EP0488783A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Lead frame for semiconductor device comprising a heat sink
Assignee: Shinko Electric Industries Co Ltd
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Filing: 1991-11-29
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Granted: —
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Expires: 2011-11-29
Abstract
Abstract A lead frame (20) to be used for a semiconductor device (31), comprises: a heat sink (25) having a peripheral area and a central projected land (27) on which a semiconductor chip (31) is to be mounted. The heat sink (25) has a relatively good heat radiating characteristic. A plurality of inner leads (22) are provided, each having an inner end overlapping the peripheral area of the heat sink (25) and connected to it by an insulating material (26). A semiconductor chip (31) has a chip surface on which a junction pattern is arranged, and is preferably mounted on the projected land (27) of the heat sink (25) by an insulating adhesive (32) so that the chip surface faces the projected land (27). TAB leads (33) are provided for electrically connecting the semiconductor chip (31) to the inner leads (22), and a sealing resin (34) hermetically seals at least the semiconductor chip (31). <IMAGE>
Inventors
- 👤 Masato Tanaka
- 👤 Katsuya Fukase
- 👤 Mitsuharu Shimizu
- 👤 Toshiyuki Murakami
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 21:37
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/435; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/701; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
74 words
A lead frame (20) for a semiconductor device comprising: a heat sink (25) having a peripheral area and a central projected land (27), on which a semiconductor chip is to be mounted, said heat sink (25) having a relatively good heat radiating characteristic; and, a plurality of inner leads (22) each having an inner end which overlaps and is attached to said peripheral area of the heat sink by an electrically insulating material (26).
Claim 2
Dependent Claim
74 words
A lead frame (20) for a semiconductor device comprising: a heat sink (25) having a peripheral area and a central projected land (27), on which a semiconductor chip is to be mounted, said heat sink (25) having a relatively good heat radiating characteristic; and, a plurality of inner leads (22) each having an inner end which overlaps and is attached to said peripheral area of the heat sink by an electrically insulating material (26).
Claim 3
Dependent Claim
88 words
A semiconductor device comprising: a lead frame in accordance with claim 1; a semiconductor chip (31) having a chip surface on which a junction pattern is arranged, said semiconductor chip (31) being mounted on said central projected land (27) of the heat sink (25) by an electrically insulating adhesive (32) so that said chip surface faces said projected land (27); TAB leads (33) for electrically connecting said semiconductor chip (31) to said inner leads (21); and, a sealing resin (34) hermetically sealing at least said semiconductor chip (31).
Claim 4
Dependent Claim
64 words
A semiconductor device according to claim 2, wherein said semiconductor chip (31) has a second surface opposite to said chip surface, and said semiconductor device further comprises: a second heat sink (35) having a relatively good heat radiating characteristic, said second heat sink (35) being attached to said second surface of the semiconductor chip (31) by an electrically insulating or electrically conductive adhesive (36).
Claim 5
Dependent Claim
45 words
A semiconductor device according to claim 1, wherein the or each heat sink (25,35) is made of any suitable metal or ceramic, for example, Mo, AIN, SiC, Cu-W or the like, having a coefficient of thermal expansion similar to that of said semiconductor chip (31).
Claim 6
Dependent Claim
80 words
A semiconductor device comprising: a semiconductor chip (31,124) having a chip surface on which a junction pattern is arranged; a heat sink (25,35,123,126) made of any suitable material having a coefficient of thermal expansion similar to that of said semiconductor chip (31,124), said heat sink (25,35,123,126) being attached to said chip surface of the semiconductor chip (31,124) by a chip coated layer; and, a sealing resin (34,128) hermetically sealing at least said semiconductor chip to thereby form a hermetic package.
Claim 7
Dependent Claim
80 words
A semiconductor device comprising: a semiconductor chip (31,124) having a chip surface on which a junction pattern is arranged; a heat sink (25,35,123,126) made of any suitable material having a coefficient of thermal expansion similar to that of said semiconductor chip (31,124), said heat sink (25,35,123,126) being attached to said chip surface of the semiconductor chip (31,124) by a chip coated layer; and, a sealing resin (34,128) hermetically sealing at least said semiconductor chip to thereby form a hermetic package.
Claim 8
Dependent Claim
30 words
A semiconductor device according to claim 5, wherein said hermetic package has a cover (35,125) and at least a part of said cover is constituted by said heat sink (25,35,123,126).
Claim 9
Dependent Claim
123 words
A structure for mounting a semiconductor device comprising: a ceramic board (136,221) made of a material having a coefficient of thermal expansion; said ceramic board (136,221) being provided integrally with a projected land portion (137,225) on which a semiconductor chip (124,229) is to be mounted; a semiconductor chip (124,229) having a chip surface on which a junction pattern is arranged, said semiconductor chip (124,229) being mounted on said projected land (137,225) portion by an electrically insulating adhesive (127,235) so that said chip surface faces said projected land (137,225); means (125,142,222,233,240) for electrically connecting said semiconductor chip (124,229); and, a cap means (140,228) rigidly secured to said ceramic board (136,221) for enclosing said semiconductor chip (124,229) to thereby hermetically seal said semiconductor chip (124,229).
Claim 10
Dependent Claim
123 words
A structure for mounting a semiconductor device comprising: a ceramic board (136,221) made of a material having a coefficient of thermal expansion; said ceramic board (136,221) being provided integrally with a projected land portion (137,225) on which a semiconductor chip (124,229) is to be mounted; a semiconductor chip (124,229) having a chip surface on which a junction pattern is arranged, said semiconductor chip (124,229) being mounted on said projected land (137,225) portion by an electrically insulating adhesive (127,235) so that said chip surface faces said projected land (137,225); means (125,142,222,233,240) for electrically connecting said semiconductor chip (124,229); and, a cap means (140,228) rigidly secured to said ceramic board (136,221) for enclosing said semiconductor chip (124,229) to thereby hermetically seal said semiconductor chip (124,229).
Claim 11
Dependent Claim
63 words
A structure, according to claim 7, in which the means for electrically correcting include a circuit pattern having terminals (142) formed on said ceramic board (136); and/or holes (237) passing through the circuit board (225) and wires (233) or other conductors extending from said semiconductor chip (229) through said holes (237) to be introduced to the other side of the ceramic board (225).
Claim 12
Dependent Claim
42 words
A structure according to claim 7 or 8, wherein said semiconductor chip (124,229) has a second surface opposite to said chip surface, and said cap means (140,228) is attached to said second surface of the semiconductor chip by an insulating adhesive (127,230).
Claim 13
Dependent Claim
29 words
A semiconductor device according to any one of claims 2 to 9, further comprising a heat radiating fin (129,231) attached to a heat sink (126) or a cap (140,228).
References Cited (Backward Citations)
No citation records indexed.
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