Housing structure for accomodating electronic apparatus
Abstract
Abstract A box-like housing for an electronics apparatus is provided having superior effects for preventing problems caused by ESD. The wall of the housing is formed by a sandwiched plate consisting of the innermost layer (1) of high electro-conductive material such as a steel plate, the middle layer (2) of electro-insulating material such as plastic, and the outermost layer (3) of low electro-conductive material having much higher resistance compared with the innermost layer (1) such as a carbon-containing paint coating. The innermost layer (1) and the outermost layer (3) are frame-grounded through a common earth line.
Inventors
- 👤 Toshiaki C/O Fujitsu Limited Suzuki
- 👤 Eiji C/O Fujitsu Limited Suzuki
Bibliographic Details
Claims Analysis
Total Claims: 7References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.