EP0488554A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Tab tape, tab tape package and method of bonding same
Assignee: International Business Machines Corp
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Filing: 1991-11-14
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Granted: —
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Expires: 2011-11-14
Abstract
Abstract A TAB tape 10 comprises an insulating tape having a multiplicity of openings 12 (Figure 2), each surrounded by metallic leads 14 having inner lead portions 18 projecting into the opening 12. In the corners of the opening 12 on the tape are formed metallic chip pressure members 30 having tips 32 projecting into the opening 12 between groups of inner lead portions 18. A chip 24 is positioned in each opening 12 in turn with chip pads 26 aligned with the inner lead portions 18. A bonding tool 34 is moved downwardly into engagement with the inner lead portions 18 to force them into contact with the chip pads 26 and to thermocompressively attach them thereto. The corners of the tool 34 engage and bend the tips 32 into engagement with the surface of the chip 24, so that when the tool is lifted tie chip is prevented from following due to adhesion of the tool and leads. <IMAGE>
Inventors
- 👤 Katsuyuki Lions-Mansion 105 134-1 Yonehara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 11:01
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W72/00; H10W72/071; H10W72/077; H10W72/701; H10W72/0711; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
72 words
A TAB tape which includes insulating tape (11) having openings (12) at respective chip attaching positions, and leads (14) formed on the insulating tape (11) and extending (18) into respective openings (12) to be connected to pads (26) of the respective chips (24) when the chips are attached, characterised by chip pressure means (30) on the insulating tape (11) extending (32) into each opening (12) to prevent passage of a chip therethrough.
Claim 2
Dependent Claim
66 words
A TAB tape according to claim 1, in which the attachment of the chips is by a bonding tool (28) pressing the lead extensions (18) against the chip pads (26), and the chip pressure means (30) extends (32) into each opening (12) to prevent a chip (24) from being lifted up by adhesion between the bonding tool (28) and the leads when the chip is attached.
Claim 3
Dependent Claim
25 words
A TAB tape according to claim 1 or claim 2 wherein the chip pressure means (30) comprises metallic members formed on the insulating tape (11).
Claim 4
Dependent Claim
27 words
A TAB tape according to claim 3, wherein the metallic members (30) are formed on the insulating tape (11) on the same side as the leads (14).
Claim 5
Dependent Claim
24 words
A TAB tape according to claims 3 or 4, wherein the metallic members (30) are formed of the same material as the leads (14).
Claim 6
Dependent Claim
24 words
A TAB tape according to any preceding claim, wherein the chip pressure means (30) extend into each opening (12) at the four corners thereof.
Claim 7
Dependent Claim
42 words
A TAB tape according to any preceding claim, wherein the chip presure means (30) and the bonding tool (28) interengage during chip attachment so that the chip pressure means engages the surface of the chip to be attached away from the pads.
Claim 8
Dependent Claim
97 words
A TAB tape package comprising a TAB tape according to any preceding claim, in which the leads (14) have inner lead portions (18) extending into the opening (12) and outer lead portions (20) extending from the insulating tape (11), a chip (24) is disposed in the opening and has pads (26) connected to the inner lead portions (18), and the chip pressure means (30) extends into the opening to prevent contact between the inner lead portion (18) and the chip (24) by engagement with the surface of the chip at the side of the pads (Figure 5).
Claim 9
Dependent Claim
27 words
A TAB tape package according to claim 8, wherein the chip pressure means (30) has a projecting portion (32;38) bent towards the surface of the chip (24).
Claim 10
Independent Claim
147 words
A method of bonding a TAB tape, comprising preparing a TAB Tape according to any of claims 1 to 7, aligning the TAB tape with respect to a chip (24) so that the lead portions in a selected opening (12) are positioned on the pads (26) of the chip (24) to be attached and projecting portions (32) of the chip pressure means in the opening are positioned on the surface at the side of the pads, moving a bonding tool downwardly (28) to the selected opening, the bonding tool (28) having a bottom surface for thermocompressively bonding the lead portions (18) to the pads (26) and inclined surfaces (36) for engaging the projecting portions (32) and bending the projecting portions towards the surface at the side of the pads by engagement of the inclined surfaces with the projecting portions during the downward movement of said bonding tool.
References Cited (Backward Citations)
No citation records indexed.
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