as set forth in claim 1, wherein said heat radiating fin assembly is comprised of a support column extending vertically from the top surface of the said package body and at least one heat radiating fin extending in the radial direction from the support column, said protective means is comprised of a plate-shaped member mounted to said support column in a manner detachable from the same, which plate-shaped member has a contour shape larger than a contour shape of said lead array, the contour shape of the said plate-shape member being aligned with the contour shape of the said lead array when mounting the said plate-shaped member to the said support column, said plate-shaped member is made to be supported by engagement with said container, and said orienting means is comprised of at least one orienting surface formed at a part of the said support column and at least one first orienting surface formed at a part of said plate-shaped member, the engagement of the orienting means of the said support column and the orienting surface of the said plate-shaped member orienting the said plate-shaped member to a predetermined direction at all times when the said plate-shaped member is mounted to the said support column, said orienting means being further comprised of at least one second orienting surface formed at a part of said plate-shaped member and an orienting surface formed at a part of said container, the second orienting surface of said plate-shaped member and the orienting means of the said container orienting the said plate-shaped member to a predetermined direction at all times when said plate-shaped member is engaged with said container.

Claim 4

A semiconductor device as set forth in claim 1, wherein said protective means is comprised of a plate-shaped member constituted as a heat radiating fin of said heat radiating fin assembly, the plate-shaped member extending in a radial direction from a support column constituting a part of said heat radiating fin assembly, which support column extends vertically from the top surface of said package body, and having a contour shape larger than a contour shape of said lead array, said plate-shaped member is made to be supported by engagement with said container, and said orienting means is comprised of at least one second orienting surface formed at a part of the said plate-shaped member and at least one orienting surface formed at a part of said container, the second orienting means of the said plate-shaped member and the orienting surface of the said container orienting the said plate-shaped member to a predetermined direction at all times when the said plate-shaped member is engaged with the said container.

Claim 5

A semiconductor device as set forth in claim 4, said semiconductor device characterized in that a long cutaway portion is formed at the side of the said plate-shaped member along the intermediate region of the same and in that a contour line at the inside of the cutaway portion is located at an inward region of the contour shape of the said lead array.

Claim 6

A container for accommodating the semiconductor device as set forth in claim 2, said container semiconductor device characterized in that it is comprised of a long box-shaped container, one of the ends of the box-shaped container is open, guide elements are provided at the inside surfaces of the two side walls of the said box-shaped container along the longitudinal axial direction, and the said package body is supported by engagement of the two opposing edges of the said plate-shaped member with the said guide elements when the said package body is accommodated inside the box-shaped container from the open end.

Claim 7

A container for accommodating the semiconductor device as set forth in claim 2, said container semiconductor device characterized in that it is comprised of a tray provided with a plurality of depressions, shoulders are formed at the edges surrounding the depressions, and the said package body is supported by engagement of the surrounding edges of the said plate-shaped member with the said shoulders when the said package body is accommodated inside the depressions.

Claim 8

A container for accommodating the semiconductor device as set forth in claim 3, said container semiconductor device characterized in that it is comprised of a long box-shaped container, one of the ends of the box-shaped container is open, guide elements are provided at the inside surfaces of the two side walls of the said box-shaped container along the longitudinal axial direction, and the said package body is supported by engagement of the two opposing edges of the said plate-shaped member with the said guide elements when the said package body is accommodated inside the box-shaped container from the open end.

Claim 9

A container for accommodating the semiconductor device as set forth in claim 3, said container semiconductor device characterized in that it is comprised of a tray provided with a plurality of depressions, shoulders are formed at the edges surrounding the depressions, and the said package body is supported by engagement of the surrounding edges of the said plate-shaped member with the said shoulders when the said package body is accommodated inside the depressions.

Claim 10

A container for accommodating the semiconductor device as set forth in claim 4, said container semiconductor device characterized in that it is comprised of a long box-shaped container, one of the ends of the box-shaped container is open, guide elements are provided at the inside surfaces of the two side walls of the said box-shaped container along the longitudinal axial direction, and the said package body is supported by engagement of the two opposing edges of the said plate-shaped member with the said guide elements when the said package body is accommodated inside the box-shaped container from the open end.

