EP0494684A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Ic card and a method for manufacturing the same

Assignee: NEC Corp

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Filing: 1992-01-10

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Granted: —

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Expires: 2012-01-10

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Abstract

Abstract There is disclosed an IC card which includes a module (21) constructed by mounting a plurality of IC (11) devices on a printed circuit board with locations and dimensions conforming to standard specifications, a frame member (22b) which reinforces the mechanical strength of the module, a spacer member (22a) including spacer pieces to be arranged at the vacant locations of the IC devices of the module, and a flat housing member (26a,26b) which accommodates the module, the frame member, and the spacer member in the state of their mutual stacking. In order to achieve easy formation of the spacer member at the vacant locations, the spacer member of the IC card according to the invention has slits (25) with bridging parts (23) which define the openings with locations and the dimensions that conform with the standard specifications. When there is no vacant location, the openings are formed by cutting the bridging parts, whereas when there are vacant locations, the spacer pieces are formed by maintaining the bridging parts as they are. When the frame member has flat portions, the presence and absence of the vacant locations is also handled by forming similar slits.

Inventors

👤 Atsuhiko c/o NEC Corporation Izumi
👤 Teruo c/o NEC Engineering Ltd Suzuki

Bibliographic Details

Application Number —

Jurisdiction EP

Data Source google_patents

Last Synchronized 2026-11-05 19:17

CPC Classifications

G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07728

Claims Analysis

Total Claims: 4

Claim 1

Independent Claim 93 words

In an IC card comprising: a module which includes a printed circuit substrate and a plurality of IC devices connected electrically to said printed circuit substrate; a frame member which is arranged surrounding the circumference of said module; spacer member which is a plate having holes and spacer regions surrounded by slits and bridging parts, any one of said holes and spacer regions being formed at every positions corresponding to said IC devices; and a housing member for covering from outside the stack of said module, said frame member, and said spacer member.

Claim 2

Dependent Claim 245 words

An IC card comprising: a module which includes a printed circuit substrate with printed circuits formed thereon and a plurality of platelike IC devices with respectively predetermined dimensions connected electrically to the respective ones of said printed circuits and are mounted at respectively predetermined locations; a frame member which is arranged surrounding the circumference of the module for reinforcing the mechanical strength of the module against the external forces that act in the directions perpendicular and parallel to the surface of the module; a spacer member including spacer pieces that are arranged in place of the IC devices at vacant locations that are created by omitting said IC devices to be mounted out of said predetermined locations of the surface on the side of said module where said plurality of IC devices are to be mounted; and a housing member for covering from outside the stack of said module, said frame member, and said spacer member, wherein said spacer member includes slits with bridging parts that define openings corresponding to the dimensions of said IC devices at said vacant locations so as to enable said spacer member to form said spacer pieces when there exist said vacant locations in the surface of said module such that when there do not exist said vacant locations, openings defined by said slits are formed by cutting said bridging parts, whereas when there exist vacant locations, said spacer pieces are formed by maintaining said bridging parts as they are.

Claim 3

Dependent Claim 128 words

An IC card as claimed in claim 1, wherein said frame member has plane portions which extend substantially parallel to said module, said plane portions of said frame member have said slits with said bridging parts such that when there exists no said vacant locations on the surface of said module, said plane portions have openings at locations corresponding to said IC devices and when there exist vacant locations, enables said plane portions to form supporting parts at directly below the surface of said module at these vacant locations, and said plane portions form openings defined by said slits by cutting said bridging parts when there exists no vacant locations and forms said supporting parts by maintaining said bridging parts as they are when there exist vacant location.

Claim 4

Independent Claim 62 words

A method for manufacturing an IC card which comprises steps of: Cutting off predetermined bridge parts in a spacer member; Stacking said spacer member on a module having printed circuit substrate and a plurality of IC devices mounted thereon with electrical connection to said printed circuit; and covering said module, and said space member with housing members from above and from below.

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