Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
119 words
A resin sealed semiconductor device comprising: a semiconductor chip (1) having an electric circuit therein and an elongated main connection line (20) respectively formed thereon; a plurality of leads (9) disposed near said chip (1); electrical connecting means for electrically connecting together said chip (1) and said leads (9); at least one by-pass connection line(100) formed in correspondence with said main connection line (20); and by-pass connecting means (11) for electrically connecting said main connection line (20) near at one end thereof to said by-pass connection line (100) near at one end thereof, and electrically connecting said main connection line (20) near at the other end thereof to said by-pass connection line (100) near at the other end thereof.
Claim 2
Dependent Claim
29 words
A device according to claim 1, wherein at least one of said leads (9) is electrically connected to said main connection line (20) by said electrical connecting means (11).
Claim 3
Dependent Claim
44 words
A device according to claim 2, wherein pads (2, 3, 4) connected to said electric circuit are formed on the surface of said chip (1), and each of said pads (2, 3, 4) is connected to one end of said electrical connecting means (11).
Claim 4
Dependent Claim
27 words
A device according to claim 2, wherein said lead (10) electrically connected to said main connection line (20) is connected to a power source (V SS ).
Claim 5
Dependent Claim
25 words
A device according to claim 2 or 4, wherein said by-pass connection line (100) is formed substantially in parallel with said main connection line (20).
Claim 6
Dependent Claim
19 words
A device according to claim 5, wherein said main connection line (20) is formed of a closed loop shape.
Claim 7
Dependent Claim
18 words
A device according to claim 5, wherein there is provided one line of said by-pass connection line (100).
Claim 8
Dependent Claim
18 words
A device according to claim 5, wherein there are provided two lines of said by-pass connection line (100).
Claim 9
Dependent Claim
91 words
A device according to claim 7 or 8, wherein said by-pass connection line (100) has wider areas (100B a , 100B b ) near at opposite ends thereof, one of said wider areas (100B a , 100B b ) being connected to said main connection line (20) at one end portion thereof by said by-pass connecting means (11) and the other of said wider areas (100B a , 100B b ) being connected to said main connection line (20) at the other end portion thereof by said by-bass connecting means (11).
Claim 10
Dependent Claim
16 words
A device according to claim 9, wherein said chip (1) is mounted on a bed (5).