Claim 11

A container for accommodating the semiconductor device as set forth in claim 3, said container semiconductor device characterized in that it is comprised of a tray provided with a plurality of depressions, shoulders are formed at the edges surrounding the depressions, and the said package body is supported by engagement of the surrounding edges of the said plate-shaped member with the said shoulders when the said package body is accommodated inside the depressions.

Claim 12

A semiconductor device provided with a rectangular package body, a large number of leads projecting outward from two opposing sides of the package body, and a heat radiating fin assembly provided at the top surface of the said package body, in which semiconductor device a container for accommodating said package body being comprised of a long box-shaped container, one end of the box-shaped container is open, guide elements and projecting elements are provided at the inside surfaces of two walls of the said box-shaped container along the longitudinal axial direction of the same, and use is made of the said heat radiating fin assembly for accommodating and holding the package body in said box-shaped container, said semiconductor device characterized in that said heat radiating fin assembly is comprised of a support column which extends vertically from the top surface of the said package body and at least one heat radiating fin extending from the support column in the radial direction and when said package body is accommodated in the said box-shaped container from its open end, the said heat radiating fins are supported by engagement with said guide elements and two of the opposing sides of the said package body, that is, the opposing sides where the said leads project from, are engaged with the said projecting elements, whereby said package body is accommodated and held in the said box-shaped container at a predetermined orientation.

Claim 13

A semiconductor device provided with a rectangular package body, a large number of leads projecting outward from two opposing sides of the package body, and a heat radiating fin assembly provided at the top surface of the said package body, in which semiconductor device a container for accommodating said package body is comprised of a tray provided with a plurality of depressions, shoulders are formed at the surrounding edges of the depressions, and use is made of the said heat radiating fin assembly for accommodating and holding the package body in the depressions of the tray, said semiconductor device characterized in that said heat radiating fin assembly is comprised of a support column which extends vertically from the top surface of the said package body and at least one heat radiating fin extending from the support column in the radial direction, said heat radiating fins projecting out further than the said leads at the two opposing sides of the package body, that is, the opposing sides where the leads project from, and when said package body is accommodated in the depressions of said tray, the said heat radiating fins are supported by engagement with said shoulders, whereby said package body is accommodated and held in the said depressions of the said tray at a predetermined orientation.

Claim 14

A semiconductor device provided with a rectangular package body, a large number of leads projecting outward from two opposing sides of the package body, and a heat radiating fin assembly provided at the top surface of the said package body, in which semiconductor device a container for accommodating said package body is comprised of a long box-shaped container, one end of the box-shaped container is open, guide elements and projecting elements are provided at the inside surfaces of two walls of the said box-shaped container along the longitudinal axial direction of the same, and use is made of the said heat radiating fin assembly for accommodating and holding the package body in said box-shaped container, said semiconductor device characterized in that said heat radiating fin assembly is comprised of a support column which extends vertically from the top surface of the said package body and at least one heat radiating fin extending from the support column in the radial direction and when said package body is accommodated in the said box-shaped container from its open end, the said heat radiating fins are supported by engagement with said guide elements and two of the opposing sides of the said package body are engaged with the said projecting elements, whereby said package body is accommodated and held in the said box-shaped container at a predetermined orientation.

Claim 15

A semiconductor device provided with a rectangular package body, a large number of leads projecting outward from two opposing sides of the package body, and a heat radiating fin assembly provided at the top surface of the said package body, in which semiconductor device a container for accommodating said package body is comprised of a tray provided with a plurality of depressions, shoulders are formed at the surrounding edges of the depressions, and use is made of the said heat radiating fin assembly for accommodating and holding the package body in the depressions of the tray, said semiconductor device characterized in that said heat radiating fin assembly is comprised of a support column which extends vertically from the top surface of the said package body and at least one heat radiating fin extending from the support column in the radial direction, said heat radiating fins projecting out further than the distance between at least two opposing sides of the said package body, and when said package body is accommodated in the depressions of said tray, the said heat radiating fins are supported by engagement with said shoulders, whereby said package body is accommodated and held in the said depressions of the said tray at a predetermined orientation.