Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
55 words
An organic resin multi-layer wiring substrate comprising: a plurality of lamination blocks (1, 2), each made by alternately laminating a plurality of electrically conductive wiring layers (13a, 13b, 23a, 23b) and a plurality of insulation layers (15, 26) of organic resin; and a plurality of holes (3) for electrically interconnecting said plurality of lamination blocks.
Claim 2
Dependent Claim
32 words
An organic resin multi-layer wiring substrate as set forth in claim 1, wherein at least one lamination block of said plurality of lamination blocks is formed on a hard plate (10, 20).
Claim 3
Dependent Claim
21 words
An organic resin multi-layer wiring substrate as set forth in claim 2, wherein said hard plate is a ceramic plate (20).
Claim 4
Dependent Claim
23 words
An organic resin multi-layer wiring substrate as set forth in claim 1, wherein said insulation layer (15; 26) is a polyimide insulation layer.
Claim 5
Dependent Claim
24 words
An organic resin multi-layer wiring substrate as set forth in claim 1, wherein said insulation layer includes an adhesive polyimide insulation layer (14; 25).
Claim 6
Independent Claim
97 words
A method of making an organic resin multi-layer wiring substrate comprising the steps of: a first step of forming lamination blocks by alternately laminating a plurality of electrically conductive wiring layers and organic resin insulation layers on hard plates; a second step of adhering the two lamination blocks made by the above step with the laminated sides abutting against each other; a third step of removing the hard plate of one of the lamination blocks using appropriate solvent; and a fourth step of forming holes through the one lamination block and extending into the other lamination block.
Claim 7
Dependent Claim
64 words
A method of making an organic resin multi-layer wiring substrate as set forth in claim 6, wherein said first step includes, forming the ground and connection layers on a flat aluminum plate by photo lithography technique, coating the photosensitive polyimide varnish layer, forming the holes by exposing to light and developing said photosensitive polyimide varnish layer, and curing to form a polyimide insulation layer.
Claim 8
Dependent Claim
38 words
A method of making an organic resin multi-layer wiring substrate as set forth in claim 6, wherein at least one of said organic resin insulation layers includes a portion to be adhered which is of adhesive polyimide varnish.
Claim 9
Dependent Claim
36 words
A method of making an organic resin multi-layer wiring substrate as set forth in claim 6, wherein at least one hard plate is made of aluminum and is removed by the solvent in said third step.
Claim 10
Dependent Claim
25 words
A method of making an organic resin multi-layer wiring substrate as set forth in claim 6, wherein said holes are formed using KrF excimer laser